Flip Flops CMOS Hex D-Type Flip-Flop
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | SOIC |
包装说明 | SOP, SOP16,.25 |
针数 | 16 |
Reach Compliance Code | unknown |
系列 | 4000/14000/40000 |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e4 |
长度 | 9.9 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
最大频率@ Nom-Sup | 3500000 Hz |
湿度敏感等级 | 1 |
位数 | 6 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
包装方法 | TAPE AND REEL |
峰值回流温度(摄氏度) | 260 |
电源 | 5/15 V |
传播延迟(tpd) | 300 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电压 (Vsup) | 18 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
宽度 | 3.9 mm |
最小 fmax | 8 MHz |
CD40174BM96G4 | FS1DF77P2177MLF | CD40174BM96E4 | CD40174BMTG4 | CD40174BMG4 | CD40174BMTE4 | CD40174BNSRE4 | CD40174BNSRG4 | CD40174BPWG4 | |
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描述 | Flip Flops CMOS Hex D-Type Flip-Flop | Cable Assembly, | Flip Flops CMOS Hex D-Type Flip-Flop | Flip Flops CMOS Hex D-Type Flip-Flop | Flip Flops CMOS Hex D-Type Flip-Flop | Flip Flops CMOS Hex D-Type Flip-Flop | Flip Flops CMOS Hex D-Type Flip-Flop | Flip Flops CMOS Hex D-Type Flip-Flop | Flip Flops CMOS Hex D-Type Flip-Flop |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
长度 | 9.9 mm | 77 mm | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm | 10.2 mm | 10.2 mm | 5 mm |
最高工作温度 | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -20 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | SOIC | - | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | TSSOP |
包装说明 | SOP, SOP16,.25 | - | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.3 | SOP, SOP16,.3 | GREEN, PLASTIC, TSSOP-16 |
针数 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
系列 | 4000/14000/40000 | - | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
JESD-30 代码 | R-PDSO-G16 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e4 | - | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
负载电容(CL) | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP | - | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
最大频率@ Nom-Sup | 3500000 Hz | - | 3500000 Hz | 3500000 Hz | 3500000 Hz | 3500000 Hz | 3500000 Hz | 3500000 Hz | 3500000 Hz |
湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
位数 | 6 | - | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
输出极性 | TRUE | - | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | - | SOP | SOP | SOP | SOP | SOP | SOP | TSSOP |
封装等效代码 | SOP16,.25 | - | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.3 | SOP16,.3 | TSSOP16,.25 |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
包装方法 | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL | TUBE | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TUBE |
峰值回流温度(摄氏度) | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | 5/15 V | - | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
传播延迟(tpd) | 300 ns | - | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | - | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 2 mm | 2 mm | 1.2 mm |
最大供电电压 (Vsup) | 18 V | - | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
最小供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | - | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 3.9 mm | - | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 5.3 mm | 5.3 mm | 4.4 mm |
最小 fmax | 8 MHz | - | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
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