电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CCDNPO001C1K05633BLF

产品描述Ceramic Capacitor, Ceramic, 1000V, 25% +Tol, 25% -Tol, NP0, -/+60ppm/Cel TC, 0.000001uF,
产品类别无源元件    电容器   
文件大小279KB,共7页
制造商Arco Electronics
标准
下载文档 详细参数 全文预览

CCDNPO001C1K05633BLF概述

Ceramic Capacitor, Ceramic, 1000V, 25% +Tol, 25% -Tol, NP0, -/+60ppm/Cel TC, 0.000001uF,

CCDNPO001C1K05633BLF规格参数

参数名称属性值
是否Rohs认证符合
Objectid767391965
包装说明,
Reach Compliance Codeunknown
ECCN代码EAR99
电容0.000001 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度5.5 mm
长度5 mm
负容差25%
端子数量2
最高工作温度85 °C
最低工作温度-25 °C
封装形式Radial
包装方法Bulk
正容差25%
额定(直流)电压(URdc)1000 V
系列CCD
温度特性代码NP0
温度系数60ppm/Cel ppm/°C
端子节距6.35 mm

CCDNPO001C1K05633BLF文档预览

ARCO ELECTRONICS, LLC.
Ordering code
CCD
NPO
1
2
1.Type
TYPE
CCD:
C
eramic capacitor
CCE:
Epoxy coating
CERAMIC DISC CAPACITOR
2K
5
10
6
6.Size Code
0
7
Code
05
10
12
103
3
M
4
7
8
1
9
DIA(mm)
5
10
12
B
10
2.Temperature Characteristic
Code
TEMP. COEFF.
(PPM/°C)
Code
CAP. Change (%)
Code
005
010
221
Code
B
C
D
F
G
Code
1C
1E
1H
2A
2B
PF
5P
10P
220P
CAP. TOL.
±0.1PF
±0.25PF
±0.5PF
±1%
±2%
CAP. TOL.
16V
25V
50V
100V
250V
NPO (CH)
0±60
B
±10
SL
+350~-1000
7.Pitch
E
+22,-56
Code
222
103
104
Code
J
K
M
Z
P
Code
2H
1K
2K
3K
6K
F
+22,-82
PF
2200P
10000P
100000P
CAP. TOL.
±5%
±10%
±20%
+80-20%
+100-0%
CAP. TOL.
500V
1000V
2000V
3000V
6000V
Code
2
5
6
Code
3
5
7
1
3 max.(500V)
4max.(HI-VOLT)
3.Rated Capacitance
Pitch (mm)
2.5±0.8
5±0.8
6.35±0.8
Code
7
0
Pitch (mm)
7.52±0.8
9.5±0.8
8.Lead Length
Lead length (mm) Code Lead length(mm)
3±0.8
0
10±0.8
5±0.8
1
25±3
7±0.8
2
3
4
4.Capacitance Tolerance
9.Lead Style
1max.(50V)
5 max.
5 max.
5.Rated Voltage
23 min
23 min
L
F
10.Packing
Code
A
R
B
Type
Ammo Pack Taping
Reel Pack Taping
BULK
50/100V Series
W.V.
(DC)
NPO
(CH)
0.5~47
47 ~68
75~100
120~150
180~200
220~270
300~330
470
TEMP.Char./Capacitance range(PF)
SL
33~150
180~220
250~330
390
470~560
680~820
B
(Y5E)(Y5P)
100~2200
3300
3900
4700~6800
7500~10000
E
(Z5U)
1000~5000
5600~6800
7500~10000
20000~22000
F
(Z5V)
3300~10000
12000~22000
DIA
(mm)
5±1
6±1
7±1
8±1
9±1
10±1
12±1
14±1
50V/100V
500V Series
W.V.
(DC)
TEMP.Char./Capacitance range(PF)
NPO
(CH)
0.5~50
47 ~56
65~82
91~100
100~120
150~180
200~220
SL
10~68
82~100
120~150
180~220
390~470
680~820
900~1000
B
(Y5E)(Y5P)
100~680
820~1200
1500~1800
2000~2700
3000~3300
3900~5200
5600~6800
8200~10000
E
(Z5U)
1000~2200
2200~3300
3900~5000
5600~6800
8200~10000
12000~15000
18000~22000
F
(Z5V)
2000~2200
2200~4700
5000~6800
8200~10000
DIA
(mm)
5±1
6±1
7±1
8±1
9±1
10±1
12±1
14±1
16±1
500V
15000~22000
27000~47000
100000
Semi-Conductive Series
W.V.
(DC)
12V/16V
TEMP.Char./Capacitance range(PF)
B
(Y5P)
E
(Y5U)
100000
1000
47000
F
(Y5V)
100000
220000
10000~22000
100000
DIA
(mm)
6±1
8±1
3.5±1
5±1
6±1
6.5±1
7±1
8±1
10±1
3.5±1
4.5±1
5±1
6±1
8±1
10±1
12.5±1
25V
10000
22000
33000
47000
68000
100000
100000
50V/100V
10000
15000
22000
33000~47000
100000
10000
22000
33000~47000
100000
220000
10000~22000
47000
100000
Taping Dimensions
P
2
P
P
2
P
d
H
W
1
d
W
H
W
1
W
P
1
F
P
0
D
0
P
1
F
P
o
D
o
Formed Leads and Taping
Symbol
Dimensions
P
P
0
P
1
P
2
Units : mm(inch)
Remarks
Less than 2 mm of cumulative error per 20 pitches
12.7±1
(
0.500±0.039
)
12.7±0.3
(
0.500±0.012
)
3
.85±0.5
(
0.152±0.020
)
6
.35±1
(
0.250±0.039
)
F
W
W
1
H
ØD
0
Ød
5
±0.8
(
0.197±0.031
)
18±0.5
(
0.709-0.020
)
9
±0.5
(
0.354-0.020
)
20+1.5-1.0
(
0.787+0.059-0.039
)
4
±2
(
0.157±0.008
)
0.6+0.06-0.05(
0.024+0.002-0.002
)
AMMO-PACK
340max
REEL-PACK
cassette
55max
30 1mm
240max
Reel
370mm max
RELIABILITY DATA
No
ITEM
.
1
Operating
CLASS I
-25°C~+85°C
CLASS II
CLASS III
Measuring Condition
B
:-
25°C~+85°C
F: -25°C~+85°C
(Y5V)
E&F
:
-25°C~+85°C
Retain the sample for 30 minutes at the temperature
specified below in the sequence listed in the table. Then
measure the capacitance in each step after thermal
equilibrium at each temperature is reached.
Step1
Step2
Step3
Step4
Step5
Room Operating
Room
Operating Room
Temp Temp(min)
Temp
Temp(min) Temp
25±2°C - 25±3°C 25±2°C
85±2°C
25±2°C
+10±2°C
Note that step fand2 do not apply for the SL characteristics.
Temperature Range
CH:0±60ppm/°C
Temperature
B:
±10%
SL:+350-1000ppm/°C
E:+22%-56%
2 Characteristics
F:+22%-82%
+22%
-82%
3 Capacitance
Within the specified tolerance
C≥30pF;Q≥1000
C<30pF;Q≥400+20·
c
B&E:tan
δ≤0.025
F: tan
δ≤0.05
F: tan
δ≤0.05
4 Q or Dissipation
Factor (tan
δ)
(
C is nominal capacitance)
5 Withstanding
Voltage
Insulation
6 Resistance
Shall be measured 25±2°C normal temperature
at the frequency and voltage
ClassI:1MHz±20%, 1±0.2Vrms
ClassII:1KHz±10%, 1±0.2Vrms
ClassIII:1KHz±20%, 0.5±0.05Vrms
No defects
Applied: Rated voltage
·3 (class I)
Rated voltage
·2.5 (class II)
Rated voltage
·2 (class III)
Duration:1 to 5 sec.
The charge/discharge current is less than 50mA.
More than 10GΩ or More than 1GΩ or
Apply rated voltage for
More than 10GΩ
200Ω·F, whichever is 20Ω·F, whichever is
25±2°C and 70% R.H. max.
less
less
1 minute at
16Vdc product: Measurement voltage is 25Vdc
Fix the capacitor, apply the tensile stress listed below
in the terminal extraction direction until the
designated value is reached. Then retain the capacitor
for 10±0.1 seconds as is.
Nominal wire diameter
0.5 mm 0.6 mm
Tensile stress
5N
10N
7
Pull Test
(Tensile stress)
Termination not to be broken or loosened
8 Solderability of
Leads
At least three-fourths of the immersed surface in the
Solder temperature:
230±5°C
circumference direction is covered with new solder.
Dipping: 3±0.5
sec
. (Flux shall be used)
