C0G (NP0) Dielectric
General Specifications
C0G (NP0) is the most popular formulation of the “tempera-
ture-compensating,” EIA Class I ceramic materials. Modern
C0G (NP0) formulations contain neodymium, samarium and
other rare earth oxides.
C0G (NP0) ceramics offer one of the most stable capacitor
dielectrics available. Capacitance change with temperature
is 0 ±30ppm/°C which is less than ±0.3%
∆
C from -55°C
to +125°C. Capacitance drift or hysteresis for C0G (NP0)
ceramics is negligible at less than ±0.05% versus up to
±2% for films. Typical capacitance change with life is less
than ±0.1% for C0G (NP0), one-fifth that shown by most
other dielectrics. C0G (NP0) formulations show no aging
characteristics.
The C0G (NP0) formulation usually has a “Q” in excess
of 1000 and shows little capacitance or “Q” changes with
frequency. Their dielectric absorption is typically less than
0.6% which is similar to mica and most films.
PART NUMBER (see page 2 for complete part number explanation)
0805
Size
(L" x W")
5
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
A
Dielectric
C0G (NP0) = A
101
J
A
Failure
Rate
A = Not
Applicable
T
2
A
Special
Code
A = Std.
Product
Capacitance Capacitance
Code (In pF)
Tolerance
2 Sig. Digits +
B = ±.10 pF
Number of
C = ±.25 pF
Zeros
D = ±.50 pF
Terminations
Packaging
2 = 7" Reel
T = Plated Ni
4 = 13" Reel
and Sn
7 = Gold Plated 7 = Bulk Cass.
9 = Bulk
F
G
J
K
=
=
=
=
±1% (≥ 25 pF)
±2% (≥ 13 pF)
±5%
±10%
Contact
Contact
Factory For
Factory
1 = Pd/Ag Term
For
Multiples
Insulation Resistance (Ohm-Farads)
Temperature Coefficient
Typical Capacitance Change
Envelope: 0
±
30 ppm/°C
Capacitance vs. Frequency
+2
Insulation Resistance vs Temperature
10,000
Capacitance
Capacitance
+1
0
-1
-2
1,000
+0.5
0
-0.5
100
%
%
-55 -35 -15 +5 +25 +45 +65 +85 +105 +125
1KHz
10 KHz
100 KHz
1 MHz
10 MHz
0
0
20
40
60
80
100
Temperature
°C
Variation of Impedance with Cap Value
Impedance vs. Frequency
0805 - C0G (NP0)
10 pF vs. 100 pF vs. 1000 pF
100,000
Frequency
Variation of Impedance with Chip Size
Impedance vs. Frequency
1000 pF - C0G (NP0)
10
1206
0805
1812
1210
1.0
10.00
Temperature
°C
Variation of Impedance with Ceramic Formulation
Impedance vs. Frequency
1000 pF - C0G (NP0) vs X7R
0805
X7R
NPO
10,000
100
10.0
10 pF
Impedance,
1000
Impedance,
1,000
Impedance,
1.00
0.10
1.0
0.1
1
10
100
100 pF
1000 pF
1000
0.1
10
100
Frequency, MHz
0.01
10
100
1000
Frequency, MHz
Frequency, MHz
4
C0G (NP0) Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Q
Insulation Resistance
Dielectric Strength
Appearance
Capacitance
Variation
Q
Insulation
Resistance
Solderability
Appearance
Capacitance
Variation
Resistance to
Solder Heat
Q
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Q
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Q
(C=Nominal Cap)
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Load
Humidity
Q
Insulation
Resistance
Dielectric
Strength
NP0 Specification Limits
-55ºC to +125ºC
Within specified tolerance
<30 pF: Q≥ 400+20 x Cap Value
≥30
pF: Q≥ 1000
100,000MΩ or 1000MΩ - µF,
whichever is less
No breakdown or visual defects
No defects
±5% or ±.5 pF, whichever is greater
Meets Initial Values (As Above)
≥
Initial Value x 0.3
≥
95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
≤
±2.5% or ±.25 pF, whichever is greater
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
≤
±2.5% or ±.25 pF, whichever is greater
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
≤
±3.0% or ± .3 pF, whichever is greater
≥
30 pF:
≥10
pF, <30 pF:
<10 pF:
Q≥ 350
Q≥ 275 +5C/2
Q≥ 200 +10C
Charge device with twice rated voltage in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0).
Remove from test chamber and stabilize at
room temperature for 24 hours
before measuring.
Step 1: -55ºC ± 2º
Step 2: Room Temp
Step 3: +125ºC ± 2º
Step 4: Room Temp
30 ± 3 minutes
≤
3 minutes
30 ± 3 minutes
≤
3 minutes
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
90 mm
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 MHz ± 10% for cap
≤
1000 pF
1.0 kHz ± 10% for cap > 1000 pF
Voltage: 1.0Vrms ± .2V
Charge device with rated voltage for
60 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Resistance to
Flexure
Stresses
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
Thermal
Shock
Repeat for 5 cycles and measure after
24 hours at room temperature
Load Life
≥
Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
≤
±5.0% or ± .5 pF, whichever is greater
≥
30 pF:
≥10
pF, <30 pF:
<10 pF:
Q≥ 350
Q≥ 275 +5C/2
Q≥ 200 +10C
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature for 24 ± 2 hours
before measuring.
≥
Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
5
C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
L) Length
(W) Width
(t) Terminal
WVDC
Cap
(pF)
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
Cap
0.010
(µF)
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC
MM
(in.)
MM
(in.)
MM
(in.)
