5081
SMT Board-to-Board Verbinder - RM 0.80mm
SMT Board-to-Board-Connectors - 0,80mm Pitch
Technische Daten /Technical
Data
Isolierkörper
Thermoplastischer Kunststoff, nach UL94 V-0
Insulator
Thermoplastic, rated UL94 V-0
Farbe
Weiss
Colour
White
Kontaktmaterial
Phosphorbronze
Contact Material
Phosphor bronze
Kontaktoberfläche
Lt. Oberflächenoptionen, über Ni
Contact Surface
Acc. to options (see below), over Ni
Lötbarkeit
IEC512-12A
Solderability
IEC512-12A
Durchgangswiderstand
< 20mΩ
Contact Resistance
< 20mΩ
9
Isolationswiderstand
> 1x10
Ω
9
Insulation Resistance
> 1x10
Ω
Spannungsfestigkeit
300V
AC/DC
Test Voltage
300V
AC/DC
Nennstrom
0,5A
Current Rating
0,5A
Temperaturbereich
-40°C ... +105°C
Temperature Range
-40°C ... +105°C
Verarbeitung
Reflow-Lötverfahren; weitere Informationen in Kapitel T
Processing
Reflow-soldering, detailed information in ch. T
Series
Type
*
Contacts
*
Plating
*
Packing
*
5081
Stiftleiste
Plug
01
01
L=2.80 L1=1.80 L2=1.35
02
L=3.30 L1=1.80 L2=1.35
03
L=3.80 L1=1.80 L2=1.35
04
L=4.30 L1=2.30 L2=1.35
05
L=4.80 L1=2.30 L2=1.35
06
L=5.30 L1=2.30 L2=1.35
07
L=5.30 L1=2.30 L2=1.25
40
08-50
00
00
Vergoldet
Gold plated
ST
ST
TR
TEL.: +49 5223 98507-0
FAX.: +49 5223 98507-50
E-MAIL: sales@wppro.com
INTERNET: www.wppro.com
1
© W+P PRODUCTS
5081
SMT Board-to-Board Verbinder - RM 0.80mm
SMT Board-to-Board-Connectors - 0,80mm Pitch
Mating
Heights:
Male
Type 01
Type 02
Type 03
Type 04
Type 05
Type 06
Type 07
Type 08
4,00mm
4,50mm
5,00mm
-
-
-
-
-
-
-
5,50mm
6,00mm
6,50mm
-
Female
Type 09
Type 10
-
-
-
-
-
7,00mm
-
Type 11
-
-
-
-
-
-
7,00mm
Series
Type
*
Contacts
*
Plating
Packing
*
5081
Buchsenkontakt
Socket
08
08
L=2.90 L1=1.65
09
L=3.40 L1=1.65
10
L=3.90 L1=1.65
11
L=3.90 L1=1.25
40
08-50
00
00
Vergoldet
Gold plated
ST
ST
TR
(
*
Bestellbeispiel - Bitte durch Ihre
Spezifikationen ersetzen.
*
Order example - To be replaced by your
specifications.)
TEL.: +49 5223 98507-0
FAX.: +49 5223 98507-50
2
Lieferformen /
Packing Options:
ST
= In Stangen /
In tubes
TR
= Tape & Reel /
Tape & Reel
ST
= In Stangen /
In tubes
TR
= Tape & Reel /
Tape & Reel
E-MAIL: sales@wppro.com
INTERNET: www.wppro.com
Informationen zum Reflow-Lötverfahren
Reflow-Soldering Information
Reflow-Lötverfahren
Reflow-Soldering
Bauteile sollten gemäß folgendem Temperatur-Profil in
Anlehnung an die IPC/JEDEC J-STD-020C für bleifreies
Löten im Reflowverfahren verarbeitet werden (Maximalwerte)
Profil Eigenschaft
Durchschnitts-Ramp-Up Rate (Ts
max
to Tp)
Vorheizen
- Temperatur Min (Ts
min
)
- Temperatur Max (Ts
max
)
- Zeit (ts
min
auf ts
max
)
Verbleiben oberhalb:
- Temperatur (T
L
)
- Zeit (t
L
)
Peak/Klassifizierung Temperatur (Tp)
Zeit innerhalb von 5°C um die Peak-Temperatur (tp)
Ramp-Down Rate
Zeit von 25°C bis zur Peak-Temperatur
Bleifreies Löten
3°C / Sek. Max.
150°C
200°C
60-180 Sekunden
217°C
60-180 Sekunden
260°C +/- 5°C
20-40 Sekunden
6°C / Sekunde max.
8 Minuten max.
Items should be soldered according to IPC/JEDEC J-
STD-020C temperature-profile for leadfree reflow-soldering
(maximum values):
Profile Feature
Average Ramp-Up Rate (Ts
max
to Tp)
Preheat
- Temperature Min (Ts
min
)
- Temperature Max (Ts
max
)
- Time (ts
min
auf ts
max
)
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
Peak/Classification Temperature (Tp)
Time within 5°C of actual Peak-Temperature (tp)
Ramp-Down Rate
Time 25°C to Peak Temperature
PB-Free assembly
3°C / second max.
150°C
200°C
60-180 seconds
217°C
60-180 seconds
260°C +/- 5°C
20-40 seconds
6°C / second max.
8 minutes max.
Empfohlenes Reflow-Lötprofil:
Recommended Reflow-Soldering profile:
TEL.: +49 5223 98507-0
FAX.: +49 5223 98507-50
E-MAIL: sales@wppro.com
INTERNET: www.wppro.com
3
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