board eval for ltc3405es6
| DC422A-A | LTC3405ES6#TR | LTC3405ES6#TRPBF | DC422A-B | LTC3405ES6#TRMPBF | LTC3405ES6#TRM | |
|---|---|---|---|---|---|---|
| 描述 | board eval for ltc3405es6 | IC reg bck sync adj 0.3A sot23-6 | IC reg bck sync adj 0.3A sot23-6 | board eval for ltc3405es6 | IC REG BCK ADJ 0.3A SYNC SOT23-6 | IC REG BCK ADJ 0.3A SYNC SOT23-6 |
| Brand Name | - | Linear Technology | Linear Technology | - | Linear Technology | Linear Technology |
| 是否Rohs认证 | - | 不符合 | 符合 | - | 符合 | 不符合 |
| 厂商名称 | - | Linear ( ADI ) | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | - | SOT | SOT | - | SOT | SOT |
| 包装说明 | - | TSSOP, TSOP6,.11,37 | TSSOP, TSOP6,.11,37 | - | TSSOP, TSOP6,.11,37 | TSSOP, TSOP6,.11,37 |
| 针数 | - | 6 | 6 | - | 6 | 6 |
| 制造商包装代码 | - | S6 | S6 | - | S6 | S6 |
| Reach Compliance Code | - | _compli | compli | - | compliant | not_compliant |
| ECCN代码 | - | EAR99 | EAR99 | - | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | - | SWITCHING REGULATOR | SWITCHING REGULATOR | - | SWITCHING REGULATOR | SWITCHING REGULATOR |
| 控制模式 | - | CURRENT-MODE | CURRENT-MODE | - | CURRENT-MODE | CURRENT-MODE |
| 控制技术 | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
| 最大输入电压 | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小输入电压 | - | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V |
| 标称输入电压 | - | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
| JESD-30 代码 | - | R-PDSO-G6 | R-PDSO-G6 | - | R-PDSO-G6 | R-PDSO-G6 |
| JESD-609代码 | - | e0 | e3 | - | e3 | e0 |
| 长度 | - | 2.9 mm | 2.9 mm | - | 2.9 mm | 2.9 mm |
| 湿度敏感等级 | - | 1 | 1 | - | 1 | 1 |
| 功能数量 | - | 1 | 1 | - | 1 | 1 |
| 端子数量 | - | 6 | 6 | - | 6 | 6 |
| 最高工作温度 | - | 70 °C | 70 °C | - | 70 °C | 70 °C |
| 最大输出电流 | - | 0.63 A | 0.63 A | - | 0.63 A | 0.63 A |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | TSSOP | - | TSSOP | TSSOP |
| 封装等效代码 | - | TSOP6,.11,37 | TSOP6,.11,37 | - | TSOP6,.11,37 | TSOP6,.11,37 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | - | 235 | 260 | - | 260 | 235 |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.08 mm | 1.08 mm | - | 1.08 mm | 1.08 mm |
| 表面贴装 | - | YES | YES | - | YES | YES |
| 切换器配置 | - | BUCK | BUCK | - | BUCK | BUCK |
| 最大切换频率 | - | 1800 kHz | 1800 kHz | - | 1800 kHz | 1800 kHz |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | - | Matte Tin (Sn) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | GULL WING | GULL WING | - | GULL WING | GULL WING |
| 端子节距 | - | 0.95 mm | 0.95 mm | - | 0.95 mm | 0.95 mm |
| 端子位置 | - | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 20 | 30 | - | 30 | 20 |
| 宽度 | - | 1.625 mm | 1.625 mm | - | 1.625 mm | 1.625 mm |
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