E1SDB18-25.476M TR
Series
RoHS Compliant (Pb-free) Resistance Welded Short
HC-49/UP SMD Crystal
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over 0°C to +70°C
Mode of Operation
AT-Cut Third Overtone
RoHS
Pb
Packaging Options
Tape & Reel
E1S D B 18 -25.476M TR
Nominal Frequency
25.476MHz
Load Capacitance
18pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Storage Temperature Range
Insulation Resistance
25.476MHz
±30ppm at 25°C, ±50ppm over 0°C to +70°C
±5ppm/year Maximum
18pF Parallel Resonant
7pF Maximum
150 Ohms Maximum
AT-Cut Third Overtone
1mWatt Maximum
-40°C to +125°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Lead Termination
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014 Condition A
MIL-STD-883, Method 1014 Condition C
Sn 2µm - 6µm
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
LINE MARKING
1
3.20
MAX
E25.476M
E=Ecliptek Designator
M=MHz
13.30 MAX
4.85
MAX
4.88 ±0.20
0.50 MIN (x2)
0.80 ±0.30 (x2)
11.60 MAX
NOTE: Coplanarity 0.360 MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 1 of 5
E1SDB18-25.476M TR
Suggested Solder Pad Layout
All Dimensions in Millimeters
5.5 (X2)
2.0 (X2)
4.0
Solder Land
(X2)
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 2 of 5
E1SDB18-25.476M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.2
2.0 ±0.1
DIA 1.5 ±0.1
0.4 ±0.1
11.5 ±0.1
24.0 ±0.3
10.75 ±0.10
A0*
12.0 ±0.2
*Compliant to EIA 481A
B0*
K0*
1.5 MIN
DIA 40 MIN
Access Hole at
Slot Location
30.4 MAX
360 MAX
DIA 50 MIN
DIA 20.2 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
24.4 +2.0/-0.0
DIA 13.0 ±0.2
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 3 of 5
E1SDB18-25.476M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 4 of 5
E1SDB18-25.476M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 245°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 5 of 5
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