电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

395451

产品描述63/37 crysl 502 3% .032dia/21swg
产品类别工具与设备   
文件大小80KB,共2页
制造商Henkel
下载文档 选型对比 全文预览

395451在线购买

供应商 器件名称 价格 最低购买 库存  
395451 - - 点击查看 点击购买

395451概述

63/37 crysl 502 3% .032dia/21swg

文档预览

下载PDF文档
Technical Data Sheet
C502
December-2009
PRODUCT DESCRIPTION
C502 provides the following product characteristics:
Technology
Activity
Product Benefits
Solder wire - Cored
Medium
• No clean
• Clear residue
• Good wetting
• Fast soldering
• Mild odor
• Pb-free and SnPb alloys available
ROM1
Soldering
Copper, Brass and Nickel
IPC/J-STD-004
Classification
Application
Surface Finishes
Soldering Iron:
● Good results can be obtained using a range of tip
temperatures. However, the optimum tip temperature and
heat capacity required for a hand-soldering process is a
function of both soldering iron design and the nature of
the task.
● Care should be exercised to avoid unnecessarily high tip
temperatures for extensive periods of time.
● A high tip temperature may increase any tendency to flux
spitting and it may produce some residue darkening.
● The tip of the soldering iron should be properly tinned.
Severely contaminated soldering iron tips should be
cleaned with Multicore® Tip Tinner/Cleaner.
● Wipe the tip on a clean, damp sponge before re-tinning
with C502 wire.
Soldering Process:
1. Apply the soldering iron tip to the work surface. The iron
tip should contact both the base material and the lead at
the same time to heat both surfaces properly. It should
take no more than a fraction of a second to heat both
surfaces adequately.
2. Apply C502 flux cored wire to a part of the joint surface
away from the soldering iron and allow to form a joint
fillet. This will be virtually instantaneous. Do not apply
excessive solder to the joint as this will not improve joint
integrity and it will leave excess flux residues on the
surface.
3. Remove solder from the work piece and then remove the
iron tip.
4. The total process will be very rapid, depending upon
thermal mass, tip temperature, tip configuration and the
solderability of the surfaces to be joined.
5. The resin and flux systems are designed to leave
relatively low residues and to minimize residual activity.
This is achieved by ensuring some decomposition and
volatilization takes place during the soldering process
Cleaning:
C502 flux cored solder wire has been formulated to leave
amber flux residues and resist spitting and fuming. In most
industrial and consumer electronics applications, cleaning will
not be required. The product may, therefore, be used to
complement a no-clean wave soldering or reflow process or to
allow repairs to cleaned boards without the need for a second
cleaning process. In high-reliability applications, the residues
should be removed.
Should cleaning be required, this is best achieved using
SC-01™ cleaner.
C502 cored solder wire has been specially formulated to
complement no clean wave and reflow soldering processes.
C502 is also well suited for soldering applications requiring
high melting temperature alloys.
TYPICAL PROPERTIES
Solder Cored Wire
Alloys - Tin/lead
• SN63
• SN60
• SN62
• 96SC (SAC387)
• 97SC (SAC305)
• 99C (SnCu)
• 95A (SnSb)
• 96S (SnAg)
156 to 172 mg KOH/g
0.2%
2.7
Alloys - Lead Free
Acid Value
Halide content
Flux Content (%)
ALLOYS:
The alloys used in C502 cored solder wires conform to the
purity requirements of the common national and international
standards.
FLUX:
C502 solid flux is based on modified rosin and carefully
selected activators. In practice they exhibit a mild rosin odor
and leave a small quantity of clear residue.
DIRECTIONS FOR USE
Soldering with C502 does not require any special methods or
deviation from standard hand soldering practices.

395451相似产品对比

395451 397982 395465 386862 386851
描述 63/37 crysl 502 3% .032dia/21swg 63/37 crysl 502 3% .015dia/28swg 63/37 crysl 502 3% .064dia/16swg 63/37 crysl 502 2% .032dia/21swg 63/37 crysl 502 2% .022dia/24swg
听说stm32每一个芯片只有一个全球唯一的ID
上次在研讨会上,ST公司的专家说的,有没有人知道怎么读出这个ID。...
symphonia stm32/stm8
我们需要一个做TI DSP的高级硬件工程师
岗位职责:1.基于TI DSP的嵌入式设备系统方案设计。2.基于TI DSP的硬件电路原理设计。3.解决驱动程序开发中遇到的技术问题。4.FPGA系统方案的设计、开发与调试。5.器件选型,批量生产的可靠性分 ......
etrafficvision 求职招聘
wince 6.0 比 5.0的优越之处
相信有高手已经在做wince6.0了,想请问下,它比5.0有啥明显的好处? 增加了啥功能?有没有增加D3DM驱动? 开发效率驱动调试方面有啥提高?...
weiyingwu 嵌入式系统
有谁知道哪里能定制电机呢
有谁知道哪里能定制电机呢??需要BLDC,24V,3A电流,功率72W,额定转速8000~1WRPM,最大转矩0.07Nm。电机伸出轴长需要80mm。轴直径不小于5mm。带霍尔,1.5m导线。...
安_然 DSP 与 ARM 处理器
TI开发板的ICDI能否接出来仿真其它公司的M3?
说明书是有写可以接JTAG出来的(还自带个线)能否仿真STM32这样的芯片呢?...
luster 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 442  2098  1902  1455  1822  20  45  55  19  21 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved