Operating Temperature Range ......................... -40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range ............................ -65°C to +150°C
Soldering Temperature (reflow) .......................................+260°C
Lead Temperature (soldering, 10s) ................................. +300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ......+162°C/W
Junction-to-Case Thermal Resistance (θ
JC
) .............+20°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V
IN
= 24V, V
GND
= 0V, C
IN
= C
VCC
= 1µF, V
EN/UVLO
= 1.5V, LX = MODE =
RESET
= unconnected; T
A
= T
J
= -40°C to +125°C, unless
otherwise noted. Typical values are at T
A
= +25°C. All voltages are referenced to GND, unless otherwise noted.) (Note 2)
PARAMETER
INPUT SUPPLY (VIN)
Input Voltage Range
Input Shutdown Current
Input Supply Current
ENABLE/UVLO (EN/UVLO)
V
ENR
EN/UVLO Threshold
EN/UVLO Input Leakage Current
LDO (V
CC
)
V
CC
Output Voltage Range
V
CC
Current Limit
V
CC
Dropout
V
CC
UVLO
V
CC
I
VCC-MAX
V
CC-DO
V
CC-UVR
V
CC-UVF
6V < V
IN
< 42V, 0mA < I
VCC
< 10mA
V
CC
= 4.3V, V
IN
= 12V
V
IN
= 4.5V, I
VCC
= 5mA
V
CC
rising
V
CC
falling
4.05
3.7
4.75
13
5
30
0.15
4.18
3.8
5.25
50
0.3
4.3
3.95
V
mA
V
V
V
ENF
V
EN-TRUESD
I
EN/UVLO
V
EN/UVLO
rising
V
EN/UVLO
falling
V
EN/UVLO
falling, true shutdown
V
EN/UVLO
= 42V, T
A
= +25°C
-100
1.19
1.06
1.215
1.09
0.75
+100
nA
1.24
1.15
V
V
IN
I
IN-SH
I
Q-PFM
I
Q-PWM
V
EN/UVLO
= 0V, shutdown mode
MODE = unconnected,
FB/V
OUT
= 1.03 x FB/V
OUT-REG
Normal switching mode, V
IN
= 24V
4.5
2.2
95
2.5
42
4
160
4
V
µA
µA
mA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
www.maximintegrated.com
Maxim Integrated
│
2
MAX15462
42V, 300mA, Ultra-Small, High-Efficiency,
Synchronous Step-Down DC-DC Converters
Electrical Characteristics (continued)
(V
IN
= 24V, V
GND
= 0V, C
IN
= C
VCC
= 1µF, V
EN/UVLO
= 1.5V, LX = MODE =
RESET
= unconnected; T
A
= T
J
= -40°C to +125°C, unless
otherwise noted. Typical values are at T
A
= +25°C. All voltages are referenced to GND, unless otherwise noted.) (Note 2)
PARAMETER
POWER MOSFETs
High-Side pMOS On-Resistance
Low-Side nMOS On-Resistance
LX Leakage Current
SOFT-START (SS)
Soft-Start Time
FEEDBACK (FB)
FB Regulation Voltage
FB Leakage Current
OUTPUT VOLTAGE (V
OUT
)
MODE = GND, MAX15462A
V
OUT
Regulation Voltage
V
OUT-REG
MODE = unconnected, MAX15462A
MODE = GND, MAX15462B
MODE = unconnected, MAX15462B
CURRENT LIMIT
Peak Current-Limit Threshold
Runaway Current-Limit Threshold
