Bulletin I0213J 10/00
IR590SG..HCB
PHASE CONTROL THYRISTORS
Junction Size:
Wafer Size:
V
RRM
Class:
Passivation Process:
Reference IR Packaged Part:
Square 590 mils
4"
600 to 1200 V
Glassivated MESA
181RKI Series
Major Ratings and Characteristics
Parameters
V
TM
Maximum On-state Voltage
Units
1.2 V
600 to 1200 V
140 mA
2V
5 to 180 mA
900 mA
Test Conditions
T
J
= 25°C, I
T
= 25 A
T
J
= 25°C, I
DRM
/I
RRM
= 100 µA
(1)
V
DRM
/ V
RRM
Direct and Reverse Breakdown Voltage
I
GT
V
GT
I
H
I
L
Max. Required DC Gate Current to Trigger
Max. Required DC Gate Voltage to Trigger
Holding Current Range
Maximum Latching Current
T
J
= 25° C, anode supply = 6 V, resistive load
T
J
= 25° C, anode supply = 6 V, resistive load
Anode supply = 6 V, resistive load
Anode supply = 6 V, resistive load
(1)
Nitrogen flow on die edge.
Mechanical Characteristics
Nominal Back Metal Composition, Thickness
Nominal Front Metal Composition, Thickness
Chip Dimensions
Wafer Diameter
Wafer Thickness
Maximum Width of Sawing Line
Reject Ink Dot Size
Ink Dot Location
Recommended Storage Environment
Cr - Ni - Ag (1 KA - 4 KA - 6 KA)
Cr - Ni - Ag (1 KA - 4 KA - 6 KA)
590 x 590 mils (see drawing)
100 mm, with std. <110> flat
370 µm ± 10 µm
130 µm
0.25 mm diameter minimum
See drawing
Storage in original container, in dessicated
nitrogen, with no contamination
IR590SG..HCB
Bulletin I0213J 10/00
Ordering Information Table
Device Code
IR
1
590
2
S
3
G
4
12
5
H
6
CB
7
1
2
3
4
5
6
7
-
-
-
-
-
-
-
International Rectifier Device
Chip Dimension in Mils
Type of Device: S = Solderable SCR
Passivation Process: G = Glassivated MESA
Voltage code: Code x 100 = V
RRM
Metallization: H = Silver (Anode) - Silver (Cathode)
CB
= Probed Uncut Die (wafer in box)
Available Class
06 = 600 V
08 = 800 V
12 = 1200 V
None = Probed Die in chip carrier
Outline Table
All dimensions are in millimeters
2
www.irf.com
IR590SG..HCB
Bulletin I0213J 10/00
Wafer Layout
TOP VIEW
N° 21 Basic Cells
All dimensions are in millimiters
WORLD HEADQUARTERS:
233 Kansas St., El Segundo, California 90245 U.S.A. Tel: (310) 322 3331. Fax: (310) 322 3332.
EUROPEAN HEADQUARTERS:
Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408.
IR CANADA:
15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801.
IR GERMANY:
Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933.
IR ITALY:
Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220.
IR FAR EAST:
K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086.
IR SOUTHEAST ASIA:
1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630.
IR TAIWAN:
16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: 886 2 2377 9936.
http://www.irf.com
Fax-On-Demand: +44 1883 733420
Data and specifications subject to change without notice.
www.irf.com
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