电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

4311T-101-3281BBL

产品描述Array/Network Resistor, Bussed, Thin Film, 1.38W, 50V, 0.1% +/-Tol, 50ppm/Cel, Through Hole Mount, SIP, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小198KB,共2页
制造商Bourns
官网地址http://www.bourns.com
标准  
下载文档 详细参数 全文预览

4311T-101-3281BBL概述

Array/Network Resistor, Bussed, Thin Film, 1.38W, 50V, 0.1% +/-Tol, 50ppm/Cel, Through Hole Mount, SIP, ROHS COMPLIANT

4311T-101-3281BBL规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1998843239
包装说明SIP, ROHS COMPLIANT
Reach Compliance Codenot_compliant
ECCN代码EAR99
元件功耗0.1 W
第一元件电阻3280 Ω
JESD-609代码e3
制造商序列号4300T
安装特点THROUGH HOLE MOUNT
网络类型BUSSED
元件数量10
功能数量1
端子数量11
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
额定功率耗散 (P)1.38 W
额定温度70 °C
电阻器类型ARRAY/NETWORK RESISTOR
表面贴装NO
技术THIN FILM
温度系数50 ppm/°C
温度系数跟踪5 ppm/°C
端子面层Tin (Sn)
端子形状FLAT
容差0.1%
工作电压50 V

文档预览

下载PDF文档
oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
RoHS compliant* (see How to Order
“Termination” option)
Low profile provides compatibility with
DIPs
Also available in medium profile (4300S -
.250 ”) and high profile (4300K - .350 ”)
Marking on contrasting background
Custom circuits available per factory
*R
4300T, S, K Series - Thin Film Molded SIP
Product Characteristics
Resistance Range
Bussed ...................49.9 to 100K ohms
Isolated ......................20 to 200K ohms
Series.........................20 to 100K ohms
Resistance Tolerance
.........................±0.1 %, ±0.5 %, ±1 %
Temperature Coefficient
..................±100 ppm/°C, ±50 ppm/°C,
±25 ppm/°C
Temperature Range ....-55 °C to +125 °C
Insulation Resistance
..................10,000 megohms minimum
TCR Tracking .........................±5 ppm/°C
Maximum Operating Voltage............50 V
Environmental Characteristics
Thermal Shock and
Power Conditioning ...................... 0.1 %
Short Time Overload ..................... 0.1 %
Terminal Strength ........................ 0.25 %
Resistance to Soldering Heat ....... 0.1 %
Moisture Resistance ..................... 0.1 %
Life .............................................. 0.50 %
Physical Characteristics
Body Material Flammability
...........................Conforms to UL94V-0
Lead Frame Material
..........................Copper, solder coated
Body Material ..................Novolac epoxy
How To Order
Package Power Temp. Derating Curve
(Low Profile, 4300T)
(
)
1.75
1.50
4311T
WATTS
1.25
1.00
.75
.50
.25
4310T
4309T
4308T
4306T
Product Dimensions
27.53
MAX.
(1.084)
22.45
MAX.
(.884)
14.83 MAX.
(.584)
24.99
MAX.
(.984)
19.92
MAX.
(.784)
PIN #1 REF.
4.95
(.195)
MAX.
.381 + .127/ - .000
(.015 + .005/ - 000)
2.54
±
.07
(.100
±
.003*)
TYP.
NON-ACCUM.
3.43 + .38/ - .25
(.135 + .015/ - .010)
1.02
±
.12
(.040
±
.005)
.483
±
.050
TYP.
(.020
±
.002)
2.16
±
.10
(.085
±
.004)
25
70
150
125
AMBIENT TEMPERATURE (
°
C )
0
Package Power Ratings at 70°C
T
S
K
4304 .......... ............ 0.60...... 0.80 watts
4306 ...... 0.75.......... 0.90...... 1.20 watts
4308 ...... 1.00.......... 1.20...... 1.60 watts
4309 ...... 1.13 ................................watts
4310 ...... 1.25.......... 1.50...... 2.00 watts
4311 ...... 1.38 ................................watts
1.02
±
.05
(.0425
±
.002)
.254
±
.050
(.010
±
.002)
Governing dimensions are in metric. Dimensions in parentheses
are inches and are approximate.
*Terminal centerline to centerline measurements made at point of
emergence of the lead from the body.
43 11 T - 101 - 2222 F A B __
Model
(43 = Molded SIP)
Number of Pins
Physical Config.
•T = Low Profile Thin Film
•S = Med. Profile Thin Film
•K = High Profile Thin Film
Electrical Configuration
•101 = Bussed
•102 = Isolated
•106 = Series
Resistance Code
•First 3 digits are significant
•Fourth digit represents the
number of zeros to follow.
Absolute Tolerance Code
•B = ±0.1%
•F = ±1%
•D = ±0.5%
Temperature Coefficient Code
•A = ±100ppm/°C •C = ±25ppm/°C
•B = ±50ppm/°C
Ratio Tolerance (Optional)
•A = ±0.05% to R1 •D = ±0.5% to R1
•B = ±0.1% to R1
Terminations
• L = Tin-plated (RoHS compliant version)
• Blank = Tin/Lead-plated
Consult factory for other available options.
Typical Part Marking
Represents total content. Layout may vary.
PART
NUMBER
4311T-101-
1003BB
YYWW
CIRCUIT
RESISTANCE
CODE
DATE CODE
PIN ONE
INDICATOR
MANUFACTURER'S
TRADEMARK
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
求解HT1621与LCD的连接
第一次用HT1621,看完手册后还是有些地方不解,HT1621的SEG0可以连接LCD的A1段电极也可以连接D1段电极,这个连接关系是不确定的,任意连接? 如果用来驱动多个LCD的话,公共电极COM就是用来选 ......
zzbaizhi 微控制器 MCU
EK-LM4F120 launchpad 之软件安装
我的CCS5是在官网下的就是速度慢 这个是在一个论坛里找到的 http://pan.baidu.com/s/1orfAu 主要这几个选项 131996 131997 剩下的默认就可以了 破解: ......
ddlxiaoxu 微控制器 MCU
原来ARM7上的ucosii系统要移植到cortex-m3的板子上,求指教
现在主要问题是这个系统原来跑在ARM7的平台上,现在因为某些原因要转移到STM32的平台上。 新的开发平台有现成的ucosii系统+UCGUI,我应该不用再移植了吧, 但是 原来系统里的控制任务要移植 ......
fbi987996 实时操作系统RTOS
说说MSP430程序库硬件乘法器使用
最近用430做东西,,贴一些东西大家分享 硬件乘法器不占用CPU周期,有硬件实现,速度比软件实现的乘法速度快很多。msp430f14x、msp430f16x中都含有硬件乘法器模块,方便用户需要速度的时候 ......
Jacktang 微控制器 MCU
AM335x平台 使用SD卡的建议
The table below lists the SD cards tested which have no issue on performance. 没有问题 109875 The table below lists the SD cards tested which have poor performance. 表现不 ......
蓝雨夜 DSP 与 ARM 处理器
无线新体验,KRONE AirLAN无线局域网系统解决方案
概述 -- 有线速度, 无线自由 我们处在一个信息爆炸的时代。这使得您不管是在办公室、家里、学校、还是在旅途中,您都需要始终同其他人保持联系,以获取所需的信息。许许多多的人渴望享受随时随 ......
JasonYoo 无线连接

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 782  1014  376  2478  2593  16  21  8  50  53 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved