Intel
®
Wireless Flash Memory (W18
SCSP)
32-Mbit W18 + 8-Mbit SRAM (38F1020W0YTQ0, 38F1020W0YBQ0)
Datasheet
Product Features
■
Flash Architecture
— Flexible, Multi-Partition, Dual-Operation:
Read-While-Write / Read-While-Erase
— 8 Partitions, 4 Mbits each
— 7 Main Partitions, 8 Main Blocks each
— 1 Parameter Partition, 8 Parameter + 7 Main
Blocks
— 32-KWord Main Blocks, 4-KWord
Parameter Blocks
— Top and Bottom Parameter Configuration
■
Flash Automation Suspend Operations
— Erase Suspend to Program or Read
— Program Suspend to Read
— 5 µs (typ) Program/Erase Suspend Latency
■
Flash Software
— Intel
®
Flash Data Integrator (Intel
®
FDI)
Optimized
— Common Flash Interface (CFI)
— 32-Mbit Flash die + 8-Mbit SRAM die
— Reduces Board Space Requirement
— Simplifies PCB Design Complexity
— Easy Migration to Future SCSP Devices
■
SCSP Architecture
■
Flash Performance
— 65 ns Initial Access Speed
— 25 ns Page-Mode Read Speed; 4-Word Page
— 14 ns Burst-Mode Read Speed
— 4-, 8-, 16- or Continuous-Word Burst Modes
— Burst- and Page-Mode Reads in Parameter
and Main Partitions
— Burst Suspend
— Burst-Mode Reads can Traverse Partition
Boundaries
— Programmable WAIT Polarity
— Enhanced Factory Programming: 3.1 µs/
Word (typ)
■
■
SCSP Voltage
— 1.7 V to 1.95 V V
CC
/V
CCQ
and S-V
CC
SCSP Packaging
— 0.8 mm Ball-Pitch Intel
®
SCSP
— Area: 8x10 mm, Height: 1.2 mm max
— 88-Ball (8 x 10 Matrix): 80 Active Balls with
2 Support Balls at Each Corner
— 70 ns Access Time
— Low-Voltage Data Retention Mode
■
SRAM Architecture and Performance
Flash Quality and Reliability
— Extended Temperature: –25 °C to +85 °C
— Minimum 100,000 Block Erase Cycles
— Intel
®
0.13 µm ETOX
TM
VIII Process
Technology
■
Flash Data Protection
— Absolute Protection with VPP and WP#
— Individual Dynamic Zero-Latency Block
Locking
— Individual Block Lock-Down
— Erase/Program Lockout during Power
Transitions
■
■
Flash Protection Register
— 64 Unique Device Identifier Bits
— 64 User-Programmable OTP Bits
By stacking the Intel
®
Wireless Flash Memory (W18) device in combination with a low-power
8-Mbit SRAM device, a versatile and compact Stacked Chip Scale Package (SCSP) provides a
solution for high-performance, low-power, board-constrained memory applications. This
datasheet describes the key features of this 32-Mbit W18 + 8-Mbit SRAM combination device.
Refer to the latest revision of the
Intel
®
Wireless Flash Memory (W18) Datasheet
(order number
290701) for flash device details not provided in this document.
Notice:
This document contains information available at the time of its release. The specifica-
tions are subject to change without notice. Verify with your local Intel sales office that you have
the latest datasheet before finalizing a design.
252635-002
May 2004
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The 38F1020W0YTQ0 device may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at http://www.intel.com.
Copyright © Intel Corporation, 2004.
*Other names and brands may be claimed as the property of others.
2
Datasheet
38F1020W0YTQ0, 38F1020W0YBW0
Contents
1.0
Introduction
......................................................................................................................5
1.1
1.2
2.0
3.0
2.1
3.1
4.0
5.0
Nomenclature ........................................................................................................5
Conventions ..........................................................................................................5
Block Diagram .......................................................................................................6
88-Ball Mechanical Specification...........................................................................7
Functional Overview
........................................................................................................6
Package Information
........................................................................................................7
Ballout and Signal Description
.......................................................................................9
4.1
5.1
5.2
5.3
Signal Descriptions..............................................................................................10
Absolute Maximum Ratings.................................................................................12
Operating Conditions...........................................................................................13
Capacitance ........................................................................................................13
Maximum Ratings and Operating Conditions
.............................................................12
6.0
Electrical Specifications
................................................................................................14
6.1
DC Characteristics ..............................................................................................14
Flash AC Characteristics.....................................................................................15
SRAM AC Characteristics ...................................................................................15
7.0
AC Characteristics
.........................................................................................................15
7.1
7.2
8.0
9.0
10.0
11.0
12.0
13.0
14.0
Power and Reset Specifications
...................................................................................18
Device Operation............................................................................................................19
Flash Read Operations
..................................................................................................20
Flash Program Operations
............................................................................................20
Flash Program and Erase Operations
..........................................................................20
Flash Security Modes
....................................................................................................20
Flash Set Configuration Register
.................................................................................20
Appendix A
Appendix B
Appendix C
Appendix D
Write State Machine...........................................................................................21
Common Flash Interface....................................................................................21
Additional Information
......................................................................................21
Ordering Information
........................................................................................22
Datasheet
3
38F1020W0YTQ0, 38F1020W0YBW0
Revision History
Date of
Revision
2/12/03
9/03
5/04
Version
-001
-002
-002
Original SCSP release.
Added number column to flash and RAM AC tables and updated title.
Reformated the datasheet according to the new layout.
Description
4
Datasheet
38F1020W0YTQ0, 38F1020W0YBQ0
1.0
Introduction
This document contains information pertaining to the Intel
®
Wireless Flash Memory (W18 SCSP);
32-Mbit W18 + 8-Mbit SRAM SCSP device (38F1020W0YTQ0 and 38F1020W0YBQ0). The
intent of this datasheet is to provide information about this SCSP device where it may differ from
the discrete Intel
®
Wireless Flash memory (W18) device. Refer to the
Intel
®
Wireless Flash
Memory (W18) Datasheet
(order number 290701) for information not provided by this document.
1.1
Nomenclature
0x
k
M
Byte
Word
Kword
Mbits
SCSP
Hexadecimal prefix
1000
1,000,000
8 bits
16 bits
1024 words
1,048,576 bits
Stacked Chip Scale Package
1.2
Conventions
Device:
Term used interchangeably throughout this document to denote either a particular die or
both die in the package.
VCC or VPP vs. V
CC
or V
PP
:
When the reference is to signal or package connection name, the
notation will be VCC or VPP. When the reference is to timing or level, the notation will be
subscripted (e.g., V
CC
or V
PP
).
R-OE#, R-LB#, R-UB#, R-WE#:
Used to identify OE#, LB#, UB#, WE#, RAM signals.
Datasheet
5
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