HCC Series-High Capacitance MLCC
Holy Stone
Multilayer Ceramic Chip Capacitors
[ High Capacitance MLCC–More Than 1.0uF ]
HCC
Series – X7R,X6S,X5R,Y5V
Features.
Surface mount suited for wave and reflow
soldering
High reliability and no polarity
Small size and high capacitance value
Excellent in high frequency characteristic
RoHS compliant
Summary of Specification
X7R Dielectric Characteristic
Operation Temperature :
-55~+125
Temperature Coefficient :
15% under -55~+125 (EIA Class
Capacitance Range
1.0uF to 22uF
Dissipation Factor :
Please see HEC specification data sheet
Insulation Resistance :
10G or 500/C whichever is smaller
Aging :
2.5 % per decade hr , typical
Dielectric Strength :
250% Rated Voltage
X6S Dielectric Characteristic
Operation Temperature :
-55~+105
Temperature Coefficient :
22% under -55~+105 (EIA Class
Capacitance Range
1.0uF to 22uF
Dissipation Factor :
Please see HEC specification data sheet
Insulation Resistance :
10G or 500/C whichever is smaller
Aging :
2.5 % per decade hr , typical
Dielectric Strength :
250% Rated Voltage
X5R Dielectric Characteristic
Operation Temperature :
-55~+85
Temperature Coefficient :
15% under -55~+85 (EIA Class
Capacitance Range
1.0uF to 100uF
Dissipation Factor :
Please see HEC specification data sheet
Insulation Resistance :
10G or 500/C whichever is smaller
Aging :
2.5 % per decade hr , typical
Dielectric Strength :
250% Rated Voltage
Y5V Dielectric Characteristic
Operation Temperature :
-30~+85
Temperature Coefficient : +22/ -82 %, -30~+85 (EIA Class
Capacitance Range
1.0uF to 47uF
Dissipation Factor :
Please see HEC specification data sheet.
Insulation Resistance :
10G or 500/C whichever is smaller
Aging :
7.0 % per decade hr , typical
Dielectric Strength :
250% Rated Voltage
X7R of Temperature Coefficient
20
15
10
5
0
-5
-10
-15
-20
-55 -40 -25 -10 5
20 35 50 65 80 95 110 125
Temperature
Application
Ideal for smoothing and decoupling circuits
Suitable for DC-DC converter, personal
computer and peripherals, telecommunication
and general electronic equipment
Capacitance Change (%)
Capacitance Change (%)
Capacitance Change (%)
Capacitance Change (%)
- 31 -
)Ⅱ
)Ⅱ
)Ⅱ
)Ⅱ
℃
℃
℃
℃
Ω
Ω
Ω
Ω
℃
℃
℃
℃
Ω
Ω
Ω
Ω
≦
≦
≦
≦
±
±
±
X6S of Temperature Coefficient
25
20
15
10
5
0
-5
-10
-15
-20
-25
-55
-35
-15
5
25
45
Temperature
65
85
105
20
15
10
5
0
-5
-10
-15
-20
-55
X5R of Temperature Coefficient
-35
-15
5
25
Temperature
45
65
85
Y5V of Temperature Coefficient
40
20
0
-20
-40
-60
-80
-100
-30 -20 -10
0
10 20 30 40 50 60 70 80
Temperature
HCC Series-High Capacitance MLCC
Holy Stone
Dimension
BW
B
TYPE
0402
T
0603
0805
W
L
1206
1210
1812
2220
L
1.00 0.05
1.60 0.10
2.00 0.20
3.20 0.30
3.20 0.30
4.60 0.3
W
0.50 0.05
[.020 .002
]
0.80 0.10
[.031 .004
]
1.25 0.20
[.049 .008
]
1.60 0.20
[.126 .012]
[.098 .008]
[.126 .012]
[.197 .016]
Unit : mm [inches]
T (max)
0.55
[.022]
[.035]
[.057]
[.071]
[.102]
[.118]
[.118]
Characteristic
X7R(X) Series
10000
1000
100
Impedance & ESR Characteristic
X5R(B) Series
1000
100
Z 0805/105
(ohm)
10
1
0.1
0.01
0.001
0.1
1
10
100
1000
Frequency (KHz)
10000
100000
10
Z 0805/225
(ohm)
1
0.1
ESR 0805/105
ESR 0805/225
0.01
0.001
0.1
Y5V(Y) Series
10000
1000
100
Impedance & ESR Characteristic
X6S(S) Series
1000
100
Z 0805/105
