Micro PGA 604 Position
Socket
DESCRIPTION
604 position, Micro Pin Grid Array (PGA)
SMT ZIF socket on a 1.27mmx1.27mm con-
tact pitch. The socket utilizes a single lever
actuation method for mating and unmating
the microprocessor package.
02/02
1309305
new product
DESCRIPTION
This socket is for the next generation IA-32
(Intel Architecture – 32 bit) XEON servers
and workstations. This socket will replace the
current Micro PGA 603 position socket, P/Ns
1364448, 1364994 and 1364674.
KEY FEATURES
•
1.27mm x 1.27mm contact spacing.
•
Zero Insertion Force for device socketing.
•
Single lever handle for actuation (no tools required).
•
135 degree actuation lever travel.
•
Reliable dual point of contact.
•
Solder ball SMT for PCB attachment.
•
Compliant contact geometry minimizes effects of
thermal expansion.
•
Nickel plating barrier prevents solder wicking.
•
High temperature thermoplastic housing material.
PART NUMBER
•
1489688-1 (has plastic pick & place cover)
•
1489688-2 (has tape pick & place cover)
•
1489691-1 Restricted to Intel (has plastic pick & place cover)
•
1489691-2 Restricted to Intel (has tape pick & place cover)
TECHNICAL DOCUMENTS
•
Product Specification: 108-1946
•
Application Specification: 114-13026
•
Instruction Sheet: 408-8601
FOR MORE INFORMATION
•
Kim Whitman, Business Development Mgr.
Phone: 717-592-3376
Fax: 717-592-6222
E-mail: kbwhitma@tycoelectronics.com
•
Chauncey D. Knopp, Product Mgr.
Phone: 717-986-3331
Fax:717-592-3588
E-mail: cdknopp@tycoelectronics.com
•
Dave Trout, Development Engineer
Phone: 717-592-5161
Fax: 717-592-2566
E-mail: david.trout@tycoelectronics.com
•
Brian Kuhnly, Product Engineer
Phone: 336-665-5967
Fax: 336-665-6624
E-mail: brian.kuhnly@tycoelectronics.com
Micro PGA 604 Position Socket
METRIC
Dimensions are millimeters
PRODUCT DIMENSIONS
53.85±0.15
19.05
0.52
Pin # Identifier
26.16±0.38
7.42±0.30
1.19
14.34
Pin #1
Polmide Tape Pick-
and-Place Cover
(-2 only)
29.58
0.70
32.48
15.78
13.80±0.10
21.25
42.5 FCPGA Outline
53.5 Interposer Outline
15.73
40.10
1489688-2 Assembly Shown
in Actuated (Locked) Position
(Final Shipping Condition)
Interposer Seating Surface
Actuation Lever
Slide CAM
5.26±0.25
Cover
Technical Support Center/AMP FAX Service
1-800-522-6752 717-986-7777
Specifications subject to change.
Dimensions are in millimeters
www.tycoelectronics.com
Housing
1489688-1 Assembly with
Plastic Pick-and-Place Cover
Shown in Open (unlocked) Position
Plastic Pick-and-
Place Cover (1 only)
603 POSTITION SOCKET
VS
. 604 POSITION SOCKET COMPARISON
Similarities Between the New Micro PGA 604 Socket
and the Existing Micro PGA 603 Socket.
The Following List of Components are Identical for Both
the 603 and 604 Sockets
• Actuation Lever
• Slide Cam
• Slide Cam Wear Plate
• Contact
• Solderball
The Assembly Processes Will Be the Same for Both
Sockets
Key Differences Between the New Micro PGA 604
Socket and the Existing Micro PGA 603 Socket
New Cover – The 604 Socket requires a new, shorter
cover with a recessed pin field and finger cutouts for
removal of the 42.5mm FCPGA Package
New Housing – The 604 Socket requires a new, shorter
housing with recessed pockets
for the finger cutouts•
1309305-PDF only-02/02
©2002 by Tyco Electronics. All Rights Reserved. Tyco, AMP, and AMPFAX are trademarks.
XEON is a trademark of intel Corporation.