High Speed Fine Pitch Connectors
(MICTOR, MICTOR SB, Micro-Strip and STEP-Z
Interconnection Systems)
MICTOR SB Interconnection System
(Continued)
0.50 [.020] Centerline
30.00 [1.181] Stack Height
Plugs
5.97
[.235]
A
Ref.
B
20.00
Typ.
[.788]
Position No. 1
6.73
±
0.04
[.265
±
.002
]
0.20
Typ.
[.008]
29 Spaces at
0.50
[.020] Typ.
=
14.50
[.571]
7.14
Ref.
[.281]
A
Note:
Parts are available with
vacuum dots for robotic
placement.
0.08
29.24
+ 0.03
–
+ .003
[1.151
– .001
]
0.95
[.038]
TOL
D
A
0.94
[.037]
D
Section A-A
C
Ø 0.89
Ref.
[.035]
16.89
[.665]
0.30
Typ.
[.012]
5.28
[.208]
Pad
1.33
[.053]
6.35
[.250]
Position No. 2
0.64
Typ.
[.025]
3.10
[.122]
MICTOR SB
Interconnection System
1.45
[.057]
Orientation Hole
2 Plcs.
B
Ref.
C
Ref.
E
Spaces at
20.00
[.788] =
F
1.05
2 Plcs.
[.041]
Position No. 1
Recommended PC Board Layout
(Viewed from Connector Side)
Packaging
Type
No. of
Positions
60
120
A
20.02
.788
40.01
1.575
60.02
2.363
80.01
3.150
100.03
3.938
B
14.50
.571
34.51
1.359
54.51
2.146
74.51
2.934
94.51
3.721
Dimensions
C
D
18.49
.728
38.48
1.515
58.50
2.303
78.49
3.090
98.50
3.878
0.10
.004
0.10
.004
0.10
.004
0.15
.006
0.15
.006
E
0
1
2
3
4
F
0.00
.000
20.00
.788
40.00
1.575
60.01
2.362
80.01
3.150
Gold Flash Plating
Vacuum Dots
Without
With
1658061-1
1658061-2
1658061-3
1658061-4
1658061-5
—
—
—
—
—
10 µ Gold Plating
Vacuum Dots
Without
With
1658030-1
1658030-2
1658030-3
1658030-4
1658030-5
—
—
—
—
—
Tray
180
240
300
Note:
All part numbers are RoHS compliant.
65
Catalog 65194
Revised 6-07
www.tycoelectronics.com
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
High Speed Fine Pitch Connectors
(MICTOR, MICTOR SB, Micro-Strip and STEP-Z
Interconnection Systems)
Introduction to the Micro-Strip Interconnection System
(1.27 x 2.54 [.050 x .100] Centerline)
Product Facts
I
Designed for high speed
applications
Provides controlled
impedance
Low inductance
High density
Superior electrical
performance down to 100
picosecond rise times
40 high speed signal lines
per inch
Daughtercard-to-
motherboard stacking
connectors available in
sizes of 40 to 240 positions
Custom stacking heights
available: between 10.92
[.430] and 18.75 [.738] or
31.12 [1.225] and 38.94
[1.533]
Cable-to-board system
available in sizes of 40 to
120 positions
Vertical and right-angle
board mount receptacles for
cable connectors
Connector housings are
polarized
Recognized under the
Component Program
of Underwriters
Laboratories Inc.,
File No. E28476
R
I
I
I
I
I
I
I
I
I
I
I
Tyco Electronics Micro-Strip
connectors are a high
density, controlled
impedance connector
family compatible with the
requirements of high den-
sity and high speed data
transmission technologies.
Each signal line within the
mated connector is located
at a specific distance from
an integral, separable bus
bar serving as a ground
plane in a micro-strip
configuration. The selection
of housing dielectric,
spacing from signal
contact-to-ground plane
and conductor geometry
provide a specific charac-
teristic impedance plus
very low inductance and
capacitance.
Discontinuities resulting
from connector structure
and solder interfaces are
dimensionally small and
therefore appear transpar-
ent to high speed signals.