Z 0805/106
(ohm)
10
1
0.1
(ohm)
10
1
0.1
0.01
0.001
0.1
1
ESR 0805/105
ESR 0805/106
0.01
0.001
10
100
1000
Frequency (KHz)
10000
100000
0.1
How To Order
C
C
Product Code
C: MLCC
(Multilayer
Ceramic
Chip of
Capacitor)
0805
0805
Chip Size
0402 :
1.0×0.50 mm
0603 :
1.6×0.80 mm
0805 :
2.0×1.25 mm
1206 :
3.2×1.6 mm
1210 :
3.2×2.5 mm
B
B
Dielectric
Ex.:
X:X7R
S:X6S
B:X5R
Y:Y5V
106
106
Capacitance
Unit : pF
Ex.:
105:10×10
5
106:10×10
6
226:22×10
6
M
M
Tolerance
Ex.:
J : +/- 5%
K: +/- 10%
M:+/- 20%
Z :+80/-20%
010
010
Rated Voltage
Ex.:
004: 4Vdc
007: 6.3Vdc
010: 10Vdc
016: 16Vdc
025: 25Vdc
035: 35Vdc
050: 50Vdc
T
T
Packaging
T: Taping
& Reel
B: Bulk
- 32 -
±
[.220 .016]
±
5.7 0.40
±
5.00 0.40
±
[.181 .012]
3.20 0.3
±
±
[.126 .012]
2.50 0.20
±
±
[.126 .012]
±
[.079 .012]
±
[.063 .004]
±
[.039 .002]
B (min)
0.30
[.012]
[.016]
[.028]
[.059]
[.063]
[.098]
[.137]
BW (min)
0.15
[.006]
[.006]
[.008]
[.012]
[.012]
[.012]
[.012]
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
0.90
1.45
1.80
2.60
3.00
3.00
0.40
0.70
1.50
1.60
2.50
3.50
0.15
0.20
0.30
0.30
0.30
0.30
±
Impedance & ESR Characteristic
Z 0805/475
Z 0805/106
ESR 0805/475
ESR 0805/106
1
10
100
1000
Frequency (KHz)
10000
100000
Impadance/ESR & Frequency
Z 0805/105
Z 0805/225
ESR 0805/105
ESR 0805/225
1
10
100
1000
Frequency (KHz)
10000
100000
HCC Series-High Capacitance MLCC
Holy Stone
Capacitance Range
X7R (X) Series
Size
0603
0805
1206
1210
18122220
Code 6.3V 10V 16V 6.3V 10V 16V 25V 10V 16V 25V 35V 50V 10V 16V 25V 35V 35V 35V
105
B
B
B
D
D
D
E
E
E
E
E
E
E
F
F
155
F
F
225
B
B
D
D
D
E
E
E
E E/F F
F
F
335
D
D
E
E
F
475
D
D
D
E
E
E
E
F
F
F
106
D
E
E
E
E
F
G
226
G
X6S (S) Series
Size 0402
0603
0805
1206
1210
Code 6.3V 6.3V 10V 16V 25V 6.3V 10V 16V 25V 6.3V 10V 16V 25V 35V 50V 10V 16V 25V 50V
105
O
B
B
B
B
D
D
E
E
F
225
B
B
D
D
D
E
E
F
475
B
D
D
D
D
E
E
E
F
F
106
D
D
E
E
E
F
F
G
226
D
E
G G
X5R (B) Series
Size
0402
0603
0805
1206
1210
Code 6.3V 10V 4V 6.3V 10V 16V 25V 4V 6.3V 10V 16V 25V 6.3V 10V 16V 25V 35V 50V 6.3V 10V 16V 25V 35V
105
O
O
B
B
B
B
D
D
D
E
E
E
E
F
155
E
225
O
B
B
B
D
D
D
D
E
E
E
E E/F F
335
D
D
D
D
E
E
E
475
B
B
D
D
D
D
E
E
E
E
F
F
F
F
106
B
B
D
D
D
E
E
E
E
F
F
G F/G
226
D
D
E
E
E
G G G
G
476
E
E
G G
107
G
Y5V (Y) Series
Size
0402
0603
0805
1206
1210
1812
Code 6.3V 10V 6.3 10V 16V 25V 6.3V 10V 16V 25V 50V 10V 16V 25V 35V 50V 6.3V 10V 16V 25V 35V 50V 35V 50V
105
O
O
B
B
B
B
B
D
B
D
D
D
225
B
B
B
D
D
D
B
D
D
475
B
B
D
D
D
D
D
F
F
F
F
106
D
D
D
D D/E D/E
E
F
F
F
F
F
226
D
D D/E
F
F
F
F
476
F
F
107
G
Symbol Code
S
O
A
B
C
D
E
F
G
H
Thickness(mm) 0.3±0.03 0.5±0.05 0.6±0.1 0.85±0.1 1.0±0.1 1.25±0.15 1.6±0.2 2.0±0.2
2.4±0.2 2.8±0.2
Other dimensions, capacitance values and voltages rating are available. Please contact HEC.
- 33 -
HCC Series-High Capacitance MLCC
Holy Stone
HCC Series Specification & Test Condition
Item
Operation
Temperature
Specification
Test Condition
Visual
Capacitance
Dissipation Factor
No abnormal exterior appearance
Within the specified tolerance
Perform a heat temperature at 150 5 for
30min. then place at room temp. for 24 2hr.
Insulation
Resistance
10,000M or 500/C
whichever is smaller
for rated voltage>10V and greater 100/C
for rated voltage≤10V.
No dielectric breakdown or mechanical
breakdown
Char.
X7R (X)
X6S (S)
X5R (B)
Y5V (Y)
Temp. Range
-55 ~ +125
-55 ~ +105
-55 ~ +85
-30 ~ +85
Cap. Change
15%
22%
15%
+22/-82%
Applied Voltage : Rated Voltage
Charge Time : 60 5 sec.
Charge-Discharge current shall be less than
50mA current.
250% of the rated voltage for 1~5 sec.
Current is limited to less than 50mA
(C2-C1)/C1 × 100%
C1:Capacitance At Standard Temperature (25
C2:Capacitance At Test Temperature
Withstanding
Voltage
Temperature
Capacitance
Coefficient
The detail condition please see HEC specification
data sheet.
A 5N⋅f (≈ 0.5Kg⋅f) pull force
Resistance to
Flexure of
Substrate
No mechanical damage or capacitance change
more than the following table.
Char.
X7R(X)
X6S(S)
X5R(B)
Y5V(Y)
Capacitance Change
12.5% of initial value
12.5% of initial value
12.5% of initial value
30.0% of initial value
The board shall be bend 1.0mm with a rate of
1.0 mm/sec.
R230
Bending
Limit
C Meter
- 34 -
℃ ±
Solderability
℃
±
±
More than 90% of the terminal surface is to be
soldered newly, so metal part does not come
out or dissolve .
Solder Temperature : 245 5
Dip Time : 5 0.5 sec.
Immersing Speed : 25 10% mm/s
Solder : H63A
Flux
:Rosin
Preheat : At 80~120
For 10~30sec.
±
45 1mm
45 1mm
±
Adhesive Strength
of Termination
No indication of peeling shall occur on the
terminal electrode.
5N⋅f
shall be applied for 10 1 sec.
℃
±
℃
±
±
±
Please see HEC specification data sheet for
details
C>10uF
120Hz 20%
0.5 0.2Vrms
±
±
±
±
≦
℃
℃
℃
℃
±
±
±
℃
℃
℃
℃
℃
℃
℃
℃
Char.
X7R (X)
X6S (S)
X5R (B)
Y5V (Y)
Operation Temp.
-55 ~ +125
-55 ~ +105
-55 ~ +85
-30 ~ +85
Visual Inspection
Capacitance
C
10uF
Frequency
1KHz 10%
Voltage
1.0 0.2Vrms
±≦
±≦
±≦
±≦
℃
℃
℃
℃
)
HCC Series-High Capacitance MLCC
Holy Stone
HCC Series Specification & Test Condition
Item
Resistance to
Soldering Heat
Specification
Appearance
Capacitance
No mechanical damage shall
occur
Test Condition
Class capacitor shall be set for 48 4 hours at
room temperature after one hour heat treatment
at 150 +0/-10 before initial measure.
Preheat : at 150 10°C for 60~120sec.
Dip : solder temperature of 260 5
Dip Time : 10 1sec.
Immersing Speed : 25 10% mm/s
Solder : H63A
Flux
: Rosin
Measure at room temperature after cooling for
48 4 Hours
Class capacitor shall be set for 48 4 hours
at room temperature after one hour heat
before initial
treatment at 150 +0/-10
measure.
Capacitor shall be subjected to five cycles of
the temperature cycle as following:
Step
Temp.( )
Time(min)
1
Min Rated Temp.+0/-3
30
2
25
3
3
Max Rated Temp.+3/-0
30
4
25
3
Measure at room temperature after cooling for
48 4 Hours
Class capacitor shall be set for 48 4 hours at
room temperature after one hour heat treatment
at 150 +0/-10 before initial measure.
Temperature : 40 2
Relative Humidity : 90 ~95%RH
Test Time : 500 +12/-0 hr
Measure at room temperature after cooling for
48 4 Hours
Tanδ
Insulation
Resistance
Temperature
Cycle
Appearance
Capacitance
To satisfy the specified initial
value
To satisfy the specified initial
value
No mechanical damage shall
occur
Char.
X7R(X)
X6S(S)
X5R(B)
Y5V(Y)
≤
≤
≤
≤
Cap. change
7.5% of initial value
7.5% of initial value
7.5% of initial value
20% of initial value
Tanδ
Insulation
Resistance
To satisfy the specified initial
value
To satisfy the specified initial
value
Capacitance
Tanδ
Insulation
Resistance
Please see HEC specification
data sheet for details
1,000M or 50/C
whichever is
smaller for rated voltage>10V
and greater 10/C for rated
voltage 10V.
(C in Farad)
- 35 -
±
±
±
±
±
±
≤
≤
≤
≤
℃
Char.
X7R(X)
X6S(S)
X5R(B)
Y5V(Y)
Cap. change
12.5% of initial value
12.5% of initial value
12.5% of initial value
30% of initial value
±
℃
Ⅱ
Humidity
Appearance
No mechanical damage shall
occur
±
℃ ±
℃
±
℃
±
±
Ⅱ
±
±
±
±
±
±
±
±
±
±
≤
≤
≤
≤
℃
Char.
X7R(X)
X6S(S)
X5R(B)
Y5V(Y)
Cap. change
7.5% of initial value
7.5% of initial value
7.5% of initial value
20% of initial value
±
Ⅱ
≦
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