POE International Corp
SPECIFICATION OF GENERAL PURPOSE CHIP RESISTOR
（1/2W）
M01-00-E-07
Ver: 1
Page:
1 of 7
ROHS compliance
WF12P
±1%, ±5%
General purpose chip resistors ( 1/2W )
Size 1206
Customer
Approval No
Issue Date
:
:
:
Customer Approval :
POE International Corp
SPECIFICATION OF GENERAL PURPOSE CHIP RESISTOR
（1/2W）
M01-00-E-07
Ver: 1
Page:
2 of 7
FEATURE
1. High reliability and stability
2. Reduced size of final equipment
3. Lower assembly costs
4. Higher component and equipment reliability
5. Lead free products upon customer requested
APPLICATION
•
•
•
Consumer electrical equipment
Automotive application
EDP, Computer application
Telecom application
•
DESCRIPTION
The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to
nominated value within tolerance which controlled by laser trimming of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For
ease of soldering the outer layer of these end terminations is a Tin (lead free) alloy.
Fig 1. Consctruction of Chip-R
POE International Corp
SPECIFICATION OF GENERAL PURPOSE CHIP RESISTOR
（1/2W）
M01-00-E-07
Ver: 1
Page:
3 of 7
QUICK REFERENCE DATA
Item
Series No.
Size code
Resistance Tolerance
Resistance Range
TCR (ppm/°C)
-55°C ~ +155°C
Max. dissipation at T
amb
=70°C
Max. Operation Voltage (DC or RMS)
Climatic category (IEC 60068)
Basic specification
Note :
1.
2.
This is the maximum voltage that may be continuously supplied to the resistor element, see
“IEC
publication
60115-8”
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
General Specification
WF12P
1206 ( 3216 )
±1%
( E-96 ),
±5%
( E-24 )
Jumper, 1Ω ~ 10MΩ ( E96+E24 series)
10R ~ 1M0,
≤ ±
100 ppm/°C
< 10R; > 1M0,
≤ ±
200 ppm/°C
1/2 W
200V ( I = 3.2 Amp. For jumper )
55/155/56
JIS C 5202 / IEC 60115-1
RCWV
=
Rated Power
×
Resistance Value
or Max. RCWV listed above, whichever is lower.
Dimensions:
Part No
L
W
Tt
Tb
t
WF12P
3.10
±
0.10
1.60
±
0.10
0.50
±
0.20
0.45
±
0.20
0.55
±
0.15
POE International Corp
SPECIFICATION OF GENERAL PURPOSE CHIP RESISTOR
（1/2W）
M01-00-E-07
Ver: 1
Page:
4 of 7
Marking
4-digits marking for 1%, 3-digits marking for 5%
Example
RESISTANCE
4-digits marking
3-digits marking
90Ω
90R0
-
100Ω
1000
101
6800Ω
6801
682
47000Ω
4702
473
FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal resistance are taken
from the E96 & E24 series for resistors with a
tolerance of
±1%, ±5%.
The values of the
E24/E96 series are in accordance with
“IEC
publication 60063”.
Derating
The power that the resistor can dissipate depends
on the operating temperature; see Fig.2
Fig 2. Maximum dissipation in percentage of rated power
MOUNTING
Due to their rectangular shapes and small
tolerances, Surface Mountable Resistors are
suitable for handling by automatic placement
systems.
As a function of the ambient temperature
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
SOLDERING CONDITION
The robust construction of chip resistors allows them to
be completely immersed in a solder bath of 260°C for
one minute. Therefore, it is possible to mount Surface
Mount Resistors on one side of a PCB and other
discrete components on the reverse (mixed PCBs).
Surface Mount Resistors are tested for solderability at
245°C during 3 seconds. The test condition for no
leaching is 260°C for 60 seconds. Typical examples of
soldering processes that provide reliable joints without
any damage are given in Fig 3.
POE International Corp
SPECIFICATION OF GENERAL PURPOSE CHIP RESISTOR
（1/2W）
M01-00-E-07
Ver: 1
Page:
5 of 7
Fig 3. Infrared soldering profile for Chip Resistors
CATALOGUE NUMBERS
The resistors have a catalogue number starting with .
WF12
Size code
WF12: 1206
P
Type code
P
: Thick
film,
4702
Resistance code
E96 +E24:
3 significant digits followed by no.
of zeros
102Ω
37.4KΩ
220Ω
=1020
=3742
=2200
J
Tolerance
J:
±
5%
F:
±
1%
T
Packaging code
T: 7” Reeled taping
_
Termination code
_ = SnPb base (“_”
means a blank)
L =
Sn base (lead
free)
n
Reeled tape packaging : 8mm width paper taping 5000pcs per 7” reel.
TEST AND REQUIREMENTS
Basic specification : JIS C 5202 / IEC 60115-1
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 68-1, subclause 5.3, unless otherwise specified.
Temperature: 15ºC to 35ºC.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
TEST
Temperature
Coefficient of
Resistance (TCR )
PROCEDURE
Natural resistance change per change in degree centigrade.
REQUIREMENT
Test temperature
–55~+155°C
10R ~ 1M0,
≤ ±
100 ppm/°C
< 10R; > 1M0,
≤ ±
200 ppm/°C
R
2
−
R
1
×
10
6
R
1
(
t
2
−
t
1
)
(ppm/°C)
R
1
: Resistance at reference temperature
R
2
: Resistance at test temperature
t
1
: 25°C
Short time overload
(STOL )
Resistance to
soldering heat
Solderability
Permanent resistance change after a 5second application of
∆R/R
max.
±(2%+0.1Ω)
a voltage 2.5 times RCWV or the maximum overload voltage
specified in the above list, whichever is less.
Unmounted chips 10±1 seconds, 260±5ºC
no visible damage
∆
R/R max.
±(1%+0.05Ω)
Termination Sn base (lead free) : Unmounted chip good tinning (>95% covered)
completely immersed in a lead free solder bath, 245°C±5°C,
no visible damage
3±1 sec
1.
2.
3.
4.
30 minutes at -55°C±3°C,
2~3 minutes at room temperature,
30 minutes at +155°±3°C,
2~3 minutes at room temperature,
no visible damage
∆R/R
max.
±(1%+0.05Ω)
Temperature cycling
Total 5 continuous cycles
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