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L1A2YA150JAB2F

产品描述L1A2YA150JAB2F, CHIP
产品类别无源元件    电容器   
文件大小143KB,共4页
制造商AVX
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L1A2YA150JAB2F概述

L1A2YA150JAB2F, CHIP

L1A2YA150JAB2F规格参数

参数名称属性值
Objectid1996791017
包装说明CHIP,
Reach Compliance Codecompliant
ECCN代码EAR99
YTEOL8.3
电容0.000015 µF
电容器类型ARRAY/NETWORK CAPACITOR
JESD-609代码e0
长度1.37 mm
制造商序列号L1A
安装特点SURFACE MOUNT
负容差5%
网络类型ISOLATED C NETWORK
元件数量1
功能数量2
端子数量4
最高工作温度125 °C
最低工作温度-55 °C
封装代码CHIP
封装形状RECTANGULAR PACKAGE
包装方法TR, PAPER, 7 INCH
正容差5%
额定(直流)电压(URdc)16 V
座面最大高度0.66 mm
表面贴装YES
温度特性代码C0G
温度系数30ppm/Cel ppm/°C
端子面层Tin/Lead (Sn/Pb)
端子节距0.64 mm
端子形状WRAPAROUND
宽度1 mm

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Capacitor Array
Capacitor Array (IPC)
BENEFITS OF USING CAPACITOR
ARRAYS
AVX capacitor arrays offer designers the opportunity to
lower placement costs, increase assembly line output
through lower component count per board and to reduce
real estate requirements.
For high volume users of cap arrays using the very latest
placement equipment capable of placing 10 components per
second, the increase in throughput can be very significant and
can have the overall effect of reducing the number of place-
ment machines required to mount components:
If 120 million 2-element arrays or 40 million 4-element arrays
were placed in a year, the requirement for placement
equipment would be reduced by one machine.
During a 20Hr operational day a machine places 720K
components. Over a working year of 167 days the machine
can place approximately 120 million. If 2-element arrays are
mounted instead of discrete components, then the number
of placements is reduced by a factor of two and in the
scenario where 120 million 2-element arrays are placed there
is a saving of one pick and place machine.
Smaller volume users can also benefit from replacing
discrete components with arrays. The total number of place-
ments is reduced thus creating spare capacity on placement
machines. This in turn generates the opportunity to increase
overall production output without further investment in new
equipment.
Reduced Costs
Placement costs are greatly reduced by effectively placing
one device instead of four or two. This results in increased
throughput and translates into savings on machine time.
Inventory levels are lowered and further savings are made
on solder materials, etc.
Space Saving
Space savings can be quite dramatic when compared to
the use of discrete chip capacitors. As an example, the
0508 4-element array offers a space reduction of >40% vs.
4 x 0402 discrete capacitors and of >70% vs. 4 x 0603
discrete capacitors. (This calculation is dependent on the
spacing of the discrete components.)
Increased Throughput
Assuming that there are 220 passive components placed in a
mobile phone:
A reduction in the passive count to 200 (by replacing
discrete components with arrays) results in an increase in
throughput of approximately 9%.
A reduction of 40 placements increases throughput by 18%.
W2A (0508) Capacitor Arrays
4 pcs 0402 Capacitors
=
1 pc 0508 Array
1.4
1.0
(0.055) (0.039)
1.88
(0.074)
5.0 (0.197)
AREA = 7.0mm
2
(0.276 in
2
)
2.1 (0.083)
AREA = 3.95mm
2
(0.156 in
2
)
The 0508 4-element capacitor array gives a PCB space saving of over 40%
vs four 0402 discretes and over 70% vs four 0603 discrete capacitors.
W3A (0612) Capacitor Arrays
4 pcs 0603 Capacitors
=
1 pc 0612 Array
2.3
1.5
(0.091) (0.059)
2.0
(0.079)
6.0 (0.236)
AREA = 13.8mm
2
(0.543 in
2
)
3.2 (0.126)
AREA = 6.4mm
2
(0.252 in
2
)
The 0612 4-element capacitor array gives a PCB space saving of over 50%
vs four 0603 discretes and over 70% vs four 0805 discrete capacitors.
51

 
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