HD6473048,HD6473048 pdf中文资料,HD6473048引脚图,HD6473048电路-Datasheet-电子工程世界

Datasheet> 器件分类 > HD6473048

文档预览

HD6473048: 产品描述Hitachi Single-Chip Microcomputer; 文件大小2MB，共867页; 制造商Hitachi （Renesas ）; 官网地址http://www.renesas.com/eng/

下载文档全文预览

HD6473048概述

Hitachi Single-Chip Microcomputer

文档预览

下载PDF文档

全文
预览

Hitachi Single-Chip Microcomputer

H8/3048 Series

H8/3048

HD64F3048, HD6473048, HD6433048

H8/3047

HD6433047

H8/3045

HD6433045

H8/3044

HD6433044

Hardware Manual

ADE-602-073B

Preface

The H8/3048 Series is a series of high-performance microcontrollers that integrate system

supporting functions together with an H8/300H CPU core.

The H8/300H CPU has a 32-bit internal architecture with sixteen 16-bit general registers, and a

concise, optimized instruction set designed for speed. It can address a 16-Mbyte linear address

space.

The on-chip supporting functions include ROM, RAM, a 16-bit integrated timer unit (ITU), a

programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial communication

interface (SCI), an A/D converter, a D/A converter, I/O ports, a direct memory access controller

(DMAC), a refresh controller, and other facilities. Of the two SCI channels, one has been

expanded to support the ISO/IEC7816-3 smart card interface. Functions have also been added to

reduce power consumption in battery-powered applications: individual modules can be placed in

standby, and the frequency of the system clock supplied to the chip can be divided down under

software control.

The address space is divided into eight areas. The data bus width and access cycle length can be

selected independently in each area, simplifying the connection of different types of memory.

Seven operating modes (modes 1 to 7) are provided, offering a choice of data bus width and

address space size.

With these features, the H8/3048 Series can be used to implement compact, high-performance

systems easily.

In addition to its masked-ROM versions, the H8/3048 Series has a ZTAT™*

version with user-

programmable on-chip PROM and an F-ZTAT™*

version with on-chip flash memory that can be

programmed on-board. These versions enable users to respond quickly and flexibly to changing

application specifications.

This manual describes the H8/3048 Series hardware. For details of the instruction set, refer to the

H8/300H Series Programming Manual.

Notes: 1. ZTAT™ (Zero Turn-Around-time) is a trademark of Hitachi, Ltd.

2. F-ZTAT™ (Flexible ZTAT) is a trademark of Hitachi, Ltd.

Contents

Section 1

1.1

1.2

1.3

Overview

......................................................................................................

Overview.........................................................................................................................

Block Diagram................................................................................................................

Pin Description ...............................................................................................................

1.3.1

Pin Arrangement.............................................................................................

1.3.2

Pin Assignments in Each Mode......................................................................

1.3.3

Pin Functions ..................................................................................................

Section 2

2.1

CPU

............................................................................................................... 15

2.2

2.3

2.4

2.5

2.6

2.7

2.8

Overview.........................................................................................................................

2.1.1

Features...........................................................................................................

2.1.2

Differences from H8/300 CPU .......................................................................

CPU Operating Modes....................................................................................................

Address Space.................................................................................................................

Register Configuration....................................................................................................

2.4.1

Overview.........................................................................................................

2.4.2

General Registers............................................................................................

2.4.3

Control Registers ............................................................................................

2.4.4

Initial CPU Register Values ............................................................................

Data Formats...................................................................................................................

2.5.1

General Register Data Formats.......................................................................

2.5.2

Memory Data Formats ....................................................................................

Instruction Set.................................................................................................................

2.6.1

Instruction Set Overview ................................................................................

2.6.2

Instructions and Addressing Modes................................................................

2.6.3

Tables of Instructions Classified by Function.................................................

2.6.4

Basic Instruction Formats ...............................................................................

