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HSMBJ5924BTRE3

产品描述Zener Diode, 9.1V V(Z), 5%, 3W,
产品类别分立半导体    二极管   
文件大小125KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
标准
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HSMBJ5924BTRE3概述

Zener Diode, 9.1V V(Z), 5%, 3W,

HSMBJ5924BTRE3规格参数

参数名称属性值
是否Rohs认证符合
Objectid106618521
Reach Compliance Codeunknown
ECCN代码EAR99
配置SINGLE
二极管类型ZENER DIODE
最大动态阻抗4 Ω
元件数量1
最高工作温度150 °C
最大功率耗散3 W
标称参考电压9.1 V
表面贴装YES
最大电压容差5%
工作测试电流41.2 mA

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HSMBJ5913 thru HSMBJ5956, e3
SILICON 3.0 Watt ZENER DIODE
SCOTTSDALE DIVISION
DESCRIPTION
The HSMBJ5913-5956B series of surface mount 3.0 watt Zeners provides
voltage regulation in a selection from 3.3 to 200 volts with different tolerances
as identified by suffix letter on the part number. It is equivalent to the JEDEC
registered 1N5913 thru 1N5956B with identical electrical characteristics
except it is rated at 3.0 W instead of 1.5 W with the lower thermal resistance
features of this surface mount packaging. These plastic encapsulated Zeners
have a moisture classification of Level 1 with no dry pack required and are
also available in military equivalent screening levels by adding a prefix
identifier as further described in the Features section. Microsemi also offers
numerous other Zener products to meet higher and lower power applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
PACKAGE
WWW .
Microsemi
.C
OM
DO-214AA
(see package notes)
FEATURES
Surface mount equivalent to 1N5913 to
1N5956B
Ideal for high-density and low-profile mounting
Zener voltage available 3.3V to 200V
Standard voltage tolerances are plus/minus 5%
with B suffix and 10 % with A suffix identification
Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
RoHS Compliant devices available by adding
“e3’ suffix
Options for screening in accordance with MIL-
PRF-19500 for JAN, JANTX, JANTXV, and
JANS are available by adding MQ, MX, MV, or
MSP prefixes respectively to part numbers.
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 3.3 to 200 V
Flexible axial-lead mounting terminals
Nonsensitive to ESD per MIL-STD-750 Method
1020
High specified maximum current (I
ZM
) when
adequately heat sinking
Moisture classification is Level 1 with no dry pack
required per IPC/JEDEC J-STD-020B
MAXIMUM RATINGS
Power dissipation at 25
º
C: 3.0 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+150
º
C
Thermal Resistance: 15
º
C/W junction to lead,
º
or 80 C/W junction to ambient when mounted on
FR4 PC board (1oz Cu) with recommended
footprint (see last page)
Steady-State Power: 3 watts at T
L
< 105
o
C, or
1.56 watts at T
A
= 25
º
C when mounted on FR4
PC board with recommended footprint (also see
Figure1)
Forward voltage @200 mA: 1.2 volts
(maximum)
Solder Temperatures: 260 C for 10 s
(maximum)
º
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: C-bend (modified J-bend) leads, Tin-
Lead or RoHS Compliant annealed matte-Tin
plating solderable per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Includes part number without prefix
(e.g. 5913B, 5926C, 5951D, etc.)
TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape 750 per 7 inch reel or 2500 per 13
inch reel (add “TR” suffix to part number)
WEIGHT: 0.1 grams
See package dimensions on last page
HSMBJ5913-595
6B,e3
Copyright
©
2006
3-12-2006 REV G
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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