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M55342K08U287DC-TR

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.8W, 287ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP
产品类别无源元件    电阻器   
文件大小102KB,共1页
制造商State of the Art Inc
下载文档 详细参数 全文预览

M55342K08U287DC-TR概述

Fixed Resistor, Metal Glaze/thick Film, 0.8W, 287ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP

M55342K08U287DC-TR规格参数

参数名称属性值
是否Rohs认证不符合
Objectid1950726532
包装说明CHIP
Reach Compliance Codenot_compliant
Country Of OriginUSA
YTEOL5.85
构造Chip
JESD-609代码e4
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
最低工作温度-55 °C
封装高度0.64 mm
封装长度5.13 mm
封装形状RECTANGULAR PACKAGE
封装形式SMT
封装宽度2.38 mm
包装方法TR
额定功率耗散 (P)0.8 W
额定温度70 °C
参考标准MIL-PRF-55342
电阻287 Ω
电阻器类型FIXED RESISTOR
尺寸代码2010
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子面层Platinum/Gold (Pt/Au)
端子形状WRAPAROUND
容差1%
工作电压150 V

M55342K08U287DC-TR文档预览

State of the Art, Inc.
Thick Film Chip Resistor
M55342/08 RM 2010
CURRENT NOISE
TEMPERATURE RISE (°C)
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
800 mW
150 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 K 08 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
G: Gold wraparound
W: Gold wire bondable
SIZE CODE: /08 = RM2010
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
MECHANICAL
INCHES
MILLIMETERS
.252
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.202 (.191 - .218)
.094 (.093 - .103)
.025 (.015 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.164 (.160 - .168)
.0323 grams
5.13
2.38
0.64
0.51
0.48
4.17
(4.85 - 5.54)
(2.36 - 2.62)
(0.38 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(4.06 - 4.27)
.100
.154
.049
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
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