APEX II
®
Programmable Logic
Device Family
Data Sheet
August 2002, ver. 3.0
Features...
■
■
■
Programmable logic device (PLD) manufactured using a 0.15-µm all-
layer copper-metal fabrication process (up to eight layers of metal)
–
1-gigabit per second (Gbps) True-LVDS
TM
, LVPECL, pseudo
current mode logic (PCML), and HyperTransport
TM
interface
–
Clock-data synchronization (CDS) in True-LVDS interface to
correct any fixed clock-to-data skew
–
Enables common networking and communications bus I/O
standards such as RapidIO
TM
, CSIX, Utopia IV, and POS-PHY
Level 4
–
Support for high-speed external memory interfaces, including
zero bus turnaround (ZBT), quad data rate (QDR), and double
data rate (DDR) static RAM (SRAM), and single data rate (SDR)
and DDR synchronous dynamic RAM (SDRAM)
–
30% to 40% faster design performance than APEX
TM
20KE
devices on average
–
Enhanced 4,096-bit embedded system blocks (ESBs)
implementing first-in first-out (FIFO) buffers, Dual-Port+ RAM
(bidirectional dual-port RAM), and content-addressable
memory (CAM)
–
High-performance, low-power copper interconnect
–
Fast parallel byte-wide synchronous device configuration
–
Look-up table (LUT) logic available for register-intensive
functions
High-density architecture
–
1,900,000 to 5,250,000 maximum system gates (see
Table 1)
–
Up to 67,200 logic elements (LEs)
–
Up to 1,146,880 RAM bits that can be used without reducing
available logic
Low-power operation design
–
1.5-V supply voltage
–
Copper interconnect reduces power consumption
–
MultiVolt
TM
I/O support for 1.5-V, 1.8-V, 2.5-V, and 3.3-V
interfaces
–
ESBs offer programmable power-saving mode
Altera Corporation
DS-APEXII-3.0
1
APEX II Programmable Logic Device Family Data Sheet
Table 1. APEX II Device Features
Feature
Maximum gates
Typical gates
LEs
RAM ESBs
Maximum RAM bits
True-LVDS channels
Flexible-LVDS
TM
EP2A15
1,900,000
600,000
16,640
104
425,984
36
(1)
56
4
8
492
EP2A25
2,750,000
900,000
24,320
152
622,592
36
(1)
56
4
8
612
EP2A40
3,000,000
1,500,000
38,400
160
655,360
36
(1)
88
4
8
735
EP2A70
5,250,000
3,000,000
67,200
280
1,146,880
36
(1)
88
4
8
1,060
channels
(2)
True-LVDS PLLs
(3)
General-purpose PLL outputs
(4)
Maximum user I/O pins
Notes to
Table 1:
(1)
(2)
(3)
(4)
Each device has 36 input channels and 36 output channels.
EP2A15 and EP2A25 devices have 56 input and 56 output channels; EP2A40 and EP2A70 devices have 88 input and
88 output channels.
PLL: phase-locked loop. True-LVDS PLLs are dedicated to implement True-LVDS functionality.
Two internal outputs per PLL are available. Additionally, the device has one external output per PLL pair (two
external outputs per device).
...and More
Features
■
I/O features
–
Up to 380 Gbps of I/O capability
–
1-Gbps True-LVDS, LVPECL, PCML, and HyperTransport
support on 36 input and 36 output channels that feature clock
synchronization circuitry and independent clock multiplication
and serialization/deserialization factors
–
Common networking and communications bus I/O standards
such as RapidIO, CSIX, Utopia IV, and POS-PHY Level 4 enabled
–
400-megabits per second (Mbps) Flexible-LVDS and
HyperTransport support on up to 88 input and 88 output
channels (input channels also support LVPECL)
–
Support for high-speed external memories, including ZBT, QDR,
and DDR SRAM, and SDR and DDR SDRAM
–
Compliant with peripheral component interconnect Special
Interest Group (PCI SIG)
PCI Local Bus Specification,
Revision 2.2
for 3.3-V operation at 33 or 66 MHz and 32 or 64 bits
–
Compliant with 133-MHz PCI-X specifications
–
Support for other advanced I/O standards, including AGP, CTT,
SSTL-3 and SSTL-2 Class I and II, GTL+, and HSTL Class I and II
–
Six dedicated registers in each I/O element (IOE): two input
registers, two output registers, and two output-enable registers
–
Programmable bus hold feature
–
Programmable pull-up resistor on I/O pins available during
user mode
2
Altera Corporation
APEX II Programmable Logic Device Family Data Sheet
■
■
■
■
■
Programmable output drive for 3.3-V LVTTL at 4 mA, 12 mA,
24 mA, or I/O standard levels
–
Programmable output slew-rate control reduces switching noise
–
Hot-socketing operation supported
–
Pull-up resistor on I/O pins before and during configuration
Enhanced internal memory structure
–
High-density 4,096-bit ESBs
–
Dual-Port+ RAM with bidirectional read and write ports
–
Support for many other memory functions, including CAM,
FIFO, and ROM
–
ESB packing mode partitions one ESB into two 2,048-bit blocks
Device configuration
–
Fast byte-wide synchronous configuration minimizes in-circuit
reconfiguration time
–
Device configuration supports multiple voltages (either 3.3 V
and 2.5 V or 1.8 V)
Flexible clock management circuitry with eight general-purpose PLL
outputs
–
Four general-purpose PLLs with two outputs per PLL
–
Built-in low-skew clock tree
–
Eight global clock signals
–
ClockLock
TM
feature reducing clock delay and skew
–
ClockBoost
TM
feature providing clock multiplication (by 1 to 160)
and division (by 1 to 256)
–
ClockShift
TM
feature providing programmable clock phase and
delay shifting with coarse (90°, 180°, or 270°) and fine (0.5 to
1.0 ns) resolution
Advanced interconnect structure
