REVISIONS
LTR
A
DESCRIPTION
Delete short circuit output current (I
OS
) from table I. Change in I
CCH
, test
condition V
IN
, in table I. Editorial changes throughout. Device type 01
inactivated for new design.
Device type 01 reactivated for new design. Update to current requirements.
Editorial changes throughout. - gap
Add vendor cage code OC7V7. Update drawing to current MIL-PRF-38535
requirements. -jt
DATE (YR-MO-DA)
88-03-03
APPROVED
M. A. Frye
B
C
06-06-06
13-04-10
Raymond Monnin
C. SAFFLE
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
David W. Queenan
C
1
C
2
C
3
C
4
C
5
C
6
C
7
C
8
C
9
C
10
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
D. A. DiCenzo
APPROVED BY
N. A. Hauch
DRAWING APPROVAL DATE
87-07-20
REVISION LEVEL
C
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, DIGITAL, ADVANCED
SCHOTTKY TTL, NAND BUFFER,
MONOLITHIC SILICON
SIZE
A
CAGE CODE
AMSC N/A
67268
SHEET
1 OF 10
5962-86872
DSCC FORM 2233
APR 97
5962-E296-13
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-86872
01
C
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device types. The device types identify the circuit function as follows:
Device type
Generic number
Circuit function
01
54F38
Quad two-input NAND buffer with open collector outputs
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
C
D
2
Descriptive designator
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
CQCC1-N20
Terminals
14
14
20
Package style
Dual in-line
Flat package
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range ...................................................................
Input voltage range ......................................................................
Output sink current .......................................................................
Maximum power dissipation (P
D
) .................................................
Thermal resistance, junction-to-case (
θ
JC
): ..................................
Lead temperature (soldering, 10 seconds) ..................................
Junction temperature (T
J
) ............................................................
Storage temperature range ..........................................................
1.4 Recommended operating conditions.
Supply voltage (V
CC
) ....................................................................
Minimum high level input voltage (V
IH
) .........................................
Maximum low level input voltage (V
IL
) ..........................................
Case operating temperature range (T
C
) .......................................
4.5 V dc minimum to 5.5 V dc maximum
2.0 V dc
0.8 V dc
-55°C to +125°C
-0.5 V dc minimum to +7.0 V dc maximum
-1.2 V dc minimum at -18 mA to +7.0 V dc maximum
128 mA
165 mW
See MIL-STD-1835
+300°C
+175°C
-65°C to +150°C
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86872
SHEET
C
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.dla.mil/quicksearch/
or from the Standardization Document
Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections and logic diagram. The terminal connections and logic diagram shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Switching waveforms and test circuit. The logic diagram shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86872
SHEET
C
3
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD
PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and
Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the
requirements of MIL-PRF-38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that
affects this drawing.
3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, D or E . The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) T
A
= +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86872
SHEET
C
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55°C
≤
T
C
≤
+125°C
unless otherwise specified
Maximum collector cut-off
current
I
CEX
V
CC
= 4.5 V,
V
IN
= 0.8 V,
Inputs not under test = 5.5 V
Outputs under test are at 4.5 V
(V
OH
)
V
OL
V
CC
= 4.5 V,
I
OL
= 20 mA,
V
IN
= 2.0 V
Input clamp voltage
High level input current
V
IC
I
IH1
I
IH2
Low level input current
Supply current
I
IL
I
CCH
I
CCL
Functional tests
Propagation delay time,
A, B to Y
t
PLH
t
PHL
V
CC
= 4.5 V, I
IN
= -18 mA
V
CC
= 5.5 V, V
IN
= 2.7 V
V
CC
= 5.5 V, V
IN
= 7.0 V
V
CC
= 5.5 V, V
IN
= 0.5 V
V
CC
= 5.5 V, V
IN
= GND
V
CC
= 5.5 V, V
IN
= 5.5 V
See 4.3.1c
V
CC
= 5.0 V, R
L
= 500
Ω ±2%
C
L
= 50 pF
±10%
See figure 3
9, 10, 11
7.0
15
ns
1
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
7
9, 10, 11
1.0
6
ns
-1.2
20
100
-1.2
7
30
V
µA
µA
mA
mA
mA
1, 2, 3
0.5
V
1, 2, 3
Group A
subgroups
Min
Limits
Max
250
µA
Unit
Low level output voltage
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86872
SHEET
C
5
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