Negative Current-Limit
Threshold
PFM Current Level
TIMING
Switching Frequency
Events to Hiccup After Crossing
Runaway Current Limit
FB/V
OUT
Undervoltage Trip Level
to Cause Hiccup
Hiccup Timeout
Minimum On-Time
Maximum Duty Cycle
t
ON-MIN
D
MAX
FB/V
OUT
= 0.98 x FB/V
OUT-REG
89
62.5
f
SW
465
500
1
64.5
131
90
91.5
130
94
66.5
535
kHz
Cycles
%
ms
ns
%
I
PEAK-LIMIT
I
RUNAWAY-
LIMIT
SYMBOL
CONDITIONS
T
A
= +25°C
T
A
= T
J
= +125°C
T
A
= +25°C
T
A
= T
J
= +125°C
MIN
TYP
1.35
0.45
MAX
1.75
2.7
0.55
0.9
UNITS
R
DS-ONH
R
DS-ONL
I
LX-LKG
I
LX
= 0.3A
(sourcing)
I
LX
= 0.3A
(sinking)
Ω
Ω
µA
V
EN/UVLO
= 0V, V
IN
= 42V, T
A
= +25°C,
V
LX
= (V
GND
+ 1V) to (V
IN
- 1V)
-1
+1
t
SS
MODE = GND, MAX15462C
MODE = unconnected, MAX15462C
MAX15462C
3.8
0.887
0.887
-100
3.25
3.25
4.93
4.93
4.1
0.9
0.915
-25
3.3
3.35
5
5.08
4.4
0.913
0.936
ms
V
FB-REG
I
FB
V
nA
3.35
3.42
5.07
5.18
V
0.49
0.58
MODE = GND
0.25
0.56
0.66
0.3
0.01
0.13
0.62
0.73
0.35
A
A
A
mA
A
I
SINK-LIMIT
I
PFM
www.maximintegrated.com
Maxim Integrated
│
3
MAX15462
42V, 300mA, Ultra-Small, High-Efficiency,
Synchronous Step-Down DC-DC Converters
Electrical Characteristics (continued)
(V
IN
= 24V, V
GND
= 0V, C
IN
= C
VCC
= 1µF, V
EN/UVLO
= 1.5V, LX = MODE =
RESET
= unconnected; T
A
= T
J
= -40°C to +125°C, unless
otherwise noted. Typical values are at T
A
= +25°C. All voltages are referenced to GND, unless otherwise noted.) (Note 2)
PARAMETER
LX Dead Time
RESET
FB/V
OUT
Threshold for
RESET
Rising
FB/V
OUT
Threshold for
RESET
Falling
RESET
Delay After FB/V
OUT
Reaches 95% Regulation
RESET
Output Level Low
RESET
Output Leakage Current
MODE
MODE Internal Pullup Resistor
THERMAL SHUTDOWN
Thermal-Shutdown Threshold
Thermal-Shutdown Hysteresis
Temperature rising
166
10
°C
°C
500
kΩ
I
RESET
= 5mA
V
RESET
= 5.5V, T
A
= +25°C
FB/V
OUT
rising
FB/V
OUT
falling
93.5
90
95.5
92
2
0.2
0.1
97.5
94
%
%
ms
V
µA
SYMBOL
CONDITIONS
MIN
TYP
5
MAX
UNITS
ns
Note 2:
Limits are 100% tested at T
A
= +25°C. Limits over the operating temperature range and relevant supply voltage range are
2008年7月9日, CombOLED 研究项目的工作重点是开发出高性价比的生产工艺,以实现有机发光二极管 (OLED) 的量产。欧司朗光电半导体公司固态照明部主管 Bernhard Stapp 表示:“该项目由欧盟提供资金支持,欧司朗负责协调运作,旨在为推行新型照明光源应用创造必要的条件。”这包括采用性价比卓越的方法构建新型元件架构,从而生产出大幅面透明光源。作为 LED 市场的创新推...[详细]
UHF和HF都是一般的技术分类,不过每一类都有独立的支持协议。HF在13.56MHz频段更具有一致性,虽然国际业内行业标准很多。UHF RFID在858-960MHz频段已商业化。同时也有多种国际标准支持,包括EPC global Gen 2。 标签与读写器通过无线链接交换数据。链接可以通过适合任何频段的、具有不同读取范围和抗干扰性的EMF或RF场实现。HF RFID技术主要通过电磁场传送信...[详细]