DiskOnChip 2000 DIP
From 16MByte to 1GByte
Data Sheet, September 2004
Highlights
DiskOnChip 2000 DIP is a member of
M-Systems’ family of DiskOnChip flash disk
products. It is available in capacities of
16MByte to 1GByte.
DiskOnChip 2000 DIP features:
Single-chip plug-n-play flash disk
Low power, single 3.3V or 5V power
supply
16MByte (MB) to 1GByte (GB) capacity
Simple, easy-to-integrate interface
8KB sized memory window
Boot OS capability
Proprietary TrueFFS
®
technology for full
hard-disk emulation, high data reliability
and maximum flash lifetime
Software tools for programming,
duplicating, testing, and debugging
Reliability
TrueFFS Software
On-the-fly Reed-Solomon Error Detection
Code/Error Correction Code (EDC/ECC)
Guaranteed data integrity, even after power
failure
Transparent bad-block management
Dynamic and static wear-leveling
Full hard-disk read/write emulation for
transparent file system management
Identical software for all DiskOnChip
capacities
Patented methods to extend flash lifetime,
including:
Dynamic virtual mapping
Dynamic and static wear-leveling
Support for all major OSs, including:
VxWorks, Windows CE/.NET, Linux,
Windows NT/XP, QNX and others.
Operates with TrueFFS Software
Development Kit (SDK) in OS-less
environment.
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Data Sheet, Rev. 3.8
91-SR-002-42-8L
DiskOnChip 2000 DIP
Hardware Compatibility
32-pin DIP, JEDEC standard,
EEPROM-compatible pinout
Pinout compatible with DiskOnChip
Millennium DIP 8MB
Compatible with all major CPUs, including:
x86
StrongARM
XScale
Geode
®
SCxxxx
PowerPC™ MPC8xx
MediaGX
68K
MIPS
SuperH™ SH-x
8-bit, 16-bit and 32-bit bus architecture
support
Applications
Embedded systems
Internet access devices
Internet set-top boxes/ITV, Web browsers
WBT, thin clients, network computers
Routers, networking
Web phones, car PCs, DVD, HPC
Point of sale, industrial PCs
Telecom, medical
Capacities
Low profile: 16, 24, 32, 48, 64, 96, 128, 192,
256, 384MB
High profile: 576, 768, 1024MB
Commercial (0°C to 70°C) and Extended
Temperature Range (-40°C to +85°C) for all
capacities
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Data Sheet, Rev. 3.8
91-SR-002-42-8L
DiskOnChip 2000 DIP
T
ABLE OF
C
ONTENTS
1. Introduction ............................................................................................................................... 3
2. Product Overview ...................................................................................................................... 4
2.1
2.2
2.3
2.4
3.1
3.2
3.3
3.4
3.5
Product Description ............................................................................................................ 4
I/O Operation ...................................................................................................................... 5
Pin Diagram........................................................................................................................ 5
Signal Descriptions............................................................................................................. 6
Overview............................................................................................................................. 7
System Interface................................................................................................................. 7
Boot Block .......................................................................................................................... 8
Error Detection Code/Error Correction Code (EDC/ECC) .................................................. 8
Flash Control ...................................................................................................................... 8
3. Theory of Operation .................................................................................................................. 7
4. Operating Modes ....................................................................................................................... 9
5. TrueFFS Technology............................................................................................................... 10
5.1
General Description.......................................................................................................... 10
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
Built-In Operating System Support..................................................................................... 11
TrueFFS Software Development Kit (SDK)........................................................................ 11
File Management................................................................................................................ 11
Bad-Block Management ..................................................................................................... 11
Wear-Leveling .................................................................................................................... 11
Error Detection/Correction.................................................................................................. 12
Special Features through I/O Control (IOCTL) Mechanism ............................................... 13
Compatibility ....................................................................................................................... 13
5.2
Power Failure Management ............................................................................................. 12
5.2.1
5.2.2
5.2.3
5.3
6.1
6.2
7.1
7.2
7.3
7.4
1
8KB Memory Window ....................................................................................................... 14
Introduction....................................................................................................................... 15
Boot Procedure in PC-Compatible Platforms ................................................................... 15
Design Environment ......................................................................................................... 17
System Interface............................................................................................................... 17
Connecting Signals........................................................................................................... 18
Platform-Specific Issues ................................................................................................... 18
Data Sheet, Rev. 3.8
91-SR-002-42-8L
6. Booting from DiskOnChip 2000 ............................................................................................. 15
7. Design Considerations ........................................................................................................... 17
DiskOnChip 2000 DIP
7.4.1
7.4.2
7.4.3
Wait State ........................................................................................................................... 18
Big and Little Endian Systems............................................................................................ 18
Working with 8/16/32-Bit Systems...................................................................................... 19
8. Product Specifications ........................................................................................................... 20
8.1
Environmental Specifications ........................................................................................... 20
8.1.1
8.1.2
8.1.3
8.1.4
Temperature Ranges ......................................................................................................... 20
DiskOnChip Assembly........................................................................................................ 20
Humidity.............................................................................................................................. 20
Shock and Vibration ........................................................................................................... 20
Absolute Maximum Ratings................................................................................................ 20
Capacitance........................................................................................................................ 21
DC Electrical Characteristics over Operating Range ......................................................... 21
AC Operating Conditions.................................................................................................... 22
Read Cycle Timing ............................................................................................................. 23
Write Cycle Timing ............................................................................................................. 24
8.2
Electrical Specifications.................................................................................................... 20
8.2.1
8.2.2
8.2.3
8.2.4
8.3
Timing Specifications........................................................................................................ 23
8.3.1
8.3.2
8.4
Mechanical Dimensions.................................................................................................... 25
9. Ordering Information............................................................................................................... 26
How to Contact Us ........................................................................................................................ 27
2
Data Sheet, Rev. 3.8
91-SR-002-42-8L
DiskOnChip 2000 DIP
1.
I
NTRODUCTION
Overview of data sheet contents
Product overview, including brief product description, a pin diagram and signal
descriptions
Theory of operation for the major building blocks
Modes of operation
Description of TrueFFS technology
Using DiskOnChip 2000 DIP as a boot device
Design considerations for implementing popular applications and for maximizing
built-in flexibility features
Environmental, mechanical, electrical and production specifications
This data sheet includes the following sections:
Section 1:
Section 2:
Section 3:
Section 4:
Section 5:
Section 6:
Section 7:
Section 8:
To contact M-Systems’ worldwide offices for general information and technical support, please see
the listing on the back page, or visit M-Systems’ website (www.m-systems.com).
3
Data Sheet, Rev. 3.8
91-SR-002-42-8L
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