FIFO, 512X9, 35ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32
| 参数名称 | 属性值 |
| 零件包装代码 | QFJ |
| 包装说明 | QCCN, |
| 针数 | 32 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 35 ns |
| 周期时间 | 35 ns |
| JESD-30 代码 | R-CQCC-N32 |
| JESD-609代码 | e0 |
| 内存密度 | 4608 bit |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 512X9 |
| 可输出 | YES |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 认证状态 | Qualified |
| 筛选级别 | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 5962-9324902MXX | 5962-9324901MXX | MC1206P-1581-DBW | 5962-9324903MXX | 5962-9451103MXX | 5962-9451102MXX | 5962-9451101MXX | |
|---|---|---|---|---|---|---|---|
| 描述 | FIFO, 512X9, 35ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 512X9, 50ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 1580ohm, 200V, 0.5% +/-Tol, 100ppm/Cel, 1206, | FIFO, 512X9, 25ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 4KX9, Synchronous, CMOS, CQCC32, LCC-32 | FIFO, 4KX9, Synchronous, CMOS, CQCC32, LCC-32 | FIFO, 4KX9, Synchronous, CMOS, CQCC32, LCC-32 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-609代码 | e0 | e0 | e3 | e0 | e0 | e0 | e0 |
| 端子数量 | 32 | 32 | 2 | 32 | 32 | 32 | 32 |
| 最高工作温度 | 125 °C | 125 °C | 155 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | SMT | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 技术 | CMOS | CMOS | METAL GLAZE/THICK FILM | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | TIN LEAD | TIN LEAD | Matte Tin (Sn) | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 零件包装代码 | QFJ | QFJ | - | QFJ | QFJ | QFJ | QFJ |
| 包装说明 | QCCN, | QCCN, | - | QCCN, | QCCN, | QCCN, | QCCN, |
| 针数 | 32 | 32 | - | 32 | 32 | 32 | 32 |
| 周期时间 | 35 ns | 50 ns | - | 25 ns | 25 ns | 35 ns | 50 ns |
| JESD-30 代码 | R-CQCC-N32 | R-CQCC-N32 | - | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 |
| 内存密度 | 4608 bit | 4608 bit | - | 4608 bit | 36864 bit | 36864 bit | 36864 bit |
| 内存宽度 | 9 | 9 | - | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 字数 | 512 words | 512 words | - | 512 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 512 | 512 | - | 512 | 4000 | 4000 | 4000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 组织 | 512X9 | 512X9 | - | 512X9 | 4KX9 | 4KX9 | 4KX9 |
| 可输出 | YES | YES | - | YES | YES | YES | YES |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | QCCN | - | QCCN | QCCN | QCCN | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 并行/串行 | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Qualified | Qualified | - | Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | YES | YES | YES | YES |
| 温度等级 | MILITARY | MILITARY | - | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | QUAD | QUAD | - | QUAD | QUAD | QUAD | QUAD |
| Base Number Matches | 1 | 1 | - | 1 | 1 | 1 | - |
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