Both vertical and right-
angle board-to-board and
cable-to-board connector
versions share a nominal
impedance of 50 ohms
(single ended) or 100 ohms
(differential pair).
Each one inch length of
connector houses two elec-
trically isolated high current
contacts. When soldered to
the PC board ground plane,
that ground plane is
extended through the
mated connector.
Resistance is minimized
by a large contact area and
short electrical length, pro-
viding signal return paths
with negligible ground loop
voltages. Since signal
return is via the bus bars,
signal-ground-signal
alternation, common to
high speed applications,
becomes unnecessary. All
contacts can be dedicated
to signal transmission,
effectively doubling
connector density.
I
Certified by Canadian
Standards
Association,
File No. LR 7189
R
Micro-Strip
Interconnection System
66
Catalog 65194
Revised 6-07
www.tycoelectronics.com
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
High Speed Fine Pitch Connectors
(MICTOR, MICTOR SB, Micro-Strip and STEP-Z
Interconnection Systems)
Introduction to the Micro-Strip Interconnection System
(1.27 x 2.54 [.050 x .100] Centerline)
(Continued)
Performance
Characteristics
Connector Impedance
—
50 ohms ±10% at 1 ns
Configuration
— 2.54 [.100]
signal row-to-signal row,
1.27 [.050] signal-to-ground,
1.27 [.050] signal-to-signal
Vertical Board-to-Board Stacking Applications
Vertical Plug
(Pages 68 and 70)
Vertical
Receptacle
(See page 73)
10.92
[.430] Mated
Vertical
Plugs
(See pages 68-70)
Extended
Vertical
Receptacle
(Above)
31.12
[1.225]
Stacking
Height
Vertical
Receptacle
(See page 73)
Vertical Plug
(Pages 71 and 72)
18.75
[.738] Mated
Vertical
Plugs
(See pages 71 and 72)
38.94
[1.533]
Stacking
Height
Extended
Vertical
Receptacle
(Above)
Right-Angle Board-to-Board Application* (Small Paddlecard Applications)
Vertical
Plugs
(See pages 68-70)
Right-Angle
Receptacles
(See pages 74 and 75)
9.27
[.365]
* Not recommended for use as a daughtercard/backplane interconnector.
Vertical and Right-Angle Cable-to-Board Applications
(Ref. Tyco Electronics Catalog 65069,
Micro-Strip Cable Assemblies)
Micro-Strip
Interconnection System
67
Catalog 65194
Revised 6-07
www.tycoelectronics.com
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
High Speed Fine Pitch Connectors
(MICTOR, MICTOR SB, Micro-Strip and STEP-Z
Interconnection Systems)
Micro-Strip Vertical Plugs with Guides (Board-to-Board)
10.92 [.430]
Stacking Height
Material and Finish
Housing
— High-temperature thermo-
plastic, flame retardant, natural color
Bus Bar
— Phosphor bronze; duplex
plated 0.00076 [.000030] gold in mat-
ing area, 0.00254 [.000100] tin-lead in
terminating area, with entire bus under-
plated 0.00127 [.000050] nickel
Signal Pin
— Phosphor bronze;
duplex plated 0.00076 [.000030] gold in
mating area, 0.00254 [.000100] tin-lead
in terminating area, with entire contact
underplated 0.00127 [.000050] nickel
7.24
[.285]
B
Position No. 1
Indicator
C
A
Position No. 2
Indicator
8.64
[.340]
4.83
[.190]
Related Product Data
Performance Characteristics
—
page 67
Mating Receptacles
—
pages 73, 74 and 76
Technical Documents
— page 81
D
spaces at
1.27
[.050] =
E
Solder Tail
(see chart)
Position No. 3
Position No. 1
4 spaces at
1.27
[.050] =
5.08
[.200]
Ground Bus
Position No. 1
Position No. 2
Position No. 4
0.71
-0.15
Dia. Typ.
