HMC1023
SENSOR PRODUCTS
3-AXIS MAGNETIC SENSOR
Features
Ball Grid Array (BGA) Surface-Mount Package
Three Orthogonal Magneto-Resistive Sensors
Wide Field Range of ± 6 Gauss
1.0 mV/V/gauss Sensitivity
Minimum Detectable Field to 85 gauss
Patented On-Chip Set/Reset and Offset Straps
Product Description
The Honeywell HMC1023 is a high performance three-
axis magneto-resistive sensor design in a single
package. The advantages of the HMC1023 include
orthogonal three-axis sensing, small size and a 16-
contact BGA surface mount package.
Each of the magneto-resistive sensors are configured
as 4-element Wheatstone bridges to convert magnetic
fields to differential output voltages. Capable of sensing
fields down to 85 micro-gauss, these sensors offer a
compact, high sensitivity and highly reliable solution for
low field magnetic sensing.
APPLICATIONS
Compassing
Navigation Systems
Attitude Reference
Traffic Detection
Medical Devices
HMC1023 Circuit Diagram
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Page 1
HMC1023
SENSOR PRODUCTS
SPECIFICATIONS
Characteristics
Bridge Elements
Supply
Resistance
Operating
Temperature
Storage
Temperature
Humidity
Field Range
Linearity Error
Tested at 121°C
Full scale (FS) – total applied field
Best fit straight line
± 1 gauss
± 3 gauss
± 6 gauss
Hysteresis Error
Repeatability Error
Bridge Offset
Sensitivity
Noise Density
Resolution
Bandwidth
Disturbing Field
Sensitivity
Tempco
Bridge Offset
Tempco
Bridge Ohmic
Tempco
Cross-Axis Effect
Max. Exposed
Field
Sensitivity Ratio of
X,Y,Z Sensors
X,Y, Z sensor
Sensitive direction in X, Y and Z sensors
1.0
degree
Orthogonality
* Tested at 25°C except stated otherwise.
T
A
= -40 to 125°C
100±5
%
Cross field = 1 gauss, Happlied = ±1 gauss
No perming effect on zero reading
+0.3
200
%FS
gauss
3 sweeps across ±3 gauss
3 sweeps across ±3 gauss
Offset = (OUT+) – (OUT-)
Field = 0 gauss after Set pulse, VCC = 5V
Set/Reset Current = 2.0A
@ 1kHz, VCC=5V
50Hz Bandwidth, VCC=5V
Magnetic signal (lower limit = DC)
Sensitivity starts to degrade.
Use S/R pulse to restore sensitivity.
T
A
= -40 to 125°C, VCC=5V
T
A
= -40 to 125°C, ICC=5mA
T
A
= -40 to 125°C, No Set/Reset
T
A
= -40 to 125°C, With Set/Reset
VCC=5V, T
A
= -40 to 125°C
2100
-2800
-3000
-600
±500
±10
2500
2900
ppm/°C
ppm/°C
-3200
ppm/°C
20
0.8
1.0
48
85
5
1.2
mV/V/gauss
nV/sqrt Hz
gauss
MHz
gauss
-10
0.05
0.4
1.6
0.08
0.08
±2.5
+10
%FS
%FS
mV
%FS
-6
100
+6
%
gauss
Ambient, unbiased
-55
125
°C
Vbridge referenced to GND
Bridge current = 5mA, VCC to GND
Ambient
1.8
250
-40
5.0
350
12
450
125
Volts
ohms
°C
Conditions*
Min
Typ
Max
Units
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Page 2
HMC1023
SENSOR PRODUCTS
SPECIFICATIONS
Characteristics
Set/Reset Strap
Resistance
Current
Resistance
Tempco
Offset Straps
Resistance
Offset
Constant
Resistance
Tempco
* Tested at 25°C except stated otherwise.
Measured from OFFSET+ to OFFSET-
DC Current
Field applied in sensitive direction
T
A
= -40 to 125°C
3500
3900
4300
ppm/°C
40
4.0
50
4.6
60
6.0
ohms
mA/gauss
Measured from S/R+ to S/R-
0.1% duty cycle, or less,
2 sec current pulse
T
A
= -40 to 125°C
3300
3700
4100
ppm/°C
2.0
1.5
3.0
2.0
4.0
4.0
ohms
Amp
Conditions*
Min
Typ
Max
Units
Pin Configuration
(Arrows indicate direction of applied field that generates a positive output voltage
after a SET pulse.)
Package Outline
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Page 3
HMC1023
SENSOR PRODUCTS
Mounting Considerations
When mounting the Honeywell HMC1023 on a circuit board, please consider the following advice for ball grid array
component attachment.
Ball Grid Array attachment/removal to printed circuit boards is precisely controlled thermal solder reflow process. To
prevent internal electrical damage and package cracking, do not use conventional soldering iron/solder station tools. If
you do not have experience and the reflow oven, please have a qualified BGA rework technician do the work for you.
The reflow profile show below is the recommended profile for HMC1023 package attachment.
Melting temperature for the HMC1023 balls is at 180°C. The recommended rise and fall temperatures should be no
greater than 3°C/sec to prevent mechnical stresses or “popcorning”. Peak external temperature the part should be
exposed to is between 200 to 210°C. When exposed a high temperature, such as the solder reflow process, the
internal connections in the package could sustain permanent damage, leaving open connections. 225°C is the melting
point of solder inside the HMC1023 Ball Grid Array package. Do not expose the part to this level of temperature.
If using solder paste, we recommend Kester SN62 solder paste with water soluble flux R560. This has a melting point
around 180°C. Kester recommends a pre-heating zone from ambient temperature to 180°C for 2 to 4 minutes
maximum. The first part of this pre-heating zone ramps up from ambient to 150°C in 90 seconds with a ramp rate of
less than 2.5 degrees C per second. The soak zone should last from 60 to 90 seconds (2 minutes maximum) and
ramp up in temperature from 150 to 180°C at 0.5 to 0.6 °C/ sec. The reflow zone should last for 30 to 90 seconds
maximum (40 to 60 seconds is ideal) and peak in temperature between 200 and 210°C with a ramp of 1.3 to
1.6°C/sec.
The reflow parameters can vary significantly and excellent reflow results can still be achieved. A thin layer of paste
flux or a 2 to 3 mil layer of solder paste applied to the mother-board prior to placing the HMC1023 is helpful. The
profile can be verified by placing a thermocouple between the HMC1023 and motherboard.
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Page 4
HMC1023
SENSOR PRODUCTS
Basic Device Operation
The Honeywell HMC1023 magneto-resistive sensor is composed of three Wheatstone bridge elements to measure
magnetic fields for both field strength and direction. With power applied to the bridges, the sensors elements convert
any incident magnetic field in each element’s sensitive axis direction to a differential voltage output. In addition to the
bridge elements, these sensors have two types of on-chip magnetically coupled straps; the offset straps and the
set/reset strap. These straps are Honeywell patented features for incident field adjustment and magnetic domain
alignment; and eliminate the need for external coils positioned around the sensors.
The magnetoresistive sensors are made of a nickel-iron (Permalloy) thin-film deposited on a silicon wafer and
patterned as a resistive strip element. In the presence of a magnetic field, a change in the bridge resistive elements
causes a corresponding change in voltage across the bridge outputs.
These resistive elements are aligned together to have a common sensitive axis (indicated by arrows on the pinouts)
that will provide positive voltage change with magnetic fields increasing in the sensitive direction. Because the output
only is in proportion to the one-dimensional axis (the principle of anisotropy) and its magnitude, additional sensor
bridges placed at orthogonal directions permit accurate measurement of arbitrary field direction. The combination of
sensor bridges in this three orthogonal axis configuration permit applications such as compassing and magnetometry.
The individual sensor offset straps allow for several modes of operation when a direct current is driven through it.
These modes are: 1) Subtraction (bucking) of an unwanted external magnetic field, 2) null-ing of the bridge offset
voltage, 3) Closed loop field cancellation, and 4) Auto-calibration of bridge gain.
The set/reset strap can be pulsed with high currents for the following benefits: 1) Enable the sensor to perform high
sensitivity measurements, 2) Flip the polarity of the bridge output voltage, and 3) Periodically used to improve
linearity, lower cross-axis effects, and temperature effects.
Noise Characteristics
The noise density for the HMR1023 series is around 50nV/sqrt Hz at the 1 Hz corner, and drops below 10nV/sqrt Hz
at 20Hz and begins to fit the Johnson Noise value at around 5nV/sqrt Hz beyond 100Hz. The 10Hz noise voltage
averages around 0.58 micro-volts with a 0.16 micro-volts standard deviation. These values are provided with a 5-volt
supply.
Offset Strap
The offset strap is a spiral of metalization that couples in the sensor element’s sensitive axis. In the HMC1023 design,
there is one strap per bridge with both ends brought out externally. Each offset strap measures nominally 50 ohms,
and requires about 4.6mA for each gauss of induced field. The straps will easily handle currents to buck or boost
fields through the ±6 gauss linear measurement range, but designers should note the extreme thermal heating on the
sensor die when doing so.
With most applications, the offset strap is not utilized and can be ignored. Designers can leave one or both strap
connections (Off- and Off+) open circuited, or ground one connection node. Do not tie positive and negative strap
connections together of the same strap to avoid shorted turn magnetic circuits.
Set/Reset Strap
The set/reset strap is another spiral of metalization that couples to the sensor elements easy axis (perpendicular to
the sensitive axis on the sensor die). The HMC1023 set/reset strap circuit has three straps (one per sensor) paralleled
together for operation at low voltages. The set/reset strap connections have a nominal resistance of 3.0 ohms with a
minimum required peak current of 1.5A for reset or set pulses. With rare exception, the set/reset strap must be used
to periodically condition the magnetic domains of the magneto-resistive elements for best and reliable performance.
A set pulse is defined as a positive pulse current entering the S/R+ strap connection. The successful result would be
the magnetic domains aligned in a forward easy-axis direction so that the sensor bridge’s polarity is a positive slope
with positive fields on the sensitive axis result in positive voltages across the bridge output connections.
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Page 5
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