±2.5% or ±0.25pF
The lead wire immersed in the melted solder
B : ±5%
F : ±30%
(Whichever is
1.5mm to 2mm from the capacitor body.
E : ±15%
(Y5V)
ΔC
greater)
CLASSI,II CLASSIII
F : ±20%
9
Resistance
to Solder
Solder temperature
350±10°C
260±5°C
Withstandi
No defects
Heat
Duration
3±0.5sec 5±0.5sec
ng voltage
Exterior
No abnormalities
±2.5% or ±0.25pF
(Whichever is
greater)
ΔC
B : ±5%
E : ±15%
F : ±20%
F
: ±30%
(Y5V)
The measurements after testing must be taken after
leaving the sample for 12 to 24 hours under normal
temperature and humidity conditions.
Fix the capacitor to the supporting jig in the same
manner and under the same conditions as(10).
Perform the five cycles according to the four heat
C≥30pF: Q≥1000
Q/D.F.
10 Thermal
shock
C<30pF:Q≥400+20
·
C
c is nominal capacitance
B&E:tan
δ≤0.025
F : tan
δ≤0.05
F : tan
δ≤0.05
(Y5V)
More than 10GΩ or
More than 10GΩ or
20Ω·F,whichever is less 20Ω·F,whichever is less
treatments listed in the following table.
Step 1
Step 2
Step 3
Step 4
I.R.
Withstandi
ng voltage
More than 10GΩ
No defects
No abnormalities
±5% or ±0.5pF
(Whichever is
greater)
C≥30pF: Q≥350
10pF<C<30pF:
Q≥275+5/2·C
C≤10pF: Q≥200+10·C
Exterior
ΔC
11
Moisture
resistance
Q/D.F.
Operating Room
Operating
Room
Temp(min) Temp
Temp(max) Temp
30±3
15
30±3
15
The measurements after testing must be taken after
leaving the sample for 12 to 24 hours under normal
temperature and humidity conditions.
B : ±10%
E : ±20%
F : ±30%
F
: ±30%
(Y5V)
Temperature:
40±2°C
Humidity 90 to 95% R.H.
Duration:500+24-0 Hrs.
The measurements after testing must be taken after
leaving the sample for 1 to 2 hours under normal
temperature and humidity conditions.
*
Perform a heat treatment at 40±2°C for 1
B&E:tan
δ≤0.05
F : tan
δ≤0.075
F : tan
δ≤0.075
(Y5V)
More than 1GΩ or
More than 500MΩ or
20Ω·F,whichever is less 10Ω·F,whichever is less
(steady
state)
I.R.
Withstandi
ng voltage
More than 1GΩ
No defects
No abnormalities
±5% or ±0.5pF
(Whichever is
greater)
C≥30pF: Q≥350
10pF<C<30pF:
Q≥275+5/2·C
Exterior
ΔC
12
High
Q/D.F.
hours. Remove and let sit for 1 to 2 hours at
normal temperature and humidity conditions.
Perform the initial measuremen
t
B : ±10%
E : ±20%
F : ±30%
F
: ±30%
(Y5V)
Applied Voltage:
Rated voltage·2(CLASSI,II)
Rated voltage·1.25(CLASSIII)
Temperature:
85±2°C
Duration:1000+48-0 Hrs.
Temperat
ure
loading
The charge/discharge current is less than 10mA
C≤10pF: Q≥200+10·C
The measurements after testing must be taken after
More than 1GΩ or
More than 500MΩ or
leaving the sample for 12 to 24 hours under normal
I.R.
More than 1GΩ
20Ω·F,whichever is less 10Ω·F,whichever is less
temperature and humidity conditions.
Withstandi
No defects
*
Perform a heat treatment at 85±2°C for 1
ng voltage
B&E:tan
δ≤0.05
F : tan
δ≤0.075
F : tan