+0.08
[
.028
+.003
]
-.006
Recommended PC Board Layout
No. of
Positions
40
60
80
A
30.84
1.214
43.54
1.714
56.24
2.214
68.94
2.714
81.64
3.214
94.34
3.714
107.04
4.214
119.74
4.714
132.44
5.214
B
29.08
1.145
41.78
1.645
54.48
2.145
67.18
2.645
79.88
3.145
92.58
3.645
105.28
4.145
117.98
4.645
130.68
5.145
Dimensions
C
26.62
1.048
39.32
1.548
52.02
2.048
64.72
2.548
77.42
3.048
90.12
3.548
102.82
4.048
115.52
4.548
128.22
5.048
D
19
29
39
49
59
69
79
89
99
E
24.13
.950
36.83
1.450
49.53
1.950
62.23
2.450
74.93
2.950
87.63
3.450
100.33
3.950
113.03
4.450
125.73
4.950
Part Numbers
2.41 [.095]
3.18 [.125]
Solder Tail
Solder Tail
536280-1
536280-2
536280-3
536280-4
536280-5
536280-6
536280-7
536280-8
536280-9
536272-1
536272-2
536272-3
536272-4
536272-5
536272-6
536272-7
536272-8
536272-9
Micro-Strip
Interconnection System
100
120
140
160
180
200
Note:
Part Numbers are RoHS compliant except: Indicates non-RoHS compliant;
Indicates “5 of 6 compliant” (lead in solderable interface only).
68
Catalog 65194
Revised 6-07
www.tycoelectronics.com
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
High Speed Fine Pitch Connectors
(MICTOR, MICTOR SB, Micro-Strip and STEP-Z
Interconnection Systems)
Micro-Strip Vertical Plugs with Guides (Board-to-Board)
(Continued)
10.92 [.430]
Stacking Height
Material and Finish
Housing
— High-temperature thermo-
plastic, flame retardant, natural color
Bus Bar
— Phosphor bronze; duplex
plated 0.00076 [.000030] gold in mat-
ing area, 0.00254 [.000100] tin-lead in
terminating area, with entire bus under-
plated 0.00127 [.000050] nickel
Signal Pin
— Phosphor bronze;
duplex plated 0.00076 [.000030] gold in
mating area, 0.00254 [.000100] tin-lead
in terminating area, with entire contact
underplated 0.00127 [.000050] nickel
7.24
[.285]
A
B
D
Position No. 1
Indicator
E
C
3.35
[.132]
Position No. 2
Indicator
4.47
[.176] Dia
(2 Plc.)
4.83
[.190]
8.64
[.340]
Related Product Data
Performance Characteristics
—
page 67
Mating Receptacles
— page 75
Technical Documents
— page 81
B
8.89
[.350]
F
spaces at
1.27
[.050] =
G
8.89
[.350]
Position No. 1
4 spaces
at
1.27
[.050]
=
5.08
[.200]
3.18
[.125] Dia.
(2 Plc.)
+0.08
0.71 -0.15
Ground Bus
Position No. 1
Solder Tail
(see chart)
Position No. 3
Position No. 2
Position No. 4
[
.028
+.003
]
-.006
Recommended PC Board Layout
Note:
Guide Pins must be
purchased separately; order
Part Number 536304-2.
No. of
Positions
140
160
200
A
114.30
4.500
127.00
5.000
152.40
6.000
B
105.41
4.150
118.11
4.650
143.51
5.560
C
94.34
3.714
107.04
4.214
132.44
5.214
Dimensions
D
92.58
3.645
105.28
4.145
130.68
5.145
E
90.12
3.548
102.82
4.048
128.22
5.048
F
69
79
99
G
87.63
3.450
100.33
3.950
125.73
4.950
Part Number
3.18 [.125]
Solder Tail
536303-1
536303-2
Micro-Strip
Interconnection System
536303-4
Note:
Part Numbers are RoHS compliant except: Indicates non-RoHS compliant;
Indicates “5 of 6 compliant” (lead in solderable interface only).
69
Catalog 65194
Revised 6-07
www.tycoelectronics.com
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
NXP MCU
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