F-213
ERF8–020–05.0–S–DV–TR
™
ERF8–040–05.0–S–DV–TR
(0,80 mm) .0315"
ERF8 SERIES
ERF8–060–05.0–L–DV–TR
RUGGED HIGH SPEED SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?ERF8
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
1.4A per contact @ 95°C
(6 adjacent pins powered)
Operating Temp Range:
-55°C to + 125°C
Voltage Rating:
200 VAC max
RoHS Compliant:
Yes
Board Mates:
ERM8
Cable Mates:
ERCD, ERDP
Robust Edge Rate
™
contact improves
“Zippered” unmating
10 to 150 I/Os
®
fina
TM
l
i
nch.com
(1,50 mm)
.059"
NOMINAL
WIPE
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 30µ" Gold
Call Samtec for maximum cycles mated with ERM8
ERM8/ERF8
7 mm Stack Height
Rated @ 3dB Insertion Loss
with PCB effects*
w/o PCB effects**
MATED HEIGHT*
ERF8
ERM8 LEAD STYLE
LEAD
STYLE
–02.0 –05.0 –08.0 –09.0
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (005-030)
(0,12 mm) .005" max (040-060)
(0,15 mm) .006" max (070-075)
Single-Ended
10.5 GHz / 21 Gbps
12 GHz / 24 Gbps
Signaling
Differential Pair
9.5 GHz / 19 Gbps
15.5 GHz / 31 Gbps
Signaling
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?ERF8 or contact sig@samtec.com
–05.0
(7,00) (10,00) (13,00) (14,00)
.276 .394 .512 .551
–07.0
(9,00) (12,00) (15,00) (16,00)
.354 .472 .591 .629
*Processing conditions
will affect mated height.
ls
toco d
Pro orte
Supp
Download
om/appnote
www.samtec.c mtec.com
@ sa
Contact SIG n protocols
o
for questions
ERF8
NO. OF POSITIONS
PER ROW
LEAD
STYLE
PLATING
OPTION
DV
OTHER
OPTION
TR
100 GbE
®
s
PCI Expres
es at
app not
–005, –010, –013,
–020, –025, –030,
–040, –049, –050,
–060, –070, –075
Specify
LEAD
STYLE
from
chart
LEAD
STYLE
–L
= 10µ"
(0,25 µm)
Gold on
contact,
Matte Tin
on tail
–L
= Latching
(Lead Style –05.0 only)
(N/A with –EGP or
–EGPS option)
–TR
= Tape
& Reel
Packaging
A
–S
= 30µ"
(0,76 µm)
Gold on
contact,
Matte Tin
on tail
–EGP
= Extended Guide Post
(Lead Style –07.0 only)
(N/A with –L & –EGPS option)
APPLICATIONS
STANDARD
NEXUS5001
™
.org
POWER.org
™
ARM/HSSTP
NEXUS5001
™
.org
POWER.org
™
POS.
11
17
20
23
35
–05.0
(5,10)
.200
SERIES
ERF8-DV
ERF8-DV
ERF8-DV
ERF8-DV
ERF8-DV
PART NOs.
ASP-137969-01
ASP-130368-01
ASP-130367-01
ASP-130368-01
ASP-135029-01
–07.0
No. of Positions x
(0,80) .0315 + (6,00) .236
–L & –EGP = No. of Positions x
(0,80) .0315 + (7,50) .295
–EGPS = No. of Positions x
(0,80) .0315 + (10,00) .394
01
(7,00)
.276
–EGPS
= Extended
Guide Post Shield
(Lead Style –07.0 only)
(N/A with –L & –EGP option)
(–010, –020, –025, –030 only)
(7,25)
.285
(5,60)
.220
–EGP
–K
= (6,00 mm) .236" DIA
Polyimide Film
Pick & Place Pad
APPLICATION
SPECIFIC
Other positions
and mezzanine stack
heights available.
Call Samtec.
(3,35)
.132
02
(5,30)
.209
(3,35)
.132
(1,32)
.052
DIA
(0,80)
.0315
A
(1,07)
.042
(0,64)
.025
(2,50)
.098
(6,20)
.244
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
(5,40)
.213
(0,94)
–L
.037
(7,20)
.283
–EGPS
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