–
All-layer copper interconnect for high performance
–
Four-level hierarchical FastTrack
®
interconnect structure for fast,
predictable interconnect delays
–
Dedicated carry chain that implements arithmetic functions such
as fast adders, counters, and comparators (automatically used by
software tools and megafunctions)
–
Dedicated cascade chain that implements high-speed,
high-fan-in logic functions (automatically used by software tools
and megafunctions)
–
Interleaved local interconnect allowing one LE to drive 29 other
LEs through the fast local interconnect
Advanced software support
–
Software design support and automatic place-and-route
provided by the Altera
®
Quartus
TM
II development system for
Windows-based PCs, Sun SPARCstations, and HP 9000
Series 700/800 workstations
–
Altera MegaCore
®
functions and Altera Megafunction Partners
Program (AMPP
SM
) megafunctions optimized for APEX II
architecture
–
Altera Corporation
3
APEX II Programmable Logic Device Family Data Sheet
–
–
–
–
LogicLock
TM
incremental design for intellectual property (IP)
integration and team-based design
NativeLink
TM
integration with popular synthesis, simulation,
and timing analysis tools
SignalTap
®
embedded logic analyzer simplifies in-system design
evaluation by giving access to internal nodes during device
operation
Support for popular revision-control software packages,
including PVCS, RCS, and SCCS
Tables 2
and
3
show the APEX II ball-grid array (BGA) and
FineLine BGA
TM
device package sizes, options, and I/O pin counts.
Table 2. APEX II Package Sizes
Feature
Pitch (mm)
Area (mm
2
)
Length
×
Width (mm
×
mm)
672-Pin
FineLine BGA
1.00
729
27
×
27
724-Pin BGA
1.27
1,225
35
×
35
1,020-Pin
FineLine BGA
1.00
1,089
33
×
33
1,508-Pin
FineLine BGA
1.00
1,600
40
×
40
Table 3. APEX II Package Options & I/O Pin Count
Feature
EP2A15
EP2A25
EP2A40
EP2A70
Notes to
Table 3:
(1)
Notes (1), (2)
724-Pin BGA
492
536
536
536
735
1,060
672-Pin
FineLine BGA
492
492
492
1,020-Pin
FineLine BGA
1,508-Pin
FineLine BGA
(2)
All APEX II devices support vertical migration within the same package (e.g., the designer can migrate between the
EP2A15, EP2A25, and EP2A40 devices in the 672-pin FineLine BGA package). Vertical migration means that
designers can migrate to devices whose dedicated pins, configuration pins, LVDS pins, and power pins are the same
for a given package across device densities. Migration of I/O pins across densities requires the designer to cross
reference the available I/O pins using the device pin-outs. This must be done for all planned densities for a given
package type to identify which I/O pins are migratable.
I/O pin counts include dedicated clock and fast I/O pins.
4
Altera Corporation
APEX II Programmable Logic Device Family Data Sheet
General
Description
APEX II devices integrate high-speed differential I/O support using the
True-LVDS interface. The dedicated serializer, deserializer, and CDS
circuitry in the True-LVDS interface support the LVDS, LVPECL,
HyperTransport, and PCML I/O standards. Flexible-LVDS pins located
in regular user I/O banks offer additional differential support, increasing
the total device bandwidth. This circuitry, together with enhanced IOEs
and support for numerous I/O standards, allows APEX II devices to meet
high-speed interface requirements.
APEX II devices also include other high-performance features such as
bidirectional dual-port RAM, CAM, general-purpose PLLs, and
numerous global clocks.
Configuration
The logic, circuitry, and interconnects in the APEX II architecture are
configured with CMOS SRAM elements. APEX II devices are
reconfigurable and are 100% tested prior to shipment. As a result, test
vectors do not have to be generated for fault coverage. Instead, the
designer can focus on simulation and design verification. In addition, the
designer does not need to manage inventories of different ASIC designs;
APEX II devices can be configured on the board for the specific
functionality required.
APEX II devices are configured at system power-up with data either
stored in an Altera configuration device or provided by a system
controller. Altera offers in-system programmability (ISP)-capable
configuration devices, which configure APEX II devices via a serial data
stream. The enhanced configuration devices can configure any APEX II
device in under 100 ms. Moreover, APEX II devices contain an optimized
interface that permits microprocessors to configure APEX II devices
serially or in parallel, synchronously or asynchronously. This interface
also enables microprocessors to treat APEX II devices as memory and to
configure the device by writing to a virtual memory location, simplifying
reconfiguration.
APEX II devices also support a new byte-wide, synchronous
configuration scheme at speeds of up to 66 MHz using EPC16
configuration devices or a microprocessor. This parallel configuration
reduces configuration time by using eight data lines to send configuration
data versus one data line in serial configuration.
APEX II devices support multi-voltage configuration; device
configuration can be performed at 3.3 V and 2.5 V or 1.8 V.
Altera Corporation
5
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