电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1808AA121KAZ9A

产品描述CAPACITOR, CERAMIC, MULTILAYER, 1000V, C0G, 0.00012uF, SURFACE MOUNT, 1808, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小52KB,共2页
制造商AVX
标准  
下载文档 详细参数 全文预览

1808AA121KAZ9A概述

CAPACITOR, CERAMIC, MULTILAYER, 1000V, C0G, 0.00012uF, SURFACE MOUNT, 1808, CHIP, ROHS COMPLIANT

1808AA121KAZ9A规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1852727788
包装说明, 1808
Reach Compliance Codecompliant
ECCN代码EAR99
电容0.00012 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度2.03 mm
JESD-609代码e3
长度4.57 mm
制造商序列号1808
安装特点SURFACE MOUNT
多层Yes
负容差10%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法BULK
正容差10%
额定(直流)电压(URdc)1000 V
系列SIZE(FLEXITERM)HV
尺寸代码1808
表面贴装YES
温度特性代码C0G
温度系数30ppm/Cel ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状WRAPAROUND
宽度2.03 mm

文档预览

下载PDF文档
High Voltage MLC Chips FLEXITERM
®
For 600V to 3000V Applications
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chips capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/DC blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
To make high voltage chips, larger physical sizes than are normally
encountered are necessary. These larger sizes require that special pre-
cautions be taken in applying these chips in surface mount assemblies.
In response to this, and to follow from the success of the FLEXITERM
®
range of low voltage parts, AVX is delighted to offer a FLEXITERM
®
high
voltage range of capacitors, FLEXITERM
®
.
The FLEXITERM
®
layer is designed to enhance the mechanical flexure
and temperature cycling performance of a standard ceramic capacitor,
giving customers a solution where board flexure or temperature cycle
damage are concerns.
HOW TO ORDER
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
***
A
Voltage
600V/630V =
1000V =
1500V =
2000V =
2500V =
3000V =
C
A
S
G
W
H
C
272
K
A
Test Level
Z
Termination*
Z = FLEXITERM
®
100% Tin
(RoHS Compliant)
1
A
Temperature Capacitance Code Capacitance
Coefficient
(2 significant digits
Tolerance
C0G = A
+ no. of zeros)
C0G: J = ±5%
X7R = C
Examples:
K = ±10%
10 pF = 100
M = ±20%
100 pF = 101 X7R: K = ±10%
1,000 pF = 102
M = ±20%
22,000 pF = 223
Z = +80%,
220,000 pF = 224
-20%
1 μF = 105
Packaging
Special
1 = 7" Reel
Code
3 = 13" Reel A = Standard
9 = Bulk
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
***
AVX offers nonstandard chip sizes. Contact factory for details.
W
L
T
t
DIMENSIONS
SIZE
(L) Length
0805
1206
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
1.52
(0.060)
0.25 (0.010)
0.75 (0.030)
1210*
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
1.70
(0.067)
0.25 (0.010)
0.75 (0.030)
1808*
4.57 ± 0.25
(0.180 ± 0.010)
2.03 ± 0.25
(0.080 ± 0.010)
2.03
(0.080)
0.25 (0.010)
1.02 (0.040)
1812*
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
1825*
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.30
(0.252 ± 0.012)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
2.01 ± 0.20
(0.079 ± 0.008)
(W) Width
1.25 ± 0.20
(0.049 ± 0.008)
(T) Thickness
1.30
Max.
(0.051)
(t) terminal min. 0.50 ± 0.25
max. (0.020 ± 0.010)
*Reflow Soldering Only
millimeters (inches)
2220*
5.7 ± 0.40
(0.224 ± 0.016)
5.0 ± 0.40
(0.197 ± 0.016)
3.30
(0.130)
0.25 (0.010)
1.02 (0.040)
2225*
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
91
pic18f4520开发板制作
本人初学pic单片机,希望自己做一块单片学习板,但鉴于初学,不知道如何设计,能有些什么功能,希望哪位大神赐我一张功能齐全的学习板原理图,如果有pcb文件我会眼泪鼻涕一起流的感激您,帮帮小 ......
nishi666 Microchip MCU
关于COM1端口的问题
我是台式机 主板intel915GAV 后面有串口的 但是在设备管理器里找不到COM1 和COM2 只有打印机那个口 更新了BIOS 也装了主板的驱动 怎么回事哦 平时都没有用过那个口 应该不会坏了吧 还指望这个CO ......
nibuhao123 嵌入式系统
TI SYSBIOS v6.34 Real-time Operating System User's guided做boot的朋友可以研究下
感觉挺不错的!没事大家可以研究下!对做boot应该有好处!!!...
wuyanyanke 微控制器 MCU
人工神经网络在ARM平台上的应用.pdf
人工神经网络在ARM平台上的应用.pdf 如题...
ulan ARM技术
大家几号开始放假啊?
我26号就可以放假咯!...
蓝雨夜 聊聊、笑笑、闹闹
在嵌入式开发中应该这样理解嵌入式C编程
一、新手常常问的一个问题:C语言和嵌入式C编程有什么区别?而嵌入式工程师一般都会告诉你,其区别在于嵌入式的C语言是跑在嵌入式的开发板上的,CPU和电脑不一样,所以编译器也是不一样的,生成 ......
error_echo 编程基础

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1840  360  90  1040  2805  38  8  2  21  57 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved