RNS Series
Ultra Miniature Metal Film Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Features:
•
•
•
•
•
Miniature metal film for tight size constraints
Superior electrical, TCR performances
Flame-retardant coatings are standard
1/2-watt in standard 1/8-watt package, 1-watt part in
1/4-watt package, 2-watt part in 1/2-watt package
RoHS compliant
Electrical Specifications
Type / Code
RNS 1/2
Power Rating
(Watts) @ 70ºC
0.5W
Maximum
Working
Voltage1
200V
Maximum
Pulse
Voltage
400V
Resistance Temperature Coefficient
±50 ppm/ºC
±100 ppm/ºC
±25 ppm/ºC
±50 ppm/ºC
±100 ppm/ºC
±25 ppm/ºC
±50 ppm/ºC
±100 ppm/ºC
Ohmic Range (Ω) and Tolerance
0.5%
10 - 1M
1%
4.99 - 1M
RNS 1
1.0W
350V
600V
100 - 511K
10 - 1M
RNS 2
2.0W
350V
700V
100 - 511K
10 - 1M
1Lesser
of√PR or maximum working voltage
Please refer to the High Power Resistor Application Note (page 3) for more information on designing and implementing
high power resistor types.
Mechanical Specifications
Type / Code
RNS 1/2
RNS 1
RNS 2
A
Body Length
0.13 ± 0.01
3.40 ± 0.40
0.26 ± 0.02
6.50 ± 0.50
0.35 ± 0.02
9.00 ± 0.50
B
Body Diameter
0.07 ± 0.01
1.80 ± 0.30
0.09 ± 0.006
2.30 ± 0.20
0.14 ± 0.02
3.50 ± 0.50
C
Lead Length (Bulk)
1.10 ± 0.08
28.0 ± 2.0
1.10 ± 0.08
28.0 ± 2.0
1.10 ± 0.08
28.0 ± 2.0
D
Lead Diameter
0.017 ± 0.002
0.43 ± 0.05
0.022 ± 0.002
0.56 ± 0.05
0.31 ± 0.004
0.80 ± 0.10
Units
inches
mm
inches
mm
inches
mm
Operating Temperature Range: -55ºC to +155ºC
Performance Characteristics
Test
Biased Humidity
Resistance to Solder Heat
Insulation Resistance
Load Life
Terminal Strength
Temperature Cycling
Moisture Resistance
Standard / Method
MIL-STD 202, Method 103
MIL-STD 202, Method 210
JIS C 5202 5.6
MIL-STD 202, Method 208
MIL-STD 202, Method 211
JESD22 Method JA-104
MIL-STD 202, Method 106
Requirement
± 1.5%
± 0.5%
± 0.5%
± 1.0%
± 0.2%
± 1.0%
± 0.5%
Rev Date: 02/11/2011
This specification may be changed at any time without prior notice.
Please confirm technical specifications before you order and/or use.
1
www.seielect.com
marketing@seielect.com
RNS Series
Ultra Miniature Metal Film Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
High Power Chip Resistors and Thermal Management
Stackpole has developed several surface mount resistor series in addition to our current sense resistors,
which have had higher power ratings than standard resistor chips. This has caused some uncertainty and
even confusion by users as to how to reliably use these resistors at the higher power ratings in their designs.
The data sheets for the RHC, RMCP, RNCP, CSR, CSRN, CSRF, CSS, and CSSH state that the rated
power assumes an ambient temperature of no more than 100 degrees C for the CSS / CSSH series and 70
degrees C for all other high power resistor series. In addition, IPC and UL best practices dictate that the
combined temperature on any resistor due to power dissipated and ambient air shall be no more than 105C.
At first glance this wouldn’t seem too difficult, however the graph below shows typical heat rise for the CSR
½ 100 milliohm at full rated power. The heat rise for the RMCP and RNCP would be similar. The RHC with
its unique materials, design, and processes would have less heat rise and therefore would be easier to
implement for any given customer.
CSR 1/2 100m Surface Temp Rise
120
Test equipment:
Chroma Programmable DC Power supply
YF-162 TYPE--K thermometer
100
102
80
72
℃ 60
36
41
50
35
40
20
0
0.10
0.13
0.17
Power Rating
0.25
0.50
0.75
The 102 degrees C heat rise shown here would indicate there will be additional thermal reduction techniques
needed to keep this part under 105C total hot spot temperature if this part is to be used at 0.75 watts of
power. However, this same part at the usual power rating for this size would have a heat rise of around 72
degrees C. This additional heat rise may be dealt with using wider conductor traces, larger solder pads and
land patterns under the solder mask, heavier copper in the conductors, vias through PCB, air movement, and
heat sinks, among many other techniques. Because of the variety of methods customers can use to lower
the effective heat rise of the circuit, resistor manufacturers simply specify power ratings with the limitations
on ambient air temperature and total hot spot temperatures and leave the details of how to best accomplish
this to the design engineers. Design guidelines for products in various market segments can vary widely so it
would be unnecessarily constraining for a resistor manufacturer to recommend the use of any of these
methods over another.
Note:
The final resistance value can be affected by the board layout and assembly process, especially the size of the
mounting pads and the amount of solder used. This is especially notable for resistance values
≤
50 mΩ.
This should be taken into account when designing.
Rev Date: 02/11/2011
This specification may be changed at any time without prior notice.
Please confirm technical specifications before you order and/or use.
3
www.seielect.com
marketing@seielect.com
FPGA/CPLD
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