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MD2202-D32-V3: 产品描述IC doc2000 32mb 32-dip; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小156KB，共29页; 制造商SanDisk(闪迪)

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MD2202-D32-V3概述

IC doc2000 32mb 32-dip

MD2202-D32-V3规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	SanDisk(闪迪)
零件包装代码	DIP
包装说明	DIP,
针数	32
Reach Compliance Code	unknown
外部数据总线宽度	8
JESD-30 代码	R-PDIP-T32
端子数量	32
最高工作温度	70 °C
最低工作温度
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
峰值回流温度（摄氏度）	NOT SPECIFIED
认证状态	Not Qualified
最大供电电压	3.6 V
最小供电电压	3 V
标称供电电压	3.3 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子形式	THROUGH-HOLE
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
uPs/uCs/外围集成电路类型	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

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DiskOnChip 2000 DIP

From 16MByte to 1GByte

Data Sheet, September 2004

Highlights

DiskOnChip 2000 DIP is a member of

M-Systems’ family of DiskOnChip flash disk

products. It is available in capacities of

16MByte to 1GByte.

DiskOnChip 2000 DIP features:

Single-chip plug-n-play flash disk

Low power, single 3.3V or 5V power

supply

16MByte (MB) to 1GByte (GB) capacity

Simple, easy-to-integrate interface

8KB sized memory window

Boot OS capability

Proprietary TrueFFS

technology for full

hard-disk emulation, high data reliability

and maximum flash lifetime

Software tools for programming,

duplicating, testing, and debugging

Reliability

TrueFFS Software

On-the-fly Reed-Solomon Error Detection

Code/Error Correction Code (EDC/ECC)

Guaranteed data integrity, even after power

failure

Transparent bad-block management

Dynamic and static wear-leveling

Full hard-disk read/write emulation for

transparent file system management

Identical software for all DiskOnChip

capacities

Patented methods to extend flash lifetime,

including:

Dynamic virtual mapping

Dynamic and static wear-leveling

Support for all major OSs, including:

VxWorks, Windows CE/.NET, Linux,

Windows NT/XP, QNX and others.

Operates with TrueFFS Software

Development Kit (SDK) in OS-less

environment.

Data Sheet, Rev. 3.8

91-SR-002-42-8L

DiskOnChip 2000 DIP

ABLE OF

ONTENTS

1. Introduction ............................................................................................................................... 3

2. Product Overview ...................................................................................................................... 4

2.1

2.2

2.3

2.4

3.1

3.2

3.3

3.4

3.5

Product Description ............................................................................................................ 4

I/O Operation ...................................................................................................................... 5

Pin Diagram........................................................................................................................ 5

Signal Descriptions............................................................................................................. 6

Overview............................................................................................................................. 7

System Interface................................................................................................................. 7

Boot Block .......................................................................................................................... 8

Error Detection Code/Error Correction Code (EDC/ECC) .................................................. 8

Flash Control ...................................................................................................................... 8

3. Theory of Operation .................................................................................................................. 7

4. Operating Modes ....................................................................................................................... 9

5. TrueFFS Technology............................................................................................................... 10

5.1

General Description.......................................................................................................... 10

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

Built-In Operating System Support..................................................................................... 11

TrueFFS Software Development Kit (SDK)........................................................................ 11

File Management................................................................................................................ 11

Bad-Block Management ..................................................................................................... 11

Wear-Leveling .................................................................................................................... 11

Error Detection/Correction.................................................................................................. 12

Special Features through I/O Control (IOCTL) Mechanism ............................................... 13

Compatibility ....................................................................................................................... 13

5.2

Power Failure Management ............................................................................................. 12

5.2.1

5.2.2

5.2.3

5.3

6.1

6.2

7.1

7.2

7.3

7.4

8KB Memory Window ....................................................................................................... 14

Introduction....................................................................................................................... 15

Boot Procedure in PC-Compatible Platforms ................................................................... 15

Design Environment ......................................................................................................... 17

System Interface............................................................................................................... 17

Connecting Signals........................................................................................................... 18

Platform-Specific Issues ................................................................................................... 18

Data Sheet, Rev. 3.8

91-SR-002-42-8L

6. Booting from DiskOnChip 2000 ............................................................................................. 15

7. Design Considerations ........................................................................................................... 17

DiskOnChip 2000 DIP

7.4.1

7.4.2

7.4.3

Wait State ........................................................................................................................... 18

Big and Little Endian Systems............................................................................................ 18

Working with 8/16/32-Bit Systems...................................................................................... 19

8. Product Specifications ........................................................................................................... 20

8.1

Environmental Specifications ........................................................................................... 20

8.1.1

8.1.2

8.1.3

8.1.4

Temperature Ranges ......................................................................................................... 20

DiskOnChip Assembly........................................................................................................ 20

Humidity.............................................................................................................................. 20

Shock and Vibration ........................................................................................................... 20

Absolute Maximum Ratings................................................................................................ 20

Capacitance........................................................................................................................ 21

DC Electrical Characteristics over Operating Range ......................................................... 21

AC Operating Conditions.................................................................................................... 22

Read Cycle Timing ............................................................................................................. 23

Write Cycle Timing ............................................................................................................. 24

8.2

Electrical Specifications.................................................................................................... 20

8.2.1

8.2.2

8.2.3

8.2.4

8.3

Timing Specifications........................................................................................................ 23

8.3.1

8.3.2

8.4

Mechanical Dimensions.................................................................................................... 25

9. Ordering Information............................................................................................................... 26

How to Contact Us ........................................................................................................................ 27

Data Sheet, Rev. 3.8

91-SR-002-42-8L

MD2202-D32-V3

MD2202-D32-V3概述

MD2202-D32-V3规格参数

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