Enhanced Product 8-Bit Dual-Supply Bus Transc. w/ Configurable Voltage Transl., and 3-State Outputs 24-SOIC -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | SOIC-24 |
| Reach Compliance Code | compliant |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e4 |
| 长度 | 15.4 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER |
| 最大I（ol） | 0.032 A |
| 湿度敏感等级 | 3 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 最大电源电流（ICC） | 0.025 mA |
| 传播延迟（tpd） | 28.8 ns |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |
| V62/09615-01YE | SN74LVC8T245MDWREP | CLVC8T245MRHLTEP | V62-09615-01XE | V62/09615-01XE | SN74LVC8T245-EP | V62/09615-01ZE | |
|---|---|---|---|---|---|---|---|
| 描述 | Enhanced Product 8-Bit Dual-Supply Bus Transc. w/ Configurable Voltage Transl., and 3-State Outputs 24-SOIC -55 to 125 | Enhanced Product 8-Bit Dual-Supply Bus Transc. w/ Configurable Voltage Transl., and 3-State Outputs 24-SOIC -55 to 125 | Enhanced Product 8-Bit Dual-Supply Bus Transc. w/ Configurable Voltage Transl., and 3-State Outputs 24-VQFN -55 to 125 | Translation - Voltage Levels EP 8B Dual-Sply Bus Transc | Enhanced Product 8-Bit Dual-Supply Bus Transc. w/ Configurable Voltage Transl., and 3-State Outputs 24-TSSOP -55 to 125 | SN74LVC8T245-EP Enhanced Product 8-Bit Dual-Supply Bus Transc. w/ Configurable Voltage Transl., and 3-State Outputs | Enhanced Product 8-Bit Dual-Supply Bus Transc. w/ Configurable Voltage Transl., and 3-State Outputs 24-VQFN -55 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments | - | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | - | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | - | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) |
| 包装说明 | SOIC-24 | SOP-24 | HVQCCN, | - | TSSOP, TSSOP24,.25 | - | HVQCCN, |
| Reach Compliance Code | compliant | compliant | compliant | - | compliant | - | compliant |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | - | LVC/LCX/Z | - | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PQCC-N24 | - | R-PDSO-G24 | - | R-PQCC-N24 |
| JESD-609代码 | e4 | e4 | e4 | - | e4 | - | e4 |
| 长度 | 15.4 mm | 15.4 mm | 5.5 mm | - | 7.8 mm | - | 5.5 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | - | BUS TRANSCEIVER | - | BUS TRANSCEIVER |
| 最大I（ol） | 0.032 A | 0.032 A | 0.032 A | - | 0.032 A | - | 0.032 A |
| 湿度敏感等级 | 3 | 3 | 2 | - | 1 | - | 2 |
| 位数 | 8 | 8 | 8 | - | 8 | - | 8 |
| 功能数量 | 1 | 1 | 1 | - | 1 | - | 1 |
| 端口数量 | 2 | 2 | 2 | - | 2 | - | 2 |
| 端子数量 | 24 | 24 | 24 | - | 24 | - | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | - | 125 °C | - | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | - | -55 °C | - | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | - | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | - | TRUE | - | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | HVQCCN | - | TSSOP | - | HVQCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | - | 260 | - | 260 |
| 最大电源电流（ICC） | 0.025 mA | 0.025 mA | 0.025 mA | - | 0.025 mA | - | 0.025 mA |
| 传播延迟（tpd） | 28.8 ns | 28.8 ns | 28.8 ns | - | 25.9 ns | - | 28.8 ns |
| 座面最大高度 | 2.65 mm | 2.65 mm | 1 mm | - | 1.2 mm | - | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | - | 1.65 V | - | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V | - | 1.8 V |
| 表面贴装 | YES | YES | YES | - | YES | - | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | - | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | - | MILITARY | - | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | NO LEAD | - | GULL WING | - | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | - | - | 0.65 mm | - | 0.5 mm |
| 端子位置 | DUAL | DUAL | QUAD | - | DUAL | - | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 7.5 mm | 7.5 mm | 3.5 mm | - | 4.4 mm | - | 3.5 mm |
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