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RMKHT2010E62R6WG

产品描述Fixed Resistor, Thin Film, 1W, 62.6ohm, 300V, 0.05% +/-Tol, 30ppm/Cel, Surface Mount, 2010, CHIP, GREEN
产品类别无源元件    电阻器   
文件大小121KB,共7页
制造商Vishay(威世)
官网地址http://www.vishay.com
标准  
下载文档 详细参数 全文预览

RMKHT2010E62R6WG概述

Fixed Resistor, Thin Film, 1W, 62.6ohm, 300V, 0.05% +/-Tol, 30ppm/Cel, Surface Mount, 2010, CHIP, GREEN

RMKHT2010E62R6WG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1506801552
包装说明CHIP, GREEN
Reach Compliance Codeunknown
ECCN代码EAR99
YTEOL7.45
其他特性HIGH PRECISION
JESD-609代码e4
制造商序列号RMKHT
安装特点SURFACE MOUNT
端子数量2
最高工作温度230 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
额定功率耗散 (P)1 W
额定温度70 °C
电阻62.6 Ω
电阻器类型FIXED RESISTOR
尺寸代码2010
表面贴装YES
技术THIN FILM
温度系数30 ppm/°C
端子面层Gold (Au)
端子形状ONE SURFACE
容差0.05%
工作电压300 V

文档预览

下载PDF文档
RMKHT (CNHT)
www.vishay.com
Vishay Sfernice
High Temperature (230 °C) Wirebondable Thin Film Chip Resistors
and Resistor Networks
FEATURES
• Operating temperature range: - 55 °C; + 215 °C
• Storage temperature: - 55 °C; + 230 °C
• Wirebondable (aluminum pads)
• Aluminum or gold pads
• Large selection of sizes available
• Custom networks available on request (CNHT)
• Temperature coefficient down to 15 ppm/°C
(- 55 °C; + 215 °C)
• Tolerance down to 0.05 %
• Temperature coefficient remains at 15 ppm/°C after long
term storage at 230 °C
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
INTRODUCTION
For applications such as down hole applications, the need
for parts able to withstand very severe conditions
(temperature as high as 215 °C powered or up to 230 °C
un-powered) has leaded Vishay Sfernice to push out the
limit of the thin film technology.
Designers might read the application note “Power
Dissipation Considerations in High Precision Vishay
Sfernice Thin Film Chip Resistors and Arrays
(P, PRA, etc…) (High Temperature Application)
www.vishay.com/doc?53047
in conjunction with this
datasheet to help them to properly design their PCBs and
get the best performances of the RMKHT.
Vishay Sfernice research and development engineers will
be willing to support any customer design considerations.
TYPICAL PERFORMANCE
ABS
TCR
TOL.
25 ppm/°C
ABS
0.05 %
Note
(1)
When applicable (networks only)
TRACKING
(1)
2 ppm/°C
RATIO
(1)
0.02 %
MECHANICAL SPECIFICATIONS
Resistive element
Substrate material
Bonding pads
Passivation
Back metallization
(2)
(2)
Nichrome (NiCr)
Silicon (size 22, 33, 55, 515) - alumina (other sizes)
Aluminum (Al) or gold (Au)
Silicon nitride (Si3N4)
Gold on nickel barrier
Note
When applicable (only on alumina substrate)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
2000
Drift (%)
With Pd (T
j
= 230 °C)
T = 185 °C
T = 200 °C
T = 215 °C
T = 230 °C
4000
6000
8000
t (h)
10 000
12 000
14 000
Note
• TCR (- 55 °C; + 215 °C) remains unchanged after 15 000 h storage
Revision: 26-Mar-13
Document Number: 60075
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

 
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