microtech GmbH electronic Teltow
Chip resistors - Made in Germany
High power series
Type: CLF
Sizes: 1210, 1218, 2010, 2512
Characteristics:
•
•
•
•
•
•
•
•
Chip resistors in thick film technology
Special layout for high electrical load
Resistance area coated with glass and varnish passivation
High stability and reliability
Tight tolerances (≥0,5%) – low temperature coefficient (≥50ppm/K)
RoHS-conform and Halogen-free according to IEC 61249-2-21 / IPC 4101B
Customer specific barcodes available - also in 2D
All sizes can be manufactured with the following contact variants
⇒
Electroplated pure tin
⇒
Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after date code)
⇒
Epoxy bondable contact -K
⇒
Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
ISO 9001:2015
ISO 14001:2015
Dimensions (in mm):
Size
L
Length
Min
Max
W
Width
Min
Max
H
Depth
Min
Max
t
Contact
back
Min
Max
T
Contact
front
Min
Max
1210
1218
2010
2512
3,00
3,00
4,80
6,10
3,30
3,30
5,20
6,50
2,35
4,50
2,30
3,00
2,65
4,80
2,70
3,30
0,50
0,50
0,50
0,50
0,75
0,75
0,75
0,75
0,35
0,35
0,35
0,35
0,85
0,85
0,85
0,85
0,25
0,25
0,25
0,25
0,85
0,85
0,85
0,85
Packaging units:
Reel
Ø
180 mm
330 mm
Samples on request
Card tape
acc. EN 60286-3
5 T pcs.
10 T pcs.
20 T pcs.
4 T pcs.
8 T pcs.
16 T pcs.
Blister tape
Ordering information:
CLF
Type
CLF
-N
Contact
Standard (without
add.)
-N (non magnetic)
-K (epoxy bondable)
-S (corrosive gas
resistant)
1210
Size
1210
.
100k
1%
100ppm/K
±
TCR
50
100
K
Marking
K- only with
P
Packaging
P- Card tape
B- Blister
tape
S- Bulk
5
(optional)
R-
±
Tolerance
Value
1R
.
pcs. / Reel
(T pcs.)
Depends on
size and
packaging
unit
to
.
to
.
0,5
1
5
2512
10M
Page 26
Revision: 25-Nov-19
Catalog microtech GmbH electronic
microtech GmbH electronic Teltow
ISO 9001:2015
ISO 14001:2015
Chip resistors - Made in Germany
High power series
Type: CLF
Sizes: 1210, 1218, 2010, 2512
Technical data – depending on size:
Size
Nominal voltage
U
max
(V)
Load
P
70
(W)
0,50
1,00
0,50
1,00
R-Range
R-Tolerance
(± %)
0,5 / 1 / 5
0,5 / 1 / 5
0,5 / 1 / 5
0,5 / 1 / 5
TCR
(± ppm/K)
P
1210
1218
2010
2512
200
200
300
500
1R - 10M
1R - 10M
1R - 10M
1R - 10M
50 / 100
50 / 100
50 / 100
50 / 100
x
x
x
x
Packaging
B
S
x
x
x
x
Technical data - general:
Technical data
Operating temperature range
Climatic category acc. EN 60068
Solderability acc. EN 60068-2-58
Soldering heat resistance acc. EN 60068-2-58
Long time stability
Storage 155°C / 1000h
Endurance P
70
/ 70°C / 1000h
Damp heat, steady state (56d / 40°C / 93%)
±( 1,0% + 0,05R )
±( 0,5% + 0,05R )
±( 1,0% + 0,05R )
-55°C … +155°C
55 / 155 / 56
245°C 3s
±( 0,5% + 0,05R ) at 260°C 10s
Data, unless specified, acc. EN 140401-802.
Catalog microtech GmbH electronic
Revision: 25-Nov-19
Page 27
NXP MCU
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