Ceramic Capacitor, Ceramic, 3000V, 20% +Tol, 20% -Tol, NPQ, 0.002566uF, Surface Mount, 6267, CHIP
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Presidio Components Inc |
| 包装说明 | CHIP |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 电容 | 0.002566 µF |
| 电容器类型 | CERAMIC CAPACITOR |
| 介电材料 | CERAMIC |
| JESD-609代码 | e0 |
| 安装特点 | SURFACE MOUNT |
| 多层 | No |
| 负容差 | 20% |
| 端子数量 | 2 |
| 封装形状 | RECTANGULAR PACKAGE |
| 正容差 | 20% |
| 额定（直流）电压（URdc） | 3000 V |
| 尺寸代码 | 6267 |
| 表面贴装 | YES |
| 温度特性代码 | NPQ |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形状 | WRAPAROUND |
| Base Number Matches | 1 |
| HV6773NPQ2566PFM13P | HV6773NPQ1710PFM13P | HV6733NPQ3420PFM13P | HV6773NPQ1283PFM13P | HV6773NPQ502M13P | |
|---|---|---|---|---|---|
| 描述 | Ceramic Capacitor, Ceramic, 3000V, 20% +Tol, 20% -Tol, NPQ, 0.002566uF, Surface Mount, 6267, CHIP | Ceramic Capacitor, Ceramic, 3000V, 20% +Tol, 20% -Tol, NPQ, 0.00171uF, Surface Mount, 6267, CHIP | Ceramic Capacitor, Ceramic, 3000V, 20% +Tol, 20% -Tol, NPQ, 0.00342uF, Surface Mount, 6267, CHIP | Ceramic Capacitor, Ceramic, 3000V, 20% +Tol, 20% -Tol, NPQ, 0.001283uF, Surface Mount, 6267, CHIP | Ceramic Capacitor, Ceramic, 3000V, 10% +Tol, 10% -Tol, NPQ, 0.005uF, Surface Mount, 6267, CHIP |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Presidio Components Inc | Presidio Components Inc | Presidio Components Inc | Presidio Components Inc | Presidio Components Inc |
| 包装说明 | CHIP | , 6267 | , 6267 | , 6267 | , 6267 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 电容 | 0.002566 µF | 0.00171 µF | 0.00342 µF | 0.001283 µF | 0.005 µF |
| 电容器类型 | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
| 介电材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| JESD-609代码 | e0 | e4 | e4 | e4 | e4 |
| 安装特点 | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
| 多层 | No | No | No | No | No |
| 负容差 | 20% | 20% | 20% | 20% | 10% |
| 端子数量 | 2 | 2 | 2 | 2 | 2 |
| 封装形状 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
| 正容差 | 20% | 20% | 20% | 20% | 10% |
| 额定（直流）电压（URdc） | 3000 V | 3000 V | 3000 V | 3000 V | 3000 V |
| 尺寸代码 | 6267 | 6267 | 6267 | 6267 | 6267 |
| 表面贴装 | YES | YES | YES | YES | YES |
| 温度特性代码 | NPQ | NPQ | NPQ | NPQ | NPQ |
| 端子面层 | Tin/Lead (Sn/Pb) | Silver/Palladium (Ag/Pd) | Silver/Palladium (Ag/Pd) | Silver/Palladium (Ag/Pd) | Silver/Palladium (Ag/Pd) |
| 端子形状 | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND |
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