Advanced T1/CEPT Digital Trunk PLL
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Zarlink Semiconductor (Microsemi) |
| 包装说明 | QCCJ, |
| Reach Compliance Code | compli |
| JESD-30 代码 | S-PQCC-J28 |
| JESD-609代码 | e3 |
| 长度 | 11.505 mm |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 245 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 电信集成电路类型 | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 11.505 mm |
| MT8941BP1 | MT8941 | MT8941BE | MT8941BP | MT8941BPR | MT8941BPR1 | |
|---|---|---|---|---|---|---|
| 描述 | Advanced T1/CEPT Digital Trunk PLL | Advanced T1/CEPT Digital Trunk PLL | Advanced T1/CEPT Digital Trunk PLL | Advanced T1/CEPT Digital Trunk PLL | Advanced T1/CEPT Digital Trunk PLL | Advanced T1/CEPT Digital Trunk PLL |
| 是否Rohs认证 | 符合 | - | 不符合 | 不符合 | 不符合 | 符合 |
| 厂商名称 | Zarlink Semiconductor (Microsemi) | - | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) |
| 包装说明 | QCCJ, | - | DIP, DIP24,.6 | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | QCCJ, |
| Reach Compliance Code | compli | - | compli | compli | compli | compli |
| JESD-30 代码 | S-PQCC-J28 | - | R-PDIP-T24 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 |
| JESD-609代码 | e3 | - | e0 | e0 | e0 | e3 |
| 长度 | 11.505 mm | - | 30.99 mm | 11.505 mm | 11.505 mm | 11.505 mm |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | - | 24 | 28 | 28 | 28 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | - | DIP | QCCJ | QCCJ | QCCJ |
| 封装形状 | SQUARE | - | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | - | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 245 | - | 225 | NOT SPECIFIED | 225 | 260 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | - | 6.35 mm | 4.57 mm | 4.57 mm | 4.57 mm |
| 标称供电电压 | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | NO | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 电信集成电路类型 | TELECOM CIRCUIT | - | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | MATTE TIN |
| 端子形式 | J BEND | - | THROUGH-HOLE | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | - | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | - | DUAL | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | NOT SPECIFIED | 30 | 30 |
| 宽度 | 11.505 mm | - | 15.24 mm | 11.505 mm | 11.505 mm | 11.505 mm |
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