7070 POWER INDUCTORS
Outgassing Compliant Power Inductors
CP-T0744
■
Special coating added to ensure DWV compliance.
■
High temperature materials allow operation in ambient
temperatures up to 155°C
■
Passes NASA low outgassing (Outgassing meets ASTM-E-595)
■
Passes vibration testing to 80 G and shock testing to 1000 G
■
Tin-lead (Sn-Pb) termination for best possible board adhesion
■
High current and very low DCR
■
Soft saturation makes them ideal for VRM/VRD applications.
Core material
Composite
Terminations
Tin-lead (63/37) over copper.
Weight
1.9 – 2.1g
Ambient temperature
–55°C to +105°C with
Irms
current
Maximum part temperature
+155°C (ambient + temp rise).
Storage temperature
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
150 per 7″ reel
Plastic tape: 16 mm wide, 0.3 mm thick, 12 mm pocket spacing,
7.21 mm pocket depth
Inductance
2
±20% (µH)
0.16
0.30
0.55
0.65
0.80
1.0
1.2
1.8
2.2
3.3
4.7
5.6
6.8
DCR (mOhms)
3
typ
max
0.75
0.83
1.06
1.17
1.42
1.56
1.75
1.93
2.08
2.29
2.55
2.81
3.10
3.41
4.05
4.46
5.73
6.33
8.56
9.42
12.96
14.26
13.67
15.03
17.84
19.62
SRF (MHz)
4
min
typ
166
207
108
135
71
89
59
74
54
67
51
64
34
43
34
43
28
35
26
32
21
26
17
21
16
20
Irms
(A)
6
Isat
5
(A) 20°C rise 40°C rise
78.0
22.9
27.1
55.6
19.6
25.1
43.0
17.6
21.8
40.0
15.8
19.9
37.8
15.6
19.4
34.8
15.0
18.8
31.2
12.2
16.2
25.0
11.9
15.8
19.6
9.9
13.4
19.4
8.7
11.3
15.2
7.9
10.2
13.0
6.4
8.6
12.8
5.1
6.9
Part
CP-T0744-161MSZ
CP-T0744-301MSZ
CP-T0744-551MSZ
CP-T0744-651MSZ
CP-T0744-801MSZ
CP-T0744-102MSZ
CP-T0744-122MSZ
CP-T0744-182MSZ
CP-T0744-222MSZ
CP-T0744-332MSZ
CP-T0744-472MSZ
CP-T0744-562MSZ
CP-T0744-682MSZ
number
1
Irms
Testing
Irms
testing was performed on a
0.060″ thick pcb with 4 oz. copper
traces optimized to minimize
additional temperature rise.
Temperature rise is highly
dependent on many factors
including pcb land pattern,
trace size, and proximity to
other components. Therefore
temperature rise should be
verified in application conditions.
1. When ordering, please specify
testing
code:
CP-T0744-682MSZ
Testing: Z
= Unscreened
T
= Screening per MIL-STD-981
U
= Screening per EEE-INST-002
F
= Screening per ESCC 3201
All screening performed to the document’s latest revision
2. Inductance tested at 100 kHz, 0.1 Vrms using an Agilent/HP 4192A.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using an Agilent/HP 4395A or equivalent.
5. DC current at 25°C that causes a 30% (typ) inductance drop from its value without current.
6. Current that causes the specified temperature rise from 25°C ambient. This information is for reference only
and does not represent absolute maximum ratings.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
®
Document T0744-1 Revised 09/05/18
1102 Silver Lake Road
Cary, IL 60013
Phone 800-981-0363
Fax 847-639-1508
Email cps@coilcraft.com
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.
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