Revision 1
Automotive ProASIC3 Flash Family FPGAs
Features and Benefits
High-Temperature AEC-Q100–Qualified Devices
• Grade 2 105°C T
A
(115°C T
J
)
• Grade 1 125°C T
A
(135°C T
J
)
• PPAP Documentation
®
Low Power
• 1.5 V Core Voltage
• Support for 1.5-V-Only Systems
• Low-Impedance Flash Switches
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
• High-Performance, Low-Skew Global Network
• Architecture Supports Ultra-High Utilization
Firm-Error Immune
• Only Automotive FPGAs to Offer Firm-Error Immunity
• Can Be Used without Configuration Upset Risk
Advanced I/O
•
•
•
•
•
•
•
•
•
•
•
700 Mbps DDR, LVDS-Capable I/Os
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages—up to 4 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS
2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS (A3P250 and A3P1000)
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold-Sparing I/Os
Programmable Output Slew Rate and Drive Strength
Weak Pull-Up/-Down
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages across the Automotive ProASIC
®
3
Family
High Capacity
• 60 k to 1 M System Gates
• Up to 144 kbits of SRAM
• Up to 300 User I/Os
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Automotive Process
• Live-at-Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• Retains Programmed Design when Powered Off
On-Chip User Nonvolatile Memory
• 1 kbit of FlashROM with Synchronous Interface
High Performance
• 350 MHz System Performance
• 3.3 V, 66 MHz 64-Bit PCI
Clock Conditioning Circuit (CCC) and PLL
• Six CCC Blocks, One with an Integrated PLL
• Configurable Phase Shift, Multiply/Divide, Delay Capabilities,
and External Feedback
• Wide Input Frequency Range (1.5 MHz up to 350 MHz)
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE 1532–compliant)
• FlashLock
®
to Secure FPGA Contents (anti-tampering)
SRAMs
• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
Table 1 • Automotive ProASIC3 Product Family
ProASIC3 Devices
System Gates
VersaTiles (D-flip-flops)
RAM kbits (1,024 bits)
4,608-Bit Blocks
FlashROM Bits
Secure (AES) ISP
Integrated PLL in CCCs
VersaNet Globals1
I/O Banks
Maximum User I/Os
Package Pins
VQFP
FBGA
QFN
2
A3P060
60 k
1,536
18
4
1k
Yes
1
18
2
96
VQ100
FG144
A3P125
125 k
3,072
36
8
1k
Yes
1
18
2
133
VQ100
FG144
QNG132
A3P250
250 k
6,144
36
8
1k
Yes
1
18
4
157
VQ100
FG144, FG256
QNG132
A3P1000
1M
24,576
144
32
1k
Yes
1
18
4
300
FG144, FG256, FG484
Notes:
1. Six chip-wide (main) globals and three additional global networks in each quadrant are available.
2. QFN packages are available as RoHS compliant only.
December 2009
© 2010 Actel Corporation
I
Automotive ProASIC3 Flash Family FPGAs
I/Os Per Package
ProASIC3 Devices
A3P060
A3P125
A3P250
I/O Type
Single-Ended I/O
2
Single-Ended I/O
2
Single-Ended I/O
Single-Ended I/O
A3P1000
Differential
I/O Pairs
Package
VQ100
FG144
FG256
FG484
QNG132
71
96
–
–
–
71
97
–
–
84
68
97
157
–
87
13
24
38
–
19
–
97
177
300
–
Notes:
1. When considering migrating your design to a lower- or higher-density device, refer to the
ProASIC3 FPGA Fabric User’s Guide
to ensure complying with design and board migration requirements.
2. Each used differential I/O pair reduces the number of available single-ended I/Os by two.
3. FG256 and FG484 are footprint-compatible packages.
Automotive ProASIC3 Device Status
Automotive ProASIC3 Devices
A3P060
A3P125
A3P250
A3P1000
Status
Production
Production
Production
Production
II
R ev i si o n 1
Differential
I/O Pairs
–
25
44
74
–
Automotive ProASIC3 Flash Family FPGAs
Automotive ProASIC3 Ordering Information
A3P1000
_
1
FG
G
144
T
Application (Temperature Range)
T = Grade 2 and Grade 1 AECQ100
Grade 2 = 105°C T
A
and 115°C T
J
Grade 1 = 125°C T
A
and 135°C T
J
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS-Compliant (Green) Packaging
Package Type
VQ = Very Thin Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
QN = Quad Flat Pack (0.5 mm pitch)
Speed Grade
Blank = Standard
1 = 15% Faster than Standard
Part Number
Automotive ProASIC3 Devices
A3P060 = 60,000 System Gates
A3P125 = 125,000 System Gates
A3P250 = 250,000 System Gates
A3P1000 = 1,000,000 System Gates
Note:
Minimum order quantities apply. Contact your local Actel sales office for details.
R e visi on 1
III
Automotive ProASIC3 Flash Family FPGAs
Temperature Grade Offerings
Package
VQ100
FG144
FG256
FG484
QNG132
A3P060
C, I, T
C, I, T
–
–
–
A3P125
C, I, T
C, I, T
–
–
C, I, T
A3P250
C, I, T
C, I, T
C, I, T
–
C, I, T
A3P1000
–
C, I, T
C, I, T
C, I, T
–
Notes:
1. C = Commercial temperature range: 0°C to 70°C
2. I = Industrial temperature range: –40°C to 85°C
3. T = Automotive temperature range: Grade 2 and Grade 1 AEC-Q100
Grade 2 = 105°C T
A
and 115°C T
J
Grade 1 = 125°C T
A
and 135°C T
J
4. Specifications for Commercial and Industrial grade devices can be found in the
ProASIC3 Flash Family FPGAs
datasheet.
Speed Grade and Temperature Grade Matrix
Temperature Grade
T (Grade 1 and Grade 2), Commercial, Industrial
Std.
–1
✓
✓
Notes:
1. T = Automotive temperature range: Grade 2 and Grade 1 AEC-Q100
Grade 2 = 105°C T
A
and 115°C T
J
Grade 1 = 125°C T
A
and 135°C T
J
2. Specifications for Commercial and Industrial grade devices can be found in the
ProASIC3 Flash Family FPGAs
datasheet.
Contact your local Actel representative for device availability:
http://www.actel.com/contact/default.aspx.
IV
R ev i si o n 1
Automotive ProASIC3 Flash Family FPGAs
Table of Contents
Automotive ProASIC3 Device Family Overview
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Automotive ProASIC3 DC and Switching Characteristics
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12
VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-69
Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-75
Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-80
Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-82
Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-97
JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-98
Package Pin Assignments
100-Pin VQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
132-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
144-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
256-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
484-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
Actel Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
Revision 1
V
聊聊、笑笑、闹闹
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
