HMJ7-1
High Dynamic Range FET Mixer
Product Features
•
Greater than +34 dBm IIP3
•
77 dBc 2x1 Spur Rejection in
IF Band
•
RF 1000 - 2000 MHz
•
LO 1000 - 2000 MHz
•
IF 10 - 1000 MHz
•
+24 dBm LO Drive Level
•
+5V Bias (40 mA)
•
SMT J-Lead Package
Product Description
The HMJ7-1 is a high dynamic range GaAs FET mixer.
This active broadband mixer realizes a typical third order
intercept point of +34 dBm at an LO drive level of +21
dBm. The HMJ7-1 also provides excellent suppression of
spurious intermodulation products, greater than 67 dBc,
meeting DOCSIS2 and Euro DOCSIS system
requirements. The HMJ7-1 is a specially screened
version of the HMJ7 mixer meeting all of the
performance requirements of the HMJ7 with 21 dBm LO
power, but also meeting the suppression requirements for
intermodulation products at a 24 dBm LO power level.
The HMJ7-1 comes in a low cost, 22-pin J-Lead package.
The combination of high dynamic range and spurious
suppression makes the HMJ7-1 an ideal choice for
CATV headend transmission equipment and other
applications requiring a broadband mixer in the 1000
MHz to 2000 MHz frequency range.
Functional Diagram
RF
LO
+5Vdc
IF
Applications
•
CATV Head-End Equipment
Function
IF
LO
RF
+5V
Ground
Pin No.
2
13
21
10
All other pins
Specifications
(1)
Parameter
RF Frequency Range
LO Frequency Range
IF Frequency Range
SSB Conversion Loss
Noise Figure
LO-RF Isolation
LO-IF Isolation
RF-IF Isolation
Input IP3
RF Return Loss
LO Return Loss
IF Return Loss
Spurious Rejection
(2)
Spurious Rejection
(2)
Input P1dB
LO Drive Level
DC Current at +5V Bias
Units
MHz
MHz
MHz
dB
dB
dB
dB
dB
dBm
dB
dB
dB
dBc
dBc
dBm
dBm
mA
Min
Typ
1000 – 2000
1000 – 2000
10 – 1000
8.5
10.5
24
30
24
34
10
5
14
77
77
+23
+21
40
Max
Condition
9.5
21
24
29
RF = 1018 MHz @ 0 dBm
67
76
LO = +24 dBm, IF freq = 150 – 540 MHz, 640 – 1000 MHz
LO = +24 dBm, IF freq = 540 – 640 MHz
60
1. Test conditions unless otherwise noted: 25 ºC, RF = 1018.75 MHz @ 0 dBm, LO = 21 dBm, IF = 50, 650, 860 MHz in a high-side LO configuration.
2. The 2x1 spur is tested where the IM spur = 2 * RF input – LO, where RF input = 1090 MHz @ -14 dBm, LO = 1190 to 2090 MHz @ 24 dBm, IM spur = output frequency. The IM spur level is specified in
dBc with respect to the desired IF frequency calculated: IF output = LO - RF input.
Absolute Maximum Rating
Parameters
Operating Case Temperature
Storage Temperature
Maximum Input Power
Ordering Information
Part No.
HMJ7-1
Rating
-40 to +85
°C
-65 to +100
°C
+25 dBm
Description
High Dynamic Range FET Mixer
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6633
•
e-mail: info-sales@tqs.com
•
Web site: www. TriQuint.com
January 2009
HMJ7-1
High Dynamic Range FET Mixer
Typical Performance Data
All measurements are shown with a LO drive level = +21 dBm. Improved performance is expected with LO = +24 dBm.
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6633
•
e-mail: info-sales@tqs.com
•
Web site: www. TriQuint.com
January 2009
HMJ7-1
High Dynamic Range FET Mixer
Outline Drawing
Product Marking
The component will be marked with an
“HMJ7” designator with a four-digit
alphanumeric lot number XXXX.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Information
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 2
Passes at 2000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes at 2000 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Dimensions are expressed in Inches.
TOLERANCE .XXX [ .015 .XX [ .02
Drawing is illustrated at Max dimensions.
Mounting Config. Notes
Land Pattern / Mounting Configuration
1. Ground vias are critical for thermal and RF grounding
considerations.
2. A minimum of 36 ground vias are required for 14 mil FR4
boards.
3. If your PCB design rules allow, ground vias should be placed
under the land pattern for better RF performance. Otherwise
ground vias should be placed as close to the land pattern as
possible.
4. Trace width depends on the PCB material.
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6633
•
e-mail: info-sales@tqs.com
•
Web site: www. TriQuint.com
January 2009
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