2.6.5

Notes on Use of Bit Manipulation Instructions ..............................................

Addressing Modes and Effective Address Calculation ..................................................

2.7.1

Addressing Modes ..........................................................................................

2.7.2

Effective Address Calculation ........................................................................

Processing States ............................................................................................................

2.8.1

Overview.........................................................................................................

2.8.2

Program Execution State ................................................................................

2.8.3

Exception-Handling State...............................................................................

2.8.4

Exception-Handling Sequences ......................................................................

2.8.5

Bus-Released State .........................................................................................

2.8.6

Reset State ......................................................................................................

2.8.7

Power-Down State ..........................................................................................

2.9

Basic Operational Timing...............................................................................................

2.9.1

Overview.........................................................................................................

2.9.2

On-Chip Memory Access Timing...................................................................

2.9.3

On-Chip Supporting Module Access Timing .................................................

2.9.4

Access to External Address Space..................................................................

Section 3

3.1

MCU Operating Modes

........................................................................... 55

3.2

3.3

3.4

3.5

3.6

Overview.........................................................................................................................

3.1.1

Operating Mode Selection ..............................................................................

3.1.2

Mode Control Register (MDCR) ....................................................................................

System Control Register (SYSCR).................................................................................

Operating Mode Descriptions.........................................................................................

3.4.1

Mode 1 ............................................................................................................

3.4.2

Mode 2 ............................................................................................................

3.4.3

Mode 3 ............................................................................................................

3.4.4

Mode 4 ............................................................................................................

3.4.5

Mode 5 ............................................................................................................

3.4.6

Mode 6 ...........................................................................................................

3.4.7

Mode 7 ...........................................................................................................

Pin Functions in Each Operating Mode..........................................................................

Memory Map in Each Operating Mode..........................................................................

Section 4

4.1

Exception Handling

.................................................................................. 71

4.2

4.3

4.4

4.5

4.6

Overview.........................................................................................................................

4.1.1

Exception Handling Types and Priority..........................................................

4.1.2

Exception Handling Operation .......................................................................

4.1.3

Exception Vector Table...................................................................................

Reset ...............................................................................................................................

4.2.1

Overview.........................................................................................................

4.2.2

Reset Sequence ...............................................................................................

4.2.3

Interrupts after Reset.......................................................................................

Interrupts.........................................................................................................................

Trap Instruction...............................................................................................................

Stack Status after Exception Handling ...........................................................................

Notes on Stack Usage .....................................................................................................

Section 5

5.1

Interrupt Controller

................................................................................... 81

Overview......................................................................................................................... 81

5.1.1

Features........................................................................................................... 81

5.1.2

Block Diagram................................................................................................ 82

5.2

5.3

5.4

5.5

5.1.3

Pin Configuration............................................................................................ 83

5.1.4

Register Descriptions...................................................................................................... 84

5.2.1

System Control Register (SYSCR)................................................................. 84

5.2.2

Interrupt Priority Registers A and B (IPRA, IPRB) ....................................... 85

5.2.3

IRQ Status Register (ISR) .............................................................................. 92

5.2.4

IRQ Enable Register (IER) ............................................................................. 93

5.2.5

IRQ Sense Control Register (ISCR) ............................................................... 94

Interrupt Sources............................................................................................................. 95

5.3.1

External Interrupts .......................................................................................... 95

5.3.2

Internal Interrupts ........................................................................................... 96

5.3.3

Interrupt Vector Table ..................................................................................... 96

Interrupt Operation ......................................................................................................... 100

5.4.1

Interrupt Handling Process ............................................................................. 100

5.4.2

Interrupt Sequence .......................................................................................... 105

5.4.3

Interrupt Response Time................................................................................. 106

Usage Notes .................................................................................................................... 107

5.5.1

Contention between Interrupt and Interrupt-Disabling Instruction ................ 107

5.5.2

Instructions that Inhibit Interrupts .................................................................. 108

