LCD Gamma Buffers 18-V Supply Multi-Ch Correction
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | SSOP |
包装说明 | HTSSOP, |
针数 | 28 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
BUF11704AIPWPG4 | BUF06704AIPWPG4 | BUF07704AIPWPG4 | BUF07704AIPWPRG4 | BUF11704AIPWPRG4 | BUF05704AIPWPG4 | BUF05704AIPWPRG4 | |
---|---|---|---|---|---|---|---|
描述 | LCD Gamma Buffers 18-V Supply Multi-Ch Correction | LCD Gamma Buffers 18-V Supply Multi-Ch Correction | LCD Gamma Buffers 6 Ch LCD Gamma Crctn Buffer + 1 Vcom | LCD Gamma Buffers 6 Ch LCD Gamma Crctn Buffer + 1 Vcom | LCD Gamma Buffers 18-V Supply Multi-Ch Correction | LCD Gamma Buffers 18-V Supply Multi-Ch Correction | LCD Gamma Buffers 18-V Supply Multi-Ch Correction |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | SSOP | TSSOP | TSSOP | TSSOP | SSOP | TSSOP | TSSOP |
包装说明 | HTSSOP, | HTSSOP, | HTSSOP, | HTSSOP, | HTSSOP, | GREEN, PLASTIC, HTSSOP-14 | GREEN, PLASTIC, HTSSOP-14 |
针数 | 28 | 16 | 20 | 20 | 28 | 14 | 14 |
Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | - | BUFFER | - | BUFFER | - | BUFFER | BUFFER |
最大平均偏置电流 (IIB) | - | 0.0002 µA | - | 0.0002 µA | - | 0.0002 µA | 0.0002 µA |
标称带宽 (3dB) | - | 1 MHz | - | 1 MHz | - | 1 MHz | 1 MHz |
最大输入失调电压 | - | 20000 µV | - | 20000 µV | - | 20000 µV | 20000 µV |
JESD-30 代码 | - | R-PDSO-G16 | - | R-PDSO-G20 | - | R-PDSO-G14 | R-PDSO-G14 |
JESD-609代码 | - | e4 | - | e4 | - | e4 | e4 |
长度 | - | 5 mm | - | 6.5 mm | - | 5 mm | 5 mm |
湿度敏感等级 | - | 2 | - | 2 | - | 2 | 2 |
功能数量 | - | 6 | - | 6 | - | 4 | 4 |
端子数量 | - | 16 | - | 20 | - | 14 | 14 |
最高工作温度 | - | 85 °C | - | 85 °C | - | 85 °C | 85 °C |
最低工作温度 | - | -25 °C | - | -25 °C | - | -25 °C | -25 °C |
封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | HTSSOP | - | HTSSOP | - | HTSSOP | HTSSOP |
封装形状 | - | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | - | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | - | 260 | - | 260 | - | 260 | 260 |
认证状态 | - | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | - | 1.2 mm | - | 1.2 mm | - | 1.2 mm | 1.2 mm |
标称压摆率 | - | 1.6 V/us | - | 1.6 V/us | - | 1.6 V/us | 1.6 V/us |
供电电压上限 | - | 19 V | - | 19 V | - | 19 V | 19 V |
标称供电电压 (Vsup) | - | 18 V | - | 18 V | - | 18 V | 18 V |
表面贴装 | - | YES | - | YES | - | YES | YES |
技术 | - | BIPOLAR | - | BIPOLAR | - | BIPOLAR | BIPOLAR |
温度等级 | - | OTHER | - | OTHER | - | OTHER | OTHER |
端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | - | GULL WING | - | GULL WING | - | GULL WING | GULL WING |
端子节距 | - | 0.65 mm | - | 0.65 mm | - | 0.65 mm | 0.65 mm |
端子位置 | - | DUAL | - | DUAL | - | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 4.4 mm | - | 4.4 mm | - | 4.4 mm | 4.4 mm |
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