CERAMIC CAPACITORS
CL Series
Taping : dimensions
High Power
FEATURES
• Low ESR/ESL, RF power capacitors
• NPO capacitors, ultra stability
• RoHS compliant
• Excellent characteristics in current, voltage and power
with high Q factor
• Working voltage: 200V - 7,200V
• Sizes: 2225, 4040 and 7065
• Capacitance range: 1pF - 10,000pF
• Laser Marked (optional)
ELECTRICAL AND ENVIRONMENTAL SPECIFICATIONS
Electrical specifications
Parameter
Capacitance
Tolerances
Working voltage (WV
DC
)
Temperature coefficient
Insulation Resistance
Dielectric Withstanding
(test voltage applied for 5 seconds)
Aging
Piezo Effect
Value
1pF - 10,000pF
B, C, D below 10pF
F, G, J, K, M above 10pF
See capacitance range chart
NPO: (0 ± 30) ppm/°C, –55°C to +125°C
10
5
MΩ min at 25°C at rated WV
DC
10
4
MΩ min at 125°C at rated WV
DC
2 x WV
DC
for WV
DC
≤ 500V
1.5 x WV
DC
for 500V < WV
DC
≤ 2,500V
1.3 x WV
DC
for WV
DC
> 2,500V
none
none
APPLICATIONS
• RF Power Amplifiers
• Industrial (Plasma Chamber)
• Medical (MRI Coils)
Environmental specifications
Parameter
Life Test
Value
2,000 hours, +125°C
at 1.5 x WV
DC
(WV
DC
≤ 500V)
at 1.3 x WV
DC
(500V < WV
DC
< 1,250V)
at 1 x WV
DC
(1,250V ≤ WV
DC
)
240 hours, 85% relative humidity at 85°C
(ESA/SCC n°3009)
56 days, 93% relative humidity at 40°C
0V, 5V, WV
DC
or 500V whichever is less
CIRCUIT APPLICATIONS
• DC Blocking
• Matching Networks
• Tuning and Coupling
PHYSICAL CHARACTERISTICS
Moisture Resistance Test 1
Moisture Resistance Test 2
• Chip capacitors for surface mounting with Nickel barrier
and tinning or Copper barrier and tinning (non magnetic)
• Ribbon leads for surface mounting, axial or radial leads
for through-hole circuits
Capacitance
12 pF
47 pF
47 pF TK239
Typical Breakdown Voltage CLE with black coating 50 MHz DC = 1%
Breakdown voltage Vpeak (V)
>9500
6000
8800
HOW TO ORDER
362
Voltage code
CL
Dielectric
X
Case
size
X
= 2225
E
= 4040
F
= 7065
100
Capacitance
code
G
Tolerance
code
C
Termination
code
1
Lead / Ribbon code
-
Coating code
L
Marking code
-
Tape and reel
-RoHS
201
= 200V
301
= 300V
501
= 500V
102
= 1,000V
122
= 1,200V
152
= 1,500V
162
= 1,600V
252
= 2,500V
362
= 3,600V
502
= 5,000V
702
= 7,000V
722
= 7,200V
Please refer to
voltage given in
capacitance range
chart
CL
= NPO:
(0±30)
ppm/°C
-:
no lead or ribbon
Please refer
B
= ±0.1pF
S
= Standard:
to capacitance
C
= ±0.25pF tin-plated nickel
1
= Micro-strip ribbons,
code given in
D
= ±0.5pF
RoHS
capacitance range
F
= ±1% Available on sizes
chart
G
= ±2% 2225 and 4040:
6
= Radial leads, non
RoHS
J
= ±5%
C
= Non-magnetic:
K
= ±10% tin-plated copper
Available on size 4040:
See note 1 Available on size
1S
= Short micro-strip
ribbons, RoHS.
7065:
A
= Non-magnetic:
2
= Axial ribbons, RoHS.
silver-palladium
3
= Radial ribbons,
RoHS.
See note 2
Available on sizes
2225 and 4040:
7
= Axial leads, non
RoHS.
See note 3
-:
no coating
H
= coating
requested
-:
no marking
L
= laser marking
The RoHS tag is
not part of the
Available on sizes
reference
2225 and 4040:
E
= horizontal orientation
Tag added at the
CPX: 500 components per
end of P/N for
reel
information
CPE: 500 or 700 components
per reel
Available on size 4040:
X
= verticale orientation,
only available on CPE, 350
components per reel
-:
no tape and reel
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CERAMIC CAPACITORS
High Power
2225: TYPICAL ESR VERSUS CAPACITANCE
50
40
35
30
25
20
15
10
5
0
1
1,000
50 M
Hz
General characteristics
CL Series
4040: TYPICAL ESR VERSUS CAPACITANCE
50
45
40
35
30
25
20
15
10
5
0
1
100
1,000
10,000
30
z
MH
ESR (mΩ)
100
MHz
ESR (mΩ)
30 M
H
z
Capacitance (pF)
Capacitance (pF)
2225: TYPICAL CURRENT RATING VERSUS CAPACITANCE
100
4040: TYPICAL CURRENT RATING VERSUS CAPACITANCE
100
I max RMS (A)
30 MHz
100 MHz
500 MHz
I max RMS (A)
30 MHz
100 MHz
500 MHz
10
10
1
1
10
1
Capacitance (pF)
100
1,000
10,000
1
10
Capacitance (pF)
100
1,000
10,000
2225: TYPICAL SERIES RESONANCE FREQUENCY VERSUS CAPACITANCE
10,000
Frequency (MHz)
1,000
100
1
10
Capacitance (pF)
100
1,000
Note 1:
• For capacitance values less than 10pF, tolerances B, C and D available.
• For capacitance values equal to or higher than 10pF, tolerances F, G, J and K available.
Note 2:
• All terminations are backward compatible and lead-free
• The non-magnetic terminations are all Magnetism-free Rated
Note 3: when coding ribbons or leads for the description of the part, the termination has
to be mentioned for MR certified types to ensure that only non-magnetic materials are
used.
Note 4: Ribbon lead styles capacitors are not available in Tape and Reel.
Please consult us for specific requirements.
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RF CAPACITORS
Examples:
362 CLE 470 J1L any termination material could be used
362 CLE 470 JC1L only non-magnetic termination materials could be used
CERAMIC CAPACITORS
General Information
Taping : dimensions
CAPACITOR TERMINATIONS AND SOLDERING
RECOMMENDATIONS
I. TERMINATION TYPES
Our capacitors are delivered with one of the following terminations (for
technical reasons, only a limited number of termination types are available in
certain cases). All our terminations are backward compatible.
Parameter
Termination
Materials
Value
A
C
S
Comment
non-magnetic (silver-palladium)
non-magnetic (pure tin over copper barrier)
lead-free (pure tin over nickel barrier)
condition. The vapor phase and IR reflow soldering are less aggressive,
inducing more restricted thermal shocks. This is the reason why they are
preferred to the wave soldering method for reliable applications. In all cases,
proper pre-heating is essential.
The circuit should be pre-heated at a typical rate of 1°C/s within 65°C to 100°C of
the maximum soldering temperature. While multilayer ceramic capacitors can
withstand the peak soldering temperatures for short durations, they should be
minimized whenever possible.
Above precaution given for SMD types are applicable for the implementation
of large bare chips (1515 and above). But in general, large bare chips above
2225 are not recommended to be mounted on epoxy printed board due to the
thermal expansion mismatch between ceramic capacitor body and epoxy. This
is the reason why leaded components will be preferred especially for reliable
applications.
For information, the typical thermal profiles of these three soldering processes
are given hereafter. These typical diagrams are only given as an aid to SMD
users in determining specific processes linked to their instrumentations and
to their own experience.
NB: reference documents are IEC 61760-1, CECC30000 and IEC68 standards.
Please, refer to this standard for more information.
NB:
• terminations type C recommended for non magnetic applications.
• termination type A available for non magnetic applications (for historical
reason, we have also another code, the code “P”, for the same type of
termination. The parts that were designed-in before 2005 might still have
a code “P” instead of “A” in the part numbering. But both codes correspond
to the same type of termination).
II. SPECIFICATIONS
Care must be taken when using particular terminations: if the terminations are
heated up above a particular temperature and/or for too long a period of time,
there is a risk of leaching (dissolution of the termination revealing the inner
electrodes).
The chart below gives the resistance to soldering heat per termination type,
based on a SAC387 solder bath at 260°C.
Dielectric Type
CHA / SHA
CHB / SHB
CPX / CLX / CPE / CLE
CLF
SHL
SHS
SHF / SHN / SHT
5
±1s
(2)
10
±1s
(4)
10
±2s
(1)
A
C
10
±1s
(3)
30
±2s
30
±2s
On request
S
120
±5s
120
±5s
120
±5s
120
±5s
120
±5s
120
±5s
120
±5s
III.1.1. Vapour Phase Soldering
250°C
230°C
217°C
200°C
20s ... 40s
ca. 60s ... 130s
>217°C
Ramp down
rate <6K/s
150°C
100°C
Ramp up
rate <3K/s
50°C
0°C
0s
20s
40s 60s
80s 100s 120s 140s 160s 180s 200s 220s 240s
Lead free SnAgCu solders - Vapour Phase
250°C
210°C
20s ... 40s
(1): results extrapolated from 30±2s data obtained with Sn62/Pb36/Ag2 solder bath.
(2): data obtained with Sn62/Pb36/Ag2 solder bath.
(3): termination only available on CHA series.
(4): preliminary data.
200°C
180°C
150°C
ca. 60s ... 150s
<180°C
Ramp down
rate <6K/s
Ramp up
rate <3K/s
100°C
III. STANDARD SMD REQUIREMENTS
III.1. Soldering Recommendations
Regarding the soldering attachments, three methods are generally used: the
vapor phase soldering, the infrared reflow soldering and the wave soldering.
Unless particular skill about the use of the wave soldering, this method is not
recommended since the melted solder is directly in contact with the ceramic.
This can potentially crack the capacitor because the ceramic is sensible to the
thermal shocks. Moreover, this method needs to maintain the components
with an insulating resin which increases the thermo-mechanical strains
between the ceramic and the board both on soldering phase and operating
50°C
0°C
0s
20s
40s 60s
80s 100s 120s 140s 160s 180s 200s 220s 240s
SnPb solders – Infrared Soldering
NB: the lines indicate the upper and lower limits of typical process (terminal
temperature).
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Microchip MCU
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