Microprocessor, 8-Bit, 4MHz, CMOS, PQFP80, FP-80
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | QFP |
包装说明 | QFP, QFP80,.7X.9,32 |
针数 | 80 |
Reach Compliance Code | unknown |
其他特性 | DRAM REFRESH CONTROL; PROGRAMMABLE RELOAD TIMER |
地址总线宽度 | 20 |
位大小 | 8 |
边界扫描 | NO |
最大时钟频率 | 8 MHz |
外部数据总线宽度 | 8 |
格式 | FIXED POINT |
集成缓存 | NO |
JESD-30 代码 | R-PQFP-G80 |
JESD-609代码 | e0 |
长度 | 20 mm |
低功率模式 | YES |
DMA 通道数量 | 2 |
外部中断装置数量 | 4 |
串行 I/O 数 | 3 |
端子数量 | 80 |
片上数据RAM宽度 | |
最高工作温度 | 75 °C |
最低工作温度 | -20 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装等效代码 | QFP80,.7X.9,32 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
RAM(字数) | 0 |
座面最大高度 | 3.1 mm |
速度 | 4 MHz |
最大压摆率 | 20 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 14 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR |
Base Number Matches | 1 |
HD64180RF-4X | HD64A180R0P | HD64180ZCP-4X | HD64180ZF-4X | HD64A180R0F | HD64B180R0CP | HD64B180R0P | HD64A180R0CP | HD64B180R0F | |
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描述 | Microprocessor, 8-Bit, 4MHz, CMOS, PQFP80, FP-80 | Microprocessor, 8-Bit, 4MHz, CMOS, PDIP64, DP-64S | Microprocessor, 8-Bit, 4MHz, CMOS, PQCC68, CP-68 | Microprocessor, 8-Bit, 4MHz, CMOS, PQFP80, FP-80 | Microprocessor, 8-Bit, 4MHz, CMOS, PQFP80, FP-80 | Microprocessor, 8-Bit, 6.17MHz, CMOS, PQCC68, CP-68 | Microprocessor, 8-Bit, 6.17MHz, CMOS, PDIP64, DP-64S | Microprocessor, 8-Bit, 4MHz, CMOS, PQCC68, CP-68 | Microprocessor, 8-Bit, 6.17MHz, CMOS, PQFP80, FP-80 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | QFP | DIP | QFN | QFP | QFP | QFN | DIP | QFN | QFP |
包装说明 | QFP, QFP80,.7X.9,32 | SDIP, SDIP64,.75 | QCCJ, LDCC68,1.0SQ | QFP, QFP80,.7X.9,32 | QFP, QFL64,.55X.8,40 | QCCJ, LDCC68,1.0SQ | SDIP, SDIP64,.75 | QCCJ, LDCC68,1.0SQ | QFP, QFL64,.55X.8,40 |
针数 | 80 | 64 | 68 | 80 | 80 | 68 | 64 | 68 | 80 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | DRAM REFRESH CONTROL; PROGRAMMABLE RELOAD TIMER | DRAM REFRESH CONTROL; PROGRAMMABLE RELOAD TIMER; SUPERCEDED BY HD64180R1 | DRAM REFRESH CONTROL; PROGRAMMABLE RELOAD TIMER | DRAM REFRESH CONTROL; PROGRAMMABLE RELOAD TIMER | DRAM REFRESH CONTROL; PROGRAMMABLE RELOAD TIMER; SUPERCEDED BY HD64180R1 | DRAM REFRESH CONTROL; PROGRAMMABLE RELOAD TIMER; SUPERCEDED BY HD64180R1 | DRAM REFRESH CONTROL; PROGRAMMABLE RELOAD TIMER; SUPERCEDED BY HD64180R1 | DRAM REFRESH CONTROL; PROGRAMMABLE RELOAD TIMER; SUPERCEDED BY HD64180R1 | DRAM REFRESH CONTROL; PROGRAMMABLE RELOAD TIMER; SUPERCEDED BY HD64180R1 |
地址总线宽度 | 20 | 19 | 20 | 20 | 19 | 19 | 19 | 19 | 19 |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 12 MHz | 12 MHz | 8 MHz | 12 MHz |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
集成缓存 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | R-PQFP-G80 | R-PDIP-T64 | S-PQCC-J68 | R-PQFP-G80 | R-PQFP-G80 | S-PQCC-J68 | R-PDIP-T64 | S-PQCC-J68 | R-PQFP-G80 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 20 mm | 57.6 mm | 24.2 mm | 20 mm | 20 mm | 24.2 mm | 57.6 mm | 24.2 mm | 20 mm |
低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
DMA 通道数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
外部中断装置数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
串行 I/O 数 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
端子数量 | 80 | 64 | 68 | 80 | 80 | 68 | 64 | 68 | 80 |
最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | SDIP | QCCJ | QFP | QFP | QCCJ | SDIP | QCCJ | QFP |
封装等效代码 | QFP80,.7X.9,32 | SDIP64,.75 | LDCC68,1.0SQ | QFP80,.7X.9,32 | QFL64,.55X.8,40 | LDCC68,1.0SQ | SDIP64,.75 | LDCC68,1.0SQ | QFL64,.55X.8,40 |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE, SHRINK PITCH | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER | IN-LINE, SHRINK PITCH | CHIP CARRIER | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.1 mm | 5.1 mm | 4.6 mm | 3.1 mm | 3.1 mm | 4.6 mm | 5.1 mm | 4.6 mm | 3.1 mm |
速度 | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 6.17 MHz | 6.17 MHz | 4 MHz | 6.17 MHz |
最大压摆率 | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 30 mA | 30 mA | 20 mA | 30 mA |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | YES | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | THROUGH-HOLE | J BEND | GULL WING | GULL WING | J BEND | THROUGH-HOLE | J BEND | GULL WING |
端子节距 | 0.8 mm | 1.778 mm | 1.27 mm | 0.8 mm | 0.8 mm | 1.27 mm | 1.778 mm | 1.27 mm | 0.8 mm |
端子位置 | QUAD | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 14 mm | 19.05 mm | 24.2 mm | 14 mm | 14 mm | 24.2 mm | 19.05 mm | 24.2 mm | 14 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
厂商名称 | - | - | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
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