CR02M557-02 Rev. A - Page 1 of 3
Product Family:
Part Number Series:
Tantalum Nitride Thin Film Chip Resistor
AF Series
Construction:
High Purity Alumina Substrate
TaN resistive element
Anti-Sulfur (ASTM B09-95)
Wrap around electrodes
100% matte tin over Ni terminations
(RoHS compliant and Pb Free)
Features:
0402, 0603, 0805, 1206; E24 + E 96
values
TCR’s down to ±10ppm/°C
Resistance down to 10Ω available
AEC Q200 Qualified—Automotive Grade
Description:
These AF Series precision chip resistors are AEC Q200 qualified, sulfur resistant, offer excellent performance and
tolerance in TCR, current noise, and linearity for high frequency circuit applications and other applications requiring
precision and stability. They are perfect for demanding applications where high reliability and sulfur resistance is a must,
such as automotive applications. High volume manufacturing allows for lower costs for the customer.
Product Dimensions:
Dimension
L
W
H
T1
No marking code for 0402 size
3– digit marking for 0603 size
4– digit marking for 0805 & 1206 size
TF0402
(1005)
0.039
±0.004
0.020
±0.002
0.012
±0.004
0.012
±0.004
0.010
±0.006
TF0603
(1608)
0.061
±0.004
0.031
±0.004
0.018
±0.006
0.012
±0.006
0.012
±0.008
TF0805
(2012)
0.079
±0.004
0.049
±0.004
0.020
±0.006
0.016
±0.008
0.014
±0.008
TF1206
(3216)
0.122
±0.004
0.063
±0.004
0.024
±0.006
0.018
±0.008
0.018
±0.008
T2
All dimensions are shown in inches, Metric case sizes are shown in parenthesis.
Part Numbering:
Ex:AF0603AE2002B-T5
Product
Designator
Size W x L
English
0402
0603
0805
1206
Internal
Code
Temp. Coefficient
of Resistance
(TCR)
Resistance
Value
For all sizes, use 4
digit code for all
values. “R” denotes
decimal position as
necessary
Resistance
Tolerance
A = ±0.05%
B = ±0.10%
C = ±0.25%
D = ±0.50%
F = ±1.00%
T&R Packaging Quantity
AF
A
Y = ±10ppm/°C
X = ±15ppm/°C
E = ±25ppm/°C
Q = ±50ppm/°C
-T5 = 5,000 PCS
(0603, 0805, 1206)
-T10 = 10,000 PCS
(0402)
Thin Film Technology Corp. / 1980 Commerce Drive, North Mankato, MN 56003 (USA) / (507) 625-8445 / www.thin-film.com
CR02M557-02 Rev. A - Page 2 of 3
Electrical Specifications:
Type
English Size
Power
Tolerance% (code)
Resistance Range (Ω)
Resistance Offering
TCR ppm/°C (code)
Max Operating Voltage
Operating Temp. Range
Packaging
10,000 pcs/reel
50 V
40~35K
AF0402
0402
0.0625 Watt
AF0603
0603
0.15 Watt
40~130K
AF0805
0805
0.2 Watt
10~350K
E-24, E-96 Values
±10 (Y), ±15 (X), ±25 (E), ±50 (Q)
AF1206
1206
0.4 Watt
10~1M
±0.05(A) , ±0.1(B) , ±0.25 (C) , ±0.5(D) , ±1 (F)
75 V
-55°C ~ 155°C
100 V
5,000 pcs/reel
200 V
Reliability Specifications:
Test
Short time overload
(S.T.O.L)
IEC60115-1 4.13
Resistance to soldering heat
(R.S.H)
AEC Q200-15
Solderability
IEC 60068-2-58
Thermal Shock
MIL-STD-202 Method 107
Bias Humidity
AEC Q200-7
Load Life
IEC60115-1 4.25
Operational Life
AEC Q200-8
MIL-STD-202 -108
High Temperature
Exposure
AEC Q200-3
Moisture Resistance
AEC-Q200 -6
MIL-STD-202 Method 106
Mechanical Shock
MIL-STD-202 Method 213
Vibration
MIL-STD-202 Method 204
Terminal strength
AEC-Q200-6
Board flex
AEC-Q200-21
Bending 2mm for 60 sec
Δ R/R max. ±(0.1%+0.02Ω)
5 g's for 20 min , 12 cycles each of 3 orientations
1 kg for 60 s
65±2°C, 80~100% RH, 10 cycles, 24 hours/ cycle
Δ R/R max. ±(0.1%+0.02Ω)
Un-mounted chips completely immersed for 10±1second in a SAC solder bath at no visible damage
260
±
5ºC
Δ R/R max. ±(0.1%+0.02Ω)
Un-mounted chips completely immersed for 2±0.5 second in a SAC solder bath good tinning (>95% covered)
at 235°C±5°C
no visible damage
Test –55°C to 125
1000 cycles
/
dwell time 15min/ Max transfer time 20sec
no visible damage
Δ R/R max. ±(0.1%+0.02Ω)
Test Method
Specification
Permanent resistance change after a 5second application of a voltage 2.5 times Δ R/R max. ±(0.1%+0.02Ω)
RCWV or the maximum overload voltage specified in the above list, whichever is
less.
1000 +48/-0 hours, loaded with 10% rated power in humidity chamber controller at Δ R/R max. ±(0.1%+0.02Ω)
+85
/
85%RH
1000 +48/-0 hours, loaded with RCWV or Vmax in chamber controller 85 ±2ºC,
1.5 hours on and 0.5 hours off
1,000 hours at 125±2°C, loaded with rated power continuously
Δ R/R max. ±(0.1%+0.02Ω)
Δ R/R max. ±(0.1%+0.02Ω)
Δ R/R max. ±(0.1%+0.02Ω)
1000 hrs @ 125
,
un-powered
1/2 Sine Pulse / 1500g Peak / Velocity 15.4ft/sec
Δ R/R max. ±(0.1%+0.02Ω)
Δ R/R max. ±(0.1%+0.02Ω)
No broken
Thin Film Technology Corp. / 1980 Commerce Drive, North Mankato, MN 56003 (USA) / (507) 625-8445 / www.thin-film.com
CR02M557-02 Rev. A - Page 3 of 3
Derating Curve:
Soldering Profile:
Thin Film Technology Corp. / 1980 Commerce Drive, North Mankato, MN 56003 (USA) / (507) 625-8445 / www.thin-film.com
Microchip MCU
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