Chip Beads (2506033007Y3)
Part Number: 2506033007Y3
MULTI- LAYER CHIP BEAD
Fair- Rite offers a broad selection of cost effective multi- layer chip beads to suppress conducted EMI signals. Chip beads can be
used in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate
automated placements and allow for a dense packaging of circuit boards.
Chip Beads are available in standard, high and GHz signal speeds.
Recommended Soldering Profile
Packaging Options:
- All multi- layer chip beads are supplied taped and reeled, if required bulk packed chip beads can be provided.
The suggested land patterns are in accordance to the latest revision of IPC-7351.
Weight: 0.006 (g)
Package Size: 0603 (1608)
Dim mm mm tol
nominal inch
A
0.8 ±0.15
0.031
B
0.8 ±0.15
0.031
C
1.6 ±0.15
0.063
D
0.4 ±0.20
0.016
Land Patterns
V
W
0.60
1.70
(0.024”)
(0.067”)
X
1.00
(0.039”)
inch misc.
_
_
_
_
Y
1.10
(0.043”)
Z
_
Reel Information
Tape Width Pitch
mm
mm
8
4
Parts 7"
Reel
4000
Parts 13"
Reel
10000
Parts 14"
Reel
_
Chart Legend
+ Test frequency
Typical Impedance (Ω)
50 MHz
23
+
100 MHz
30 ±25%
500 MHz
40
+
1000 MHz -
Electrical Properties
Max DCR
0.04
(Ω)
Max Current
3000
(mA)
The impedance values listed are typical values. The nominal impedance with a +/- 25% tolerance is specified for the + marked
100 MHz. Chip beads are measured for impedance on the HP 4291A and fixture HP 16192A.
Chip beads are 100% tested for impedance and dc resistance.
Fair- Rite Products Corp.
•
One Commercial Row, Wallkill, New York 12589-0288
888-324-7748 • 845-895-2055 • Fax: 845-895-2629 • ferrites@fair- rite.com • www.fair- rite.com
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