5.5.3

Interrupts during EEPMOV Instruction Execution......................................... 108

5.5.4

Notes on External Interrup to during Use....................................................... 108

Section 6

6.1

Bus Controller

............................................................................................ 111

6.2

6.3

Overview......................................................................................................................... 111

6.1.1

Features........................................................................................................... 111

6.1.2

Block Diagram................................................................................................ 112

6.1.3

Input/Output Pins............................................................................................ 113

6.1.4

Register Descriptions...................................................................................................... 114

6.2.1

Bus Width Control Register (ABWCR) ......................................................... 114

6.2.2

Access State Control Register (ASTCR) ........................................................ 115

6.2.3

Wait Control Register (WCR)......................................................................... 116

6.2.4

Wait State Controller Enable Register (WCER)............................................. 117

6.2.5

Bus Release Control Register (BRCR)........................................................... 118

6.2.6

Chip Select Control Register (CSCR) ............................................................ 119

Operation ........................................................................................................................ 121

6.3.1

Area Division.................................................................................................. 121

6.3.2

Chip Select Signals ......................................................................................... 123

6.3.3

Data Bus.......................................................................................................... 124

6.3.4

Bus Control Signal Timing ............................................................................. 125

6.3.5

Wait Modes ..................................................................................................... 133

推荐资源

出MSP430套件: 本帖最后由 yinyue01 于 2017-2-6 11:42 编辑两套板子都是全新未拆封、未使用，后来不用MSP430了，半价出手。西安可同城自取，其他城市邮费10元，支持E金币支付。 1.MSP430口袋实验套件A ......; yinyue01 淘e淘

F2H_SDRAM问题: DE1-SoC板，程序采用avalon mm的Burst方式通讯，有两个模块都要访问DDR3，一读一写。如果都挂在f2h_axi_slave总线上，可以工作。因担心两个模块同时访问导致延时，想让其中一个通过f2h_sdram ......; cncqzxj FPGA/CPLD

NXP MCU开发环境安装提示过期: 566098 566097 请问高手，谁有这款软件的破解文件呀？谢谢！ ...; chenbingjy NXP MCU

是不是我买的开发板子有问题？: 我现在在搞AD转换，交流正弦波。但是出了一个问题：只将波形发生器的地连接上，不用连接信号线，就可以转换了。而且，我仅连接了一个通道，但是所有的16个通道都有值，而且是不断变化 ......; aazz 模拟与混合信号

双电源切换电路纠错: 本帖最后由 huiyu2018 于 2016-11-8 16:51 编辑大家好，最近做一个项目，需要一个双电源切换电路，由于用两个二极管会有较大的压降，而用MOS管会有体二极管无法做到防反，所以想了下面的这 ......; huiyu2018 电源技术

433M无线定位: 可以用433M无线定位吗？ ...; hinii23 无线连接

电动汽车的电磁辐射对人体健康有没有危害

电动汽车产生的电磁辐射对人体伤害大？近段时间，围绕电动汽车电磁辐射的问题引发广泛关注，然而，事实上，公众的认知大多是错误的，对电动汽车的电磁辐射缺乏正确的认知。9月30日，中国汽车工业协会（以下简称“中汽协”）副秘书长许艳华接受媒体专访，用真实的测试数据做出科学判断：电动汽车产生的电磁辐射对人体健康没有危害。我们生活的环境中，可以说电磁辐射无所不在，电动汽车也不例外，甚至传统的燃油车也有电...[详细]
电视常识每日新知：软硬屏区分方法

IPS面板最大的特点就是它的两极都在同一个面上，而不象其它液晶模式的电极是在上下两面，立体排列。该技术把液晶分子的排列方式进行了优化，采取水平排列方式，当遇到外界压力时，分子结构向下稍微下陷，但是整体分子还呈水平状。在遇到外力时，硬屏液晶分子结构坚固性和稳定性远远优于软屏!所以不会产生画面失真和影响画面色彩，可以最大程度的保护画面效果不被损害。 IPS硬屏技术是目前世界上最领先的液晶技术。与...[详细]
硬盘录像机编码融入智能技术解析

