Dual-Port SRAM, 1KX8, 55ns, CMOS, CQCC52, CERAMIC, LCC-52
| 参数名称 | 属性值 |
| 厂商名称 | Cypress(赛普拉斯) |
| 零件包装代码 | LCC |
| 包装说明 | QCCN, |
| 针数 | 52 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最长访问时间 | 55 ns |
| JESD-30 代码 | S-CQCC-N52 |
| 内存密度 | 8192 bit |
| 内存集成电路类型 | DUAL-PORT SRAM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 52 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 1KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 5962-8687511ZX | 5962-8687520ZX | 5962-8687503ZX | 5962-8687519ZX | |
|---|---|---|---|---|
| 描述 | Dual-Port SRAM, 1KX8, 55ns, CMOS, CQCC52, CERAMIC, LCC-52 | Dual-Port SRAM, 1KX8, 35ns, CMOS, CQCC52, CERAMIC, LCC-52 | Dual-Port SRAM, 1KX8, 55ns, CMOS, CQCC52, CERAMIC, LCC-52 | Dual-Port SRAM, 1KX8, 35ns, CMOS, CQCC52, CERAMIC, LCC-52 |
| 零件包装代码 | LCC | LCC | LCC | LCC |
| 包装说明 | QCCN, | QCCN, LCC52,.75SQ | QCCN, LCC52,.75SQ | QCCN, LCC52,.75SQ |
| 针数 | 52 | 52 | 52 | 52 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最长访问时间 | 55 ns | 35 ns | 55 ns | 35 ns |
| JESD-30 代码 | S-CQCC-N52 | S-CQCC-N52 | S-CQCC-N52 | S-CQCC-N52 |
| 内存密度 | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
| 内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 52 | 52 | 52 | 52 |
| 字数 | 1024 words | 1024 words | 1024 words | 1024 words |
| 字数代码 | 1000 | 1000 | 1000 | 1000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | QCCN | QCCN | QCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 |
| I/O 类型 | - | COMMON | COMMON | COMMON |
| 端口数量 | - | 2 | 2 | 2 |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE |
| 封装等效代码 | - | LCC52,.75SQ | LCC52,.75SQ | LCC52,.75SQ |
| 电源 | - | 5 V | 5 V | 5 V |
| 最大待机电流 | - | 0.03 A | 0.03 A | 0.03 A |
| 最小待机电流 | - | 4.5 V | 4.5 V | 4.5 V |
| 最大压摆率 | - | 0.18 mA | 0.23 mA | 0.18 mA |
| 端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm |
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