Bus Driver, ALVC/VCX/A Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, 1.27 MM PITCH, SOIC-20
| 参数名称 | 属性值 |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 系列 | ALVC/VCX/A |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e0 |
| 长度 | 12.8 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 传播延迟（tpd） | 7 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |
| IDT74ALVCH374SO8 | IDT74ALVCH374Q8 | IDT74ALVCH374PG8 | IDT74ALVCH374PY8 | |
|---|---|---|---|---|
| 描述 | Bus Driver, ALVC/VCX/A Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, 1.27 MM PITCH, SOIC-20 | Bus Driver, ALVC/VCX/A Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, 0.635 MM PITCH, QSOP-20 | Bus Driver, ALVC/VCX/A Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, 0.65 MM PITCH, TSSOP-20 | Bus Driver, ALVC/VCX/A Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, 0.65 MM PITCH, SSOP-20 |
| 零件包装代码 | SOIC | QSOP | TSSOP | SSOP |
| 包装说明 | SOP, | SSOP, | TSSOP, | SSOP, |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 系列 | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 12.8 mm | 8.6868 mm | 6.5 mm | 7.2 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SSOP | TSSOP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 传播延迟（tpd） | 7 ns | 7 ns | 7 ns | 7 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 1.7272 mm | 1.2 mm | 2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.635 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.5 mm | 3.937 mm | 4.4 mm | 5.3 mm |
| Base Number Matches | 1 | 1 | 1 | - |
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