DVR市场发展现状 DVR即数字视频录像机，相对于传统的模拟视频录像机，采用硬盘录像，故常常被称为硬盘录像机。它是一套进行图像存储处理的计算机系统，具有对图像/语音进行长时间录像、录音、远程监视和控制的功能。本文重点介绍DVR市场发展现状及未来发展趋势。 DVR市场发展现状伴随着DVR市场规模的扩大，市场的新进者不断增多，这使得DVR市场竞争异常激烈，产品同质化严重。现在随着高清智能摄像机的出...[详细]
语音识别技术原理简介

语音识别技术原理简介自动语音识别技术(Auto Speech Recognize，简称ASR)所要解决的问题是让计算机能够“听懂”人类的语音，将语音中包含的文字信息“提取”出来。ASR技术在“能听会说”的智能计算机系统中扮演着重要角色，相当于给计算机系统安装上“耳朵”，使其具备“能听”的功能，进而实现信息时代利用“语音”这一最自然、最便捷的手段进行人机通信和交互。语音识别技术所面临的问题...[详细]
塔克热系统在中国光博会隆重推出高性能光电应用中的最新主动制冷技术

能够为人工智能算力、智能感测和自动驾驶系统提供精确、高效的热管理 2025年8月25日，中国深圳 – 先进热管理领域的全球头部厂商塔克热系统（Tark Thermal Solutions）（前身为莱尔德热系统，Laird Thermal Systems）将于9月10 - 12日在深圳国际会展中心举行的第二十六届中国国际光电博览会（中国光博会，CIOE 2025...[详细]
盖世汽车供应链：透视中国汽车芯片产业

随着智能电动汽车的快速普及，汽车芯片正从辅助控制单元，跃升为支撑整车智能化的“底座”。其应用范围从动力控制、底盘域、智能座舱、辅助驾驶域延展至整车中央计算平台，构建出一个高算力、高安全、高可靠的硬核体系。在全球芯片巨头如英伟达、高通、英飞凌等持续加码的同时，华为、比亚迪、地平线、黑芝麻智能等本土企业正快速崛起，推动国产替代加速落地。伴随整车架构向中央计算与域控制器转型，汽车芯片的产业链格局正被深...[详细]
单片机stm32的5个时钟源的详细分析

　　众所周知STM32有5个时钟源HSI、HSE、LSI、LSE、PLL，其实他只有四个，因为从上图中可以看到PLL都是由HSI或HSE提供的。　　其中，高速时钟(HSE和HSI)提供给芯片主体的主时钟.低速时钟(LSE和LSI)只是提供给芯片中的RTC(实时时钟)及独立看门狗使用，图中可以看出高速时钟也可以提供给RTC。　　内部时钟是在芯片内部RC振荡器产生的，起振较快，所以时钟在芯片刚上...[详细]
电动汽车是利用发动机来实现12V车载供电吗

电动汽车的12V蓄电池供电并不是依靠发电机，只有燃油动力汽车才会依靠发动机带动发电机在行驶中发电，其作用是为12V车载设备供电；用这种发电即时供电的原因是因为12V蓄电池的容量太小，而且不能依靠外接设备充电。而电动汽车有一组动辄50kwh左右的动力电池组，其容量是燃油动力汽车电池的50~100倍甚至更高，车载12V电子设备的耗电量与容量相比小到几乎可以忽略；而动力电池组可依靠220市电充电，所以...[详细]
为什么焊接工匠都爱助焊剂？揭开回流焊接的秘密

在电子制造过程中，回流焊接是最常用的方法之一，它允许在相对短的时间内焊接大量的元件。然而，任何经验丰富的电子工程师都会告诉你，没有助焊剂，高质量的回流焊接是无法完成的。那么，为什么回流焊接时需要使用助焊剂呢？以下几个方面可以解释这一点。首先，助焊剂的主要功能是帮助焊接材料在被焊接表面上均匀分布。焊接是一个涉及熔化金属并使其重新固化的过程。如果金属在固化之前不能均匀分布在被焊接表面上，焊接质...[详细]
基于iGaN的300W高能效游戏适配器参考设计

在科技演进浪潮中，能源技术已逐渐成为现代产业发展的核心驱动力。从移动设备到云服务器，从电动车到智慧城市，科技产品日益强调效能、速度与可持续能源的平衡，而这一切的背后都需要更高效、更稳定的电源转换技术。随着各种应用对能源效率与功率密度的要求不断提高，传统以硅（Silicon, Si）为基础的功率元件正面临物理与性能的极限挑战。这也促使业界开始寻求更具潜力的新型材料，其中氮化镓（Gallium...[详细]
全球电动汽车电池供需失衡：供应或达需求三倍以上

据日经新闻报道，调查发现，由于电动汽车需求降温，全球电动汽车电池供应量有望达到需求量的三倍以上，这为日本和美国等国家建立本土生产的举措带来了阻力。图片来源：宁德时代基于标普全球移动出行（S&P Global Mobility）的数据，日经新闻指出，电动汽车电池生产设施的总年产能预计将达到3,930 GWh，而需求量预计为1,161 GWh。到2026年，电动汽车电池供...[详细]
10000台！这家公司拿下全球首个人形机器人最大单笔订单

天太机器人官微8月20日晚间发布消息，天太机器人有限公司8月20日与山东未来机器人技术有限公司、山东未来数据科技、港仔机器人集团等战略合作伙伴，共同签署全球首个具身智能人形机器人10000台订单，这是全球人形机器人行业诞生以来数量最大的单笔订单。这意味着，曾被视作“科幻”的人形机器人，正式走出实验室、跨越概念阶段，作为一种可量产、可交付、可解决实际问题的生产力工具，浩浩荡荡地涌入现实世界的...[详细]
关于STM32单片机的IAP实现

一、基础概念什么是IAP？IAP即在应用中编程(In-Application Programming IAP)，简单的说就像是一个用户自定义的升级程序。实际上，STM32单片机的程序烧写有多种方法，可以用JTAG，也可用串口通过ISP软件烧写新程序。 JTAG的方式需要专用的烧写工具，在产品布置到现场后，更新产品程序比较麻烦，而通过串口的ISP软件升级方法可以直接使用常见的串口线升级程序，十...[详细]
电动汽车的轻量化可从哪些途径来实现

汽车轻量化对于汽车来说还是一个比较陌生的一个词汇，随着对环保要求的不断提高，相关法规对于车辆更低油耗也提出了更高的标准，轻量化成为了汽车降低油耗和电动汽车增加续航里程的一种途径，根据目前市面上大多数轻量化设计的车型来看，在不涉及到安全的问题的情况下面，轻量化可以从车身的材料上面，和车辆的结构设计上面去进行实现，车辆的轻量化也是必然的趋势。对于车身材料而言，就更加的要进行着重的考虑了，首先不...[详细]
插电式混合动力汽车在冬季使用时有哪些注意事项

很多时候我们都会听说，纯电动汽车在冬季的时候使用需要注意什么样的问题，甚至很多车主都会去做相关的攻略，如对于车辆采取“随用随充”原则，车辆使用完毕后立即进行充电，因为此时电池温度相对较高，可以提高充电效率。另外也会提前为出行做一些规划，避免续航里程不够的情况，甚至在出行的不敢开空调来进行取暖。由于纯电动汽车设计的原因，在冬天使用空调取暖的，是相当耗电的，另一个方面用开空调出热风慢也是一个方...[详细]

器件捷径: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多