δ≤0.075
(Y5V)
Exterior
No abnormalities
hours. Remove and let sit for 12 to 24 hours at
normal temperature and humidity conditions.
Perform the initial measuremen
t
1KV Series
W.V.
(DC)
TEMP.Char./Capacitance range(PF)
NPO
(CH)
1~10
12 ~33
39~50
56~68
79~90
100~120
150~180
200~220
SL
30~56
68~100
120~150
180~220
270~330
350~390
470~560
680~820
B
(Y5E)(Y5P)
100~470
500~1000
1500~1800
2000~2200
2700~3300
3900~4700
5000~6800
E
(Z5U)
1000~1200
1500~2200
2700~3300
3900~10000
8200~10000
12000
22000
F
(Z5V)
DIA
(mm)
5±1
6±1
7±1
8±1
9±1
10±1
11±1
12±1
14±1
20±1
1KV
4700
5000~10000
22000
22000
47000
2KV Series(Epoxy Coating)
TEMP.Char./Capacitance range(PF)
W.V.
(DC)
NPO
SL
B
E
(CH)
1~20
22 ~30
33~39
47~50
56~68
75~82
90~100
110~120
150
15~56
68~100
120~150
180
200~220
270~300
330
390
(Y5E)(Y5P)
100~470
560~1000
1200
1500
1800~2200
2700
3000~3300
3900
(Z5U)
1000~1200
1500~2200
2700~3300
3500~3900
4700~6800
8200~10000
F
(Z5V)
3300~3900
4700~5000
5600~6800
8200
10000
12000
DIA
(mm)
5±1
6±1
7±1
8±1
9±1
10±1
11±1
12±1
13±1
2KV
4700~5600
14±1
3KV Series(Epoxy Coating)
TEMP.Char./Capacitance range(PF)
W.V.
(DC)
NPO
SL
B
E
(CH)
1~18
20 ~30
33~39
47~56
62~68
75~82
90~100
110~120
150
15~47
50~68
82~100
120
150~180
200~220
270
300~330
(Y5E)(Y5P)
100~470
680~820
1000
1200
1500
1800
2000~2200
2700~3300
(Z5U)
1000~1200
1500
1800~2000
2200~2700
3000~6800
F
(Z5V)
1800~2200
2700~3300
3900
4700~5600
6800
8200
10000
DIA
(mm)
6±1
7±1
8±1
9±1
10±1
11±1
12±1
13±1
14±1
3KV
10000
6KV,10KV Series(Epoxy Coating)
TEMP.Char./Capacitance range(PF)
W.V.
(DC)
SL
B
5~22
27~39
47~68
82
100~120
150
(Y5E)(Y5P)
100~330
390~500
560~680
820
1000
1500
E
(Z5U)
1000
1500~2200
3300
DIA
(mm)
6±1.5
7±1.5
8±1.5
9±1.5
10±1.5
11±1.5
12±1.5
13±1.5
14±1.5
15±1.5
7±1.5
7±1.5
7±1.5
8±1.5
10±1.5
12±1.5
6KV
10KV
100~120
150~180
200~220
270~330
470~560
680
Temperature Dependency of Capacitance (Approx. Values)
FPGA对MCP2515的应用
各位学长、大神好, 学弟现在在做fpga的毕设课题,涉及到利用MCP2515的SPI口转CAN通讯,从而实现两个FPGA的数据通信。 有大神做过这方面的应用嘛?求一份最好是VHDL的例程 ......
张子铭 FPGA/CPLD
U盘进水了应该怎么处理,为什么?
那天听说@okhxyyo 的U盘进水了很着急,看到大家给出的主意就想搞清为什么要这样做,这样做的原理是什么,这不,在网上找到了这个: U盘自身不带电,掉进水里也不会发生短路,如能正确脱水,一 ......
eric_wang 聊聊、笑笑、闹闹
MSP430用户手册中Timer0_A3信号接线问题
比如输入引脚编号和输出引脚编号P1.1-3什么意思...
fdjk 微控制器 MCU
PCB元器件封装中如何按实际距离放置焊盘
请问下如何在PCB元器件封装中如何按实际距离放置焊盘,就像在CAD中画线一样? 谢谢...
chenxp2010 PCB设计
Winlnet下编程问题
这么一段程序,在模拟器上运行,想访问https类型的网址,但是到了HttpSendRequest函数时,总返回错误,请高手指点,下面是函数红色部分是出错的地方: void CwininetTestDlg::OnBnClickedBut ......
ATMEGA_007 嵌入式系统
Linux驱动培训
一、课程介绍 嵌入式Linux驱动程序成为进来嵌入式开发的热点,因为驱动程序担负着将嵌入式系统越来越复杂的硬件运转起来的能力。而且Linux内核代码量极大,其中有60%以上代码属于驱动程序,掌 ......
pipitu Linux开发

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 329  2698  1317  933  1953  7  55  27  19  40 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved