Hermetically Sealed, Transistor
Output Optocouplers for Analog
and Digital Applications
Technical Data
4N55*
5962-87679
HCPL-553X
HCPL-653X
HCPL-257K
HCPL-655X
5962-90854
HCPL-550X
*See matrix for available extensions.
Features
• Dual Marked with Device
Part Number and DSCC
Drawing Number
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534, Class H and K
• Five Hermetically Sealed
Package Configurations
• Performance Guaranteed,
Over -55
°
C to +125
°
C
• High Speed: Typically
400 kBit/s
• 9 MHz Bandwidth
• Open Collector Output
• 2-18 Volt V
CC
Range
• 1500 Vdc Withstand Test
Voltage
• High Radiation Immunity
• 6N135, 6N136, HCPL-2530/
-2531, Function
Compatibility
• Reliability Data
• Analog Signal Ground
Isolation (see Figures 7, 8,
and 13)
• Isolated Input Line Receiver
• Isolated Output Line Driver
• Logic Ground Isolation
• Harsh Industrial
Environments
• Isolation for Test
Equipment Systems
improve the speed up to a
hundred times that of a conven-
tional phototransistor
optocoupler by reducing the
base-collector capacitance.
These devices are suitable for
wide bandwidth analog applica-
tions, as well as for interfacing
TTL to LSTTL or CMOS. Current
Transfer Ratio (CTR) is 9% mini-
mum at I
F
= 16 mA. The 18 V V
CC
Description
These units are single, dual and
quad channel, hermetically sealed
optocouplers. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either standard product or with
full MIL-PRF-38534 Class Level
H or K testing or from the
appropriate DSCC Drawing. All
devices are manufactured and
tested on a MIL-PRF-38534
certified line and are included in
the DSCC Qualified
Manufacturers List QML-38534
for Hybrid Microcircuits.
Each channel contains a GaAsP
light emitting diode which is
optically coupled to an integrated
photon detector. Separate
connections for the photodiodes
and output transistor collectors
Truth Table
(Positive Logic)
Input
On (H)
Off (L)
Output
L
H
Functional Diagram
Multiple Channel Devices
Available
V
CC
V
B
V
O
Applications
• Military and Space
• High Reliability Systems
• Vehicle Command, Control,
Life Critical Systems
• Line Receivers
• Switching Power Supply
• Voltage Level Shifting
GND
The connection of a 0.1
µ
F bypass capacitor between V
CC
and GND is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
capability will enable the designer
to interface any TTL family to
CMOS. The availability of the
base lead allows optimized gain/
bandwidth adjustment in analog
applications. The shallow depth
of the IC photodiode provides
better radiation immunity than
conventional phototransistor
couplers.
These products are also available
with the transistor base node
connected to improve common
mode noise immunity and ESD
susceptibility. In addition, higher
CTR minimums are available by
special request.
Package styles for these parts are
8 and 16 pin DIP through hole
(case outlines P and E respec-
tively), 16 pin DIP flat pack (case
outline F), and leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options, see Selection Guide
Table for details. Standard
Microcircuit Drawing (SMD)
parts are available for each
package and lead style.
Because the same functional die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are identical for all parts.
Occasional exceptions exist due
to package variations and
limitations and are as noted.
Additionally, the same package
assembly processes and materials
are used in all devices. These
similarities give justification for
the use of data obtained from one
part to represent other part’s
performance for die related
reliability and certain limited
radiation test results.
Selection Guide–Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
Agilent Part # & Options
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped
Butt Cut/Gold Plate
Gull Wing/Soldered
Class H SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
*JEDEC registered part.
16 Pin DIP
Through Hole
2
None
4N55*
4N55/883B
HCPL-257K
Gold Plate
Option #200
Option #100
Option #300
5962-
8767901EX
8767901EC
8767901EA
8767901UC
8767901UA
8767901TA
5962-
8767905KEX
8767905KEC
8767905KEA
8767905KUC
8767905KUA
8767905KTA
8 Pin DIP
Through Hole
1
None
HCPL-5500
HCPL-5501
HCPL-550K
Gold Plate
Option #200
Option #100
Option #300
5962-
9085401HPX
9085401HPC
9085401HPA
9085401HYC
9085401HYA
9085401HXA
5962-
9085401KPX
9085401KPC
9085401KPA
9085401KYC
9085401KYA
9085401KXA
8 Pin DIP
Through Hole
2
V
CC
GND
HCPL-5530
HCPL-5531
HCPL-553K
Gold Plate
Option #200
Option #100
Option #300
5962-
8767902PX
8767902PC
8767902PA
8767902YC
8767902YA
8767902XA
5962-
8767906KPX
8767906KPC
8767906KPA
8767906KYC
8767906KYA
8767906KXA
16 Pin Flat Pack
Unformed Leads
4
V
CC
GND
HCPL-6550
HCPL-6551
HCPL-655K
Gold Plate
20 Pad LCCC
Surface Mount
2
None
HCPL-6530
HCPL-6531
HCPL-653K
Solder Pads
5962-
8767904FX
8767904FC
5962-
87679032X
87679032A
5962-
8767908KFX
8767908KFC
5962-
8767907K2X
8767907K2A
3
8 Pin Ceramic DIP Single
Channel Schematic
ANODE
2
+
I
F
I
CC
8
I
B
I
O
7
6
V
CC
V
B
V
O
V
F
CATHODE
–
3
5
GND
Note base pin 7.
Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
1
V
B1
V
CC1
V
O1
GND
16
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
1
16
20 Pad LCCC
Surface Mount
2 Channels
15 14
V
CC2
19
20
V
B2
V
O2
GND
2
V
O1
GND
1
V
CC1
13
12
1
2
3
4
15
V
CC
V
B
V
OUT
8
1
V
CC
V
O1
V
O2
8
2
V
CC
V
O1
V
O2
V
O3
V
O4
GND
15
14
2
14
7
6
5
2
3
4
7
3
3
13
6
4
13
2
3
10
4
5
V
B2
V
CC2
GND
V
O2
12
GND
GND
5
5
12
V
B1
9
7
8
6
7
8
11
10
9
6
7
8
11
10
9
Note:
8 pin DIP and flat pack devices have common V
CC
and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages
have isolated channels with separate V
CC
and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
8.13 (0.320)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
4
Leaded Device Marking
Agilent DESIGNATOR
Agilent P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Agilent CAGE CODE*
Leadless Device Marking
Agilent DESIGNATOR
Agilent P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
XXXX
XXXXXX
XXX 50434
* QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DSCC SMD*
DSCC SMD*
Agilent CAGE CODE*
* QUALIFIED PARTS ONLY
Outline Drawings
16 Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
2.29 (0.090)
MAX.
1.27 (0.050)
REF.
11.13 (0.438)
10.72 (0.422)
0.46 (0.018)
0.36 (0.014)
8.13 (0.320)
MAX.
2.85 (0.112)
MAX.
0.88 (0.0345)
MIN.
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
9.02 (0.355)
8.76 (0.345)
0.31 (0.012)
0.23 (0.009)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
20 Terminal LCCC Surface Mount, 2
Channels
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
8 Pin DIP Through Hole, 1 and 2
Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALIZED
CASTILLATIONS (20 PLCS)
0.64
(0.025)
(20 PLCS)
0.51 (0.020)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
1.78 (0.070)
2.03 (0.080)
0.20 (0.008)
0.33 (0.013)
1.52 (0.060)
2.03 (0.080)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
5
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
300
Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 and 16 pin DIP. DSCC drawing part numbers contain provisions for
lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a
standard feature.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details). This option has solder dipped leads.
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
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