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SST39VF3202B-70-4C-B3KE

产品描述flash 32m (2mx16) 70ns 2.7-3.6V commercial
产品类别存储    存储   
文件大小290KB,共2页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
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SST39VF3202B-70-4C-B3KE概述

flash 32m (2mx16) 70ns 2.7-3.6V commercial

SST39VF3202B-70-4C-B3KE规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码BGA
包装说明TFBGA, BGA48,6X8,32
针数48
Reach Compliance Codecompliant
ECCN代码3A991.B.1.A
Factory Lead Time7 weeks
Is SamacsysN
最长访问时间70 ns
其他特性TOP BOOT BLOCK
启动块TOP
命令用户界面YES
通用闪存接口YES
数据轮询YES
JESD-30 代码R-PBGA-B48
JESD-609代码e1
长度8 mm
内存密度33554432 bit
内存集成电路类型FLASH
内存宽度16
湿度敏感等级3
功能数量1
部门数/规模1K
端子数量48
字数2097152 words
字数代码2000000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织2MX16
封装主体材料PLASTIC/EPOXY
封装代码TFBGA
封装等效代码BGA48,6X8,32
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源3/3.3 V
编程电压2.7 V
认证状态Not Qualified
座面最大高度1.2 mm
部门规模2K
最大待机电流0.00002 A
最大压摆率0.045 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间40
切换位YES
类型NOR TYPE
宽度6 mm
Base Number Matches1

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Multi-Purpose Flash
(MPF
)
Multi-Purpose Flash Plus (MPF+)
39
Series
Product Description
Multi-Purpose Flash
(MPF
) and Multi-Purpose Flash Plus (MPF+) make up a family of
parallel flash memory products that deliver high performance, low power consumption,
superior reliability and small sector size. Based on SST
®
SuperFlash
®
technology, MPF and
MPF+ provide faster program, erase and read times than conventional flash, thereby saving
power consumption and increasing manufacturing throughput.
In addition to offering 3V and 5V memory products, MPF and MPF+ provide 1.8V devices
that deliver significant power savings compared to industry standard flash. Ideal for space-
constrained applications, this family offers the industry’s smallest standard packages, the
XFLGA and WFBGA, both as small as 4mm x 6mm.
Product Brief
September 2010
Key Features
Operating Voltages
- 1.65-1.95V
- 2.7-3.6V
- 4.5-5.5V
Low Power Consumption*
- Active current: 5 mA (typical)
- Standby current: 3 µA (typical)
Fast Read Access Times*
- 45 ns
- 55 ns
- 70 ns
Fast Programming*
-14 µs per word (typical)
* Data varies for different devices.
For details, please refer to datasheet.
Flexible Erase Capability and Fast Erase Times*
- 2 KWord sector erase: 18 ms (typical)
- 32 KWord block erase: 18 ms (typical)
- Chip erase: 70 ms (typical)
Small uniform sector sizes:
2 KWord and 32 KWord
Commercial and industrial operating temperatures
Endurance:
100,000 cycles (typical)
Data Retention:
100 years (min)
MPF+ Offers Additional Features
- Erase suspend
- Boot block
- Hardware reset features
39 Series: Multi-Purpose Flash (MPF) Packages*
Voltage Density
32-pin
PDIP
(PHE)
32-pin
PLCC
(NHE)
32-pin 34-ball 48-ball
TSOP WFBGA TFBGA
(WHE) (MME) (B3KE)
48-lead 48-bump 48-ball
TSOP XFLGA WFBGA
(EKE) (C1QE) (M1QE)
(CAQE) (MAQE)
Applications
— Bluetooth
— GPS
— Digital TVs
— Digital Media Players, MP3 players
— WiFi/ WiMAX
— Printers
— Digital Photo Frames
— Mobile Phones
— DSL/Cable Modems
— Servers and Routers
— Set Top Boxes
— Digital Cameras
— Industrial
— Automotive Infotainment
Silicon Storage Technology, Inc.
1020 Kifer Road
Sunnyvale, CA 94086-5308
Tel: (408) 735-9110
Fax: (408) 735-9036
www.SST.com
4 Mbit
1.8V
8 Mbit
16 Mbit
512 Kbit
1 Mbit
3V
2 Mbit
4 Mbit
8 Mbit
16 Mbit
32 Mbit
64 Mbit
1 Mbit
5V
2 Mbit
4 Mbit
*
Wafer/Die (Known Good Die) sales of above devices are also available.
Please contact SST sales for detailed information.

SST39VF3202B-70-4C-B3KE相似产品对比

SST39VF3202B-70-4C-B3KE SST39VF3201B-70-4C-EKE SST39VF3202B-70-4I-B3KE-T SST39WF1601-70-4I-MBQE
描述 flash 32m (2mx16) 70ns 2.7-3.6V commercial flash 32m (2mx16) 70ns 2.7-3.6V commercial flash 32m (2mx16) 70ns 2.7-3.6V industrial flash 16m (1mx16) 70ns 1.65-1.95v indust
是否Rohs认证 符合 符合 符合 符合
包装说明 TFBGA, BGA48,6X8,32 TSOP1, TSSOP48,.71,20 FBGA, BGA48,6X8,32 5 X 6 MM, ROHS COMPLIANT, MO-225, WFBGA-48
Reach Compliance Code compliant compliant compliant compliant
最长访问时间 70 ns 70 ns 70 ns 70 ns
启动块 TOP BOTTOM TOP BOTTOM
命令用户界面 YES YES YES YES
通用闪存接口 YES YES YES YES
数据轮询 YES YES YES YES
JESD-30 代码 R-PBGA-B48 R-PDSO-G48 R-PBGA-B48 R-PBGA-B48
JESD-609代码 e1 e3 e1 e1
内存密度 33554432 bit 33554432 bit 33554432 bit 16777216 bit
内存集成电路类型 FLASH FLASH FLASH FLASH
内存宽度 16 16 16 16
部门数/规模 1K 1K 1K 512
端子数量 48 48 48 48
字数 2097152 words 2097152 words 2097152 words 1048576 words
字数代码 2000000 2000000 2000000 1000000
最高工作温度 70 °C 70 °C 85 °C 85 °C
组织 2MX16 2MX16 2MX16 1MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFBGA TSOP1 FBGA VFBGA
封装等效代码 BGA48,6X8,32 TSSOP48,.71,20 BGA48,6X8,32 BGA48,6X11,20
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE GRID ARRAY, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
电源 3/3.3 V 3/3.3 V 3/3.3 V 1.8 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
部门规模 2K 2K 2K 2K
最大待机电流 0.00002 A 0.00002 A 0.00002 A 0.00004 A
最大压摆率 0.045 mA 0.045 mA 0.045 mA 0.025 mA
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) - annealed Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
端子形式 BALL GULL WING BALL BALL
端子节距 0.8 mm 0.5 mm 0.8 mm 0.5 mm
端子位置 BOTTOM DUAL BOTTOM BOTTOM
切换位 YES YES YES YES
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE
零件包装代码 BGA TSOP1 - BGA
针数 48 48 - 48
ECCN代码 3A991.B.1.A 3A991.B.1.A - 3A991.B.1.A
Factory Lead Time 7 weeks 11 weeks 13 weeks -
其他特性 TOP BOOT BLOCK BOTTOM BOOT BLOCK - BOTTOM BOOT-BLOCK
长度 8 mm 18.4 mm - 6 mm
湿度敏感等级 3 3 - 3
功能数量 1 1 - 1
工作模式 ASYNCHRONOUS ASYNCHRONOUS - SYNCHRONOUS
峰值回流温度(摄氏度) 260 260 - 260
编程电压 2.7 V 2.7 V - 1.8 V
座面最大高度 1.2 mm 1.2 mm - 0.73 mm
最大供电电压 (Vsup) 3.6 V 3.6 V - 1.95 V
最小供电电压 (Vsup) 2.7 V 2.7 V - 1.65 V
标称供电电压 (Vsup) 3 V 3 V - 1.8 V
处于峰值回流温度下的最长时间 40 40 - 40
宽度 6 mm 12 mm - 5 mm
厂商名称 - Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)

 
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