GBU6A thru GBU6M
Vishay Semiconductors
formerly General Semiconductor
Glass Passivated Single-Phase
Bridge Rectifier
Case Style GBU
0.880 (22.3)
0.860 (21.8)
0.125 (3.2) x 45o
CHAMFE
R
0.140 (3.56)
0.130 (3.30)
9o
TYP
.
0.740 (18.8)
0.720 (18.3)
0.085 (2.16)
0.065 (1.65)
0.075
(1.9)R
.
0.080 (2.03)
0.060 (1.52)
5o
TYP
.
0.085 (2.16)
0.075 (1.90)
Features
Reverse Voltage
50 and 1000 V
Forward Current
6.0 A
0.020 R (TYP.)
0.310 (7.9)
0.290 (7.4)
0.160 (4.1)
0.140 (3.5)
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• This series is UL listed under the Recognized
Component Index, file number E54214
• High case dielectric strength of 1500 V
RMS
• Ideal for printed circuit boards
• Glass passivated chip junction
• High surge overload rating
• High temperature soldering guaranteed:
260°C/10 seconds, 0.375 (9.5mm) lead length,
5lbs. (2.3kg) tension
0.100 (2.54)
0.085 (2.16)
0.710 (18.0)
0.690 (17.5)
0.050 (1.27)
0.040 (1.02)
Mechanical Data
0.022 (0.56)
0.018 (0.46)
0.080 (2.03)
0.065
(1.65)
0.190 (4.83)
0.210 (5.33)
Polarity shown on front side of case, positive lead by beveled corner
Dimensions in inches and (millimeters)
Case:
Molded plastic body over passivated junctions
Terminals:
Plated leads solderable per MIL-STD-750,
Method 2026
Mounting Position:
Any
(NOTE 2)
Mounting Torque:
5 in. - lb. max.
Weight:
0.15 oz., 4.0 g
Packaging codes/options:
1/250 EA. per Bulk Tray Stack
Ratings at 25°C ambient temperature unless otherwise specified.
Maximum Ratings & Thermal Characteristics
Symbols
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified
output current at T
C
=100°C
(1) (2)
Peak forward surge current single
sine-wave superimposed on rated load
(JEDEC Method) T
J
=150°C
Rating for fusing (t<8.3ms)
Typical thermal resistance per leg
(1) (2)
GBU
6A
50
35
50
GBU
6B
100
70
100
GBU
6D
200
140
200
GBU
6G
400
280
400
6.0
GBU
6J
600
420
600
GBU
6K
800
560
800
GBU
6M
1000
700
1000
Units
V
V
V
A
A
A
2
sec
°C/W
°C
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
I
2
t
R
ΘJA
R
ΘJC
175
127
7.4
2.2
-55 to +150
Operating junction and storage temperature range T
J,
T
STG
Electrical Characteristics
Maximum DC reverse current at
rated DC blocking voltage per leg
Ratings at 25°C ambient temperature unless otherwise specified.
Maximum instantaneous forward voltage drop
per leg at 6.0 A
T
A
= 25°C
T
A
=125°C
V
F
I
R
C
J
211
1.0
5.0
500
94
V
µA
pF
Typical junction capacitance per leg at 4.0V, 1MHz
Notes:
(1) Units case mounted on 2.6 x 1.4 x 0.06" thick (6.5 x 3.5 x 0.15 cm) Al. Plate heatsink
(2) Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with #6 screws
Document Number 88615
07-Oct-03
www.vishay.com
1
GBU6A thru GBU6M
Vishay Semiconductors
formerly General Semiconductor
Ratings and
Characteristic Curves
(T
A
= 25°C unless otherwise noted)
Fig. 1 – Derating Curve
Output Rectified Current
6.0
175
Fig. 2 – Maximum Non-Repetitive Peak
Forward Surge Current Per Leg
Single Sine-Wave
(JEDEC Method)
T
J
= 150°C
Average Forward Output Current (A)
Peak Forward Surge Current (A)
Heatsink Mounting,
2.6 x 1.4 x 0.06" Thk
(6.5 x 3.5 x .15cm) AL. Plate
4.0
150
125
100
2.0
75
50
0
0
60 H
Z
Resistive or Inductive Load
50
100
150
1.0 Cycle
25
1
10
100
Case Temperature (°C)
Number of Cycles at 60 H
Z
Fig. 3 – Typical Forward
Characteristics Per Leg
100
500
Fig. 4 – Typical Reverse Leakage
Characteristics Per Leg
Instantaneous Reverse Current (µA)
100
50 - 400V
600 - 1000V
T
J
= 125°C
10
Instantaneous Forward Current (A)
10
1
T
J
= 25°C
Pulse Width = 300µs
1% Duty Cycle
1
0.1
0.1
T
J
= 25°C
0.01
0
20
40
60
80
100
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Instantaneous Forward Voltage (V)
Percent of Rated Peak Reverse Voltage (%)
Fig. 5 – Typical Junction
Capacitance Per Leg
1,000
Fig. 6 – Typical Transient
Thermal Impedance
100
Transient Thermal Impedance (°C/W)
Junction Capacitance, pF
T
J
= 25°C
f = 1.0MH
Z
Vsig = 50mVp-p
10
100
1
10
0.1
50 - 400V
600 - 1000V
1
10
100
0.1
0.01
0.1
1
10
100
Reverse Voltage (V)
www.vishay.com
2
t, Heating Time (sec.)
Document Number 88615
07-Oct-03
FPGA/CPLD
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