Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.635 MM PITCH, CERPACK-48
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | DFP |
| 包装说明 | 0.635 MM PITCH, CERPACK-48 |
| 针数 | 48 |
| Reach Compliance Code | compliant |
| 系列 | FCT |
| JESD-30 代码 | R-GDFP-F48 |
| JESD-609代码 | e3 |
| 长度 | 15.875 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 48 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 5.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.413 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | FLAT |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 9.652 mm |
| Base Number Matches | 1 |
| IDT74FCT162373CTEG | IDT74FCT162373TEG | IDT74FCT162373ATEG | IDT74FCT162373ETEG | |
|---|---|---|---|---|
| 描述 | Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.635 MM PITCH, CERPACK-48 | Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.635 MM PITCH, CERPACK-48 | Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.635 MM PITCH, CERPACK-48 | Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.635 MM PITCH, CERPACK-48 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DFP | DFP | DFP | DFP |
| 包装说明 | 0.635 MM PITCH, CERPACK-48 | 0.635 MM PITCH, CERPACK-48 | 0.635 MM PITCH, CERPACK-48 | 0.635 MM PITCH, CERPACK-48 |
| 针数 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| 系列 | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-GDFP-F48 | R-GDFP-F48 | R-GDFP-F48 | R-GDFP-F48 |
| JESD-609代码 | e3 | e3 | e3 | e3 |
| 长度 | 15.875 mm | 15.875 mm | 15.875 mm | 15.875 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DFP | DFP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 传播延迟（tpd） | 5.5 ns | 13 ns | 8.5 ns | 3.7 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.413 mm | 2.413 mm | 2.413 mm | 2.413 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
| 端子形式 | FLAT | FLAT | FLAT | FLAT |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
| 宽度 | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
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