SURFBOARDS
THE BREADBOARDING MEDIUM
FOR
R
SURFACE MOUNT
TM
IDS33110
REV A- 10-2011
33000
SERIES
APPLICATION SPECIFIC ADAPTERS
MODEL
33110
ACCEPTS
ANALOG
FAIRCHILD
ON SEMI
PARTIAL LISTING
LFCSP_UQ 1.3x1.6MM
(
CP-10-10)
10LD UMLP, QUAD 1.4x1.8MM
UQFN10 1.4x1.8,0.4P
WQFN10 1.4x1.8,0.4P
RSW (PUQFN-N10)
10 LEAD
.4 mm
PITCH
4 SIDED DEVICES
TEXAS INST.
ALWAYS CONSULT DEVICE DATA SHEET TO INSURE PROPER FIT
Feature Pins on .1 in. Centers designed for use with Solderless
breadboards, Conventional Breadboards, and Sockets with
standard .1 in. centers.
Use For Prototyping, Device Test or Evaluation and SMD to
Through Hole Conversion.
FIG.
A
B
DRAWINGS
NOT TO
SCALE
MM
25.4
10.16
2.54
2.3
1.88
.4
1.3
.225
.175
3.15
2.75
1.8
1.4
3.3
1.57
.5
IN.
1.0
.400
.100
.090
.074
.016
.051
.009
.007
.124
.108
.070
.055
.130
.062
.020
NOTE:
BOARD WIDTH
+- .5mm .020in.
BOARD HEIGHT
+-.5mm .020in.
SIP PIN SPACE
+-.20mm .008in.
PAD CENTERLINE
PAD CENTERLINE OTHER AXIS
SINGLE-IN-LINE ( SIP ) PINS
ON .100 in. CENTERS
PAD SET
4 SIDED LEAD
FORMAT.
PIN 1 LOCATION
VARIABLE BASED
ON DEVICE
SELECTED.
SEE DEVICE
DATA SHEET.
C
D
EXAMPLE DEVICE ( J )
AND MAX WIDTH ( I )
D1
E
F
G
H
I
I1
DEVICE LEAD PITCH
PAD LENGTH
PAD WIDTH
GAP
MAX LEAD WIDTH
MAX LEAD WIDTH OTHER AXIS
MOUNTING PADS ARE OVERSIZED IN LENGTH TO
ACCEPT A WIDER RANGE OF DEVICE WIDTHS AND
TOLERANCES AND TO PERMIT HAND SOLDERING.
SEE WEBSITE FOR SOLDERING SUGGESTIONS
BOARD SPECIFICATIONS
BOARD MATERIAL:
.8mm, +-.13mm .031in+-..005 in.
Thick G-10 FR-4 Glass Epoxy or equivalent.
CIRCUITS:
1 oz. Copper with RoHS compliant Lead Free
solder coating. Patten Position on board +- .5mm .020in.
J
J1
P
S
TYPICAL LEAD WIDTH
TYPICAL LEAD WIDTH OTHER AXIS
LENGTH FROM SHOULDER
+-.5mm .020in.
PIN SHOULDER HEGHT
PIN WIDTH
RoHS
Compliant
EC 2002/95
W
TOLERANCES:
If not noted are +- 20%. Nominal values are given. Controlling unit is Millimeters.
Values rounded to nearest decimal. Slight Variations due to manufacturing process can occur.
Copyright 2011
by
Capital Advanced Technologies, Inc.
All rights reserved. Surfboards is a registered trademark of Capital Advanced Technologies, Inc. The Breadboarding medium for surface mount, Just add parts and plug-
in., and the Leaf Circuit Logo are trademarks of Capital Advanced Technologies, Inc. All other trademarks are the property of their respective owners. Specifications, availability, and price is subject to change without notice. All
information given is believed to be accurate but is not guaranteed. The user of information given or products represented by such information is responsible for determining the suitability of said information or products for a given
purpose. No inducement is intended or permission granted for infringement of any patent or unauthorized use of any intellectual property of Capital Advanced Technologies or others.
CAPITAL ADVANCED TECHNOLOGIES, INC.
CAROL STREAM, ILLINOIS. USA
PHONE 630-690-1696
FAX 630-690-2498
MADE
IN
WWW.CapitalAdvanced.Com
USA
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