4
THIS DRAWING IS UNPUBLISHED.
RELEASED FOR PUBLICATION
TE CONNECTIVITY
ALL RIGHTS RESERVED.
2011
3
2
LOC
DIST
1
C
COPYRIGHT
2011
IR
10
1,5±0,8
-
REVISIONS
P
LTR
DESCRIPTION
DATE
DWN
APVD
AA
PIN 1
Z
HOUSING RIB STRENGTHENED AND RAWMATERIAL CHANGED TO PA4T
06JAN2012
13JUN2016
PS
AD
RRP
SH
ECO-16-001320
5
D
1.27
TYP.
NOTES:
1
D
TOLERANCES UNLESS OTHERWISE SPECIFIED: # 0.15.
CONTACT PLATING:
OVERALL:
Ni 1.27µm MIN. ALL OVER THE CONTACTS
SOLDER ZONE: Sn 3.5-5.0µm ON THE SOLDER ZONE OF THE CONTACT
MATING ZONE: PLATING CONFIRMS TO PRODUCT REQUIREMENTS
AS PER SPECIFICATION 108-19117
MATERIALS:
HOUSING:
30% G.F. LCP COLOR BLACK, UL 94V-0.
CONTACTS:
PHOSPHOR BRONZE
SOLDER BRACKET:
TIN PLATED BRASS WITH NICKEL UNDERPLATE.
THIS JACK CAN ALSO BE APPLIED HANGING THROUGH A HOLE,
IN A PRINTED CIRCUIT BOARD. SEE LEFT PCB LAYOUT.
SURFACE CAN
TYPE II SMD
MEASURED AT
COPLANARITY
BE USED FOR PICKING THE MODULAR JACK WITH,
MACHINE.
HEEL OF CONTACTS
AT TIPS OF CONTACTS MAX. 0.18mm
13.35±0.10
5.60
7.8
+0.10
0
5
11,5
2
3
1,4±0,8
4
5
2.2
REF.
4.6
3.4
5
6
7
8
14.0
TAPE AND REEL PACKAGING ACCORDING TO EIA 481-3
SPECIFICATIONS.
INCLUDES KAPTON TAPE (10x11,5mm)
ON TOP SURFACE AS PICK AND PLACE FEATURE.
OBSOLETE PARTS: OBSOLETE CIS STREAMLINING PER D.RENAUD/D.SINSI
C
2
C
9
2.3
12.7
11.8
6.75
B
8.0
2.5
5
2.2
0.10
6.8 x7.2mm
SECTION
1.5
6
A-A
0.10
B
19.4
2.8
0.6
0.4
14.6
REQUIRED SOLDER PASTE
THICKNESS 0.1mm MIN.
19.4
4.5
0.6
1.27
TYP.
REQUIRED SOLDER PASTE
THICKNESS 0.1mm MIN.
9
3.2
4 POS./4 CONT.
4 POS./4 CONT.
750 PCS ON n 560 mm OD REEL.
BOTTOM ENTRY ORIENTATION PER DETAIL B2
750 PCS ON n 560 mm OD REEL.
TOP ENTRY ORIENTATION PER DETAIL B1
300 PCS ON n 360 mm OD REEL.
TOP ENTRY ORIENTATION PER DETAIL B1
300 PCS ON n 360 mm OD REEL.
BOTTOM ENTRY ORIENTATION PER DETAIL B2
300 PCS ON n 360 mm OD REEL.
TOP ENTRY ORIENTATION PER DETAIL B1
2-338084-5
2-338084-3
8 1-338084-6
1-338084-5
1-338084-3
PART NUMBER
TE Connectivity
PAD FOR
PIN 1
1.27
TYP.
4 POS./4 CONT.
9
4 POS./4 CONT.
4 POS./4 CONT.
REMARKS
THIS DRAWING IS A CONTROLLED DOCUMENT.
8.8
2.5
13.8 ±0.1
8.8
2.5
DWN
CHK
PACKAGING
A
0.70
4 PLC
E.v.ELJK
E.STELLINGA
30-Sep-96
DEC.'96
7
0.7
4 PLC
DIMENSIONS:
mm
TOLERANCES UNLESS
OTHERWISE SPECIFIED:
APVD
0.4R MAX.
HOLE FOR BOTTOM
ENTRY APPLICATION
PAD FOR PIN 1
DASHLINE INDICATES OUTLINE
OF JACK, CONTACTS AND BRACKET
PRINTED CIRCUIT BOARD LAYOUT (TOP ENTRY APPL.)
MATERIAL
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
FINISH
-
-
-
-
-
PRODUCT SPEC
R.SMEETS
-
NAME
A
APPLICATION SPEC
108-19117
114-19041
1.92 gr
INVERTIBLE MODULAR JACK, 4 POSITION
HANDSET
SURFACE MOUNT APPLICATION
SIZE
CAGE CODE
DRAWING NO
-
WEIGHT
PRINTED CIRCUIT BOARD LAYOUT (BOTTOM ENTRY APPL.)
1471-9 (3/11)
SEE NOTE 3
-
SEE NOTE 2
-
CUSTOMER DRAWING
A2
00779
RESTRICTED TO
338084
SCALE
5:1
SHEET
1
OF
2
REV
-
AA
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