0201
Reflow Only
All Paper
0.60 ± 0.03
(0.024 ± 0.001)
0.30 ± 0.03
(0.011 ± 0.001)
0.15 ± 0.05
(0.006 ± 0.002)
10
16
25
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
0402
Reflow Only
All Paper
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
25
50
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
0603
Reflow/Wave
All Paper
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
25
50
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
0805
Reflow/Wave
Paper/Embossed
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25
50
100
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
J
E
E
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
J
M
N
N
N
N
1206
Reflow/Wave
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25
50
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
J
M
M
J
M
P
J
M
P
J
M
P
J
M
P
J
M
P
J
M
M
M
M
M
M
16
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
6.3
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
L
W
T
16
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
t
10
16
25
16
25
50
6.3
25
50
100
16
25
50
100
200
16
25
50
100
200
SIZE
Letter
Max.
Thickness
A
0.33
(0.013)
0201
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
0402
G
0.86
(0.034)
J
0.94
(0.037)
K
1.02
(0.040)
0603
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
0805
Q
X
1.78
2.29
(0.070)
(0.090)
EMBOSSED
Y
2.54
(0.100)
Z
2.79
(0.110)
1206
BB
3.05
(0.120)
CC
3.175
(0.125)
Contact Factory for Multiples
6
C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
(W) Width
(t) Terminal
WVDC
Cap
(pF)
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
Cap
0.010
(µF)
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC
MM
(in.)
MM
(in.)
MM
(in.)
25
1210
Reflow/Wave
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
50
100
1812
Reflow Only
All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
1825
Reflow Only
All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
200
2220
Reflow Only
All Embossed
5.70 ± 0.40
(0.224 ± 0.016)
5.00 ± 0.40
(0.197 ± 0.016)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
2225
Reflow Only
All Embossed
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
200
200
25`
200
200
L
W
T
t
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
J
J
J
J
J
J
J
M
M
M
M
M
M
M
J
J
J
J
M
M
M
Q
Q
25
50
100
200
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
CC
CC
CC
CC
25
K
K
K
K
K
K
K
K
K
M
M
P
P
P
P
P
CC
CC
CC
CC
CC
CC
CC
CC
50
K
K
K
K
K
K
K
K
K
M
M
X
X
X
X
K
K
K
K
K
P
P
P
P
P
X
X
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
P
P
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
100
200
50
100
200
50
100
200
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
50
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
Y
Y
Y
Y
P
P
P
P
P
P
P
P
P
P
P
P
P
P
Y
Y
Y
Y
Y
Y
100
200
SIZE
Letter
Max.
Thickness
A
0.33
(0.013)
C
0.56
(0.022)
1210
E
0.71
(0.028)
PAPER
G
0.86
(0.034)
J
0.94
(0.037)
1812
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
1825
P
1.52
(0.060)
Q
X
1.78
2.29
(0.070)
(0.090)
EMBOSSED
2220
Y
2.54
(0.100)
Z
2.79
(0.110)
2225
BB
3.05
(0.120)
CC
3.175
(0.125)
Contact Factory for Multiples
7
High Voltage Chips
For 500V to 5000V Applications
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chips capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/DC blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to
make high voltage chips. These larger sizes require that special pre-
cautions be taken in applying these chips in surface mount assem-
blies. This is due to differences in the coefficient of thermal expansion
(CTE) between the substrate materials and chip capacitors. Apply heat
at less than 4°C per second during the preheat. Maximum preheat
temperature must be within 50°C of the soldering temperature.
The solder temperature should not exceed 230°C. Chips 1808 and
larger to use reflow soldering only.
Capacitors with X7R Dielectrics are not intended for AC line filtering
applications.
Contact plant for recommendations. Capacitors may require protective
surface coating to prevent external arcing.
PART NUMBER (see page 2 for complete information and options)
1808
A
A
271
K
A
1
1A
AVX
Style
1206
1210
1808
1812
1825
2220
2225
3640
Voltage
7
=
500V
C
=
600V
A
=
1000V
S
=
1500V
G
=
2000V
W
=
2500V
H
=
3000V
J
=
4000V
K
=
5000V
Temperature Capacitance Capacitance
Failure
Coefficient
Code
Tolerance
Rate
(2 significant digits
C0G: J = ±5%
A = C0G
A=Not
+ no. of zeros)
K = ±10% Applicable
C = X7R
Examples:
M = ±20%
10 pF = 100 X7R: K = ±10%
100 pF = 101
M = ±20%
1,000 pF = 102
Z = +80%,
22,000 pF = 223
-20%
220,000 pF = 224
1 µF = 105
Termination
1= Pd/Ag
T = Plated Ni
and Solder
Packaging/Marking
1A = 7" Reel
Unmarked
3A = 13" Reel
Unmarked
9A = Bulk/Unmarked
W
L
T
t
DIMENSIONS
SIZE
(L) Length
(W) Width
(T) Thickness
Max.
(t) terminal
1206
1210
1808*
1812*
1825*
2220*
millimeters (inches)
2225*
3640*
3.20 ± 0.2
3.20 ± 0.2
4.57 ± 0.25
4.50 ± 0.3
4.50 ± 0.3
5.7 ± 0.4
5.72 ± 0.25
9.14 ± 0.25
(0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
1.60 ± 0.2
2.50 ± 0.2
2.03 ± 0.25
3.20 ± 0.2
6.40 ± 0.3
5.0 ± 0.4
6.35 ± 0.25
10.2 ± 0.25
(0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
1.52
1.70
2.03
2.54
2.54
3.3
2.54
2.54
(0.060)
(0.067)
(0.080)
(0.100)
(0.100)
(0.130)
(0.100)
(0.100)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.76 (0.030)
0.75 (0.030)
0.75 (0.030)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.52 (0.060)
min.
max.
*Reflow Soldering Only
39
嵌入式系统
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