multiplexer switch ics 16-channel analog mux/DEmux
参数名称 | 属性值 |
Brand Name | NXP Semiconductor |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SSOP2 |
包装说明 | SSOP, SSOP24,.3 |
针数 | 24 |
制造商包装代码 | SOT340-1 |
Reach Compliance Code | compliant |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PDSO-G24 |
JESD-609代码 | e4 |
长度 | 8.2 mm |
湿度敏感等级 | 1 |
信道数量 | 16 |
功能数量 | 1 |
端子数量 | 24 |
标称断态隔离度 | 50 dB |
通态电阻匹配规范 | 9 Ω |
最大通态电阻 (Ron) | 180 Ω |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装等效代码 | SSOP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 2 mm |
最大供电电流 (Isup) | 0.294 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 4.5 V |
表面贴装 | YES |
最长断开时间 | 83 ns |
最长接通时间 | 90 ns |
切换 | BREAK-BEFORE-MAKE |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 5.3 mm |
Base Number Matches | 1 |
74HCT4067DB,118 | 74HCT4067PW,118 | 74HC4067D,653 | 74HCT4067D,112 | 74HC4067DB,112 | 74HCT4067PW,112 | 74HC4067BQ,118 | 74HCT4067DB,112 | |
---|---|---|---|---|---|---|---|---|
描述 | multiplexer switch ics 16-channel analog mux/DEmux | multiplexer switch ics 16-channel analog mux/DEmux | multiplexer switch ics 16-channel analog | multiplexer switch ics 16-channel analog mux/DEmux | multiplexer switch ics 16-channel analog | multiplexer switch ics 16ch anlg mux/DEmux | multiplexer switch ics 16-channel analog mux/DEmux | multiplexer switch ics 16ch anlg mux/DEmux |
Brand Name | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | SSOP2 | TSSOP2 | SOP | SOP | SSOP2 | TSSOP2 | QFN | SSOP2 |
包装说明 | SSOP, SSOP24,.3 | TSSOP, TSSOP24,.25 | SOP, SOP24,.4 | SOP, SOP24,.4 | SSOP, SSOP24,.3 | TSSOP, TSSOP24,.25 | HVQCCN, LCC24/28,.14X.2,20 | SSOP, SSOP24,.3 |
针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
制造商包装代码 | SOT340-1 | SOT355-1 | SOT137-1 | SOT137-1 | SOT340-1 | SOT355-1 | SOT815-1 | SOT340-1 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PQCC-N24 | R-PDSO-G24 |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
长度 | 8.2 mm | 7.8 mm | 15.4 mm | 15.4 mm | 8.2 mm | 7.8 mm | 5.5 mm | 8.2 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
信道数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
标称断态隔离度 | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB |
通态电阻匹配规范 | 9 Ω | 9 Ω | 6 Ω | 9 Ω | 9 Ω | 9 Ω | 6 Ω | 9 Ω |
最大通态电阻 (Ron) | 180 Ω | 180 Ω | 130 Ω | 180 Ω | 180 Ω | 180 Ω | 130 Ω | 180 Ω |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | TSSOP | SOP | SOP | SSOP | TSSOP | HVQCCN | SSOP |
封装等效代码 | SSOP24,.3 | TSSOP24,.25 | SOP24,.4 | SOP24,.4 | SSOP24,.3 | TSSOP24,.25 | LCC24/28,.14X.2,20 | SSOP24,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | 5 V | 5 V | 2/10 V | 5 V | 2/9 V | 5 V | 2/10 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2 mm | 1.1 mm | 2.65 mm | 2.65 mm | 2 mm | 1.1 mm | 1 mm | 2 mm |
最大供电电流 (Isup) | 0.294 mA | 0.294 mA | 0.32 mA | 0.08 mA | 0.16 mA | 0.08 mA | 0.32 mA | 0.08 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 10 V | 5.5 V | 10 V | 5.5 V | 10 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 2 V | 4.5 V | 2 V | 4.5 V | 2 V | 4.5 V |
标称供电电压 (Vsup) | 4.5 V | 4.5 V | 9 V | 5 V | 5 V | 5 V | 9 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
最长断开时间 | 83 ns | 83 ns | 57 ns | 90 ns | 435 ns | 90 ns | 57 ns | 90 ns |
最长接通时间 | 90 ns | 90 ns | 63 ns | 98 ns | 450 ns | 98 ns | 63 ns | 98 ns |
切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
宽度 | 5.3 mm | 4.4 mm | 7.5 mm | 7.5 mm | 5.3 mm | 4.4 mm | 3.5 mm